substrate Product List and Ranking from 41 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 東西電気産業 本店(大阪)、東京店 Osaka//Interior Design
  3. 三和電子サーキット Osaka//others
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//others
  5. 4 デンカ Tokyo//others
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substrate Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店
  2. Transparent FPC (Transparent Flexible Printed Circuit Board) 太洋テクノレックス 本社　和歌山
  3. Noise Cut Transformer NCT-R5-J2 電研精機研究所
  4. 4 Noise Cut Transformer NCT-I3 電研精機研究所
  5. 4 JL Irregular Insert Series S Insert ジャパンライフ

substrate Product List

121～135 item / All 380 items

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Functional step board

Functional step board

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Functional Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate. This allows us to provide copper-thick hybrid circuit boards with continuous wiring. By forming unevenness through step formation in part of the circuit, we can enable height adjustment of mounted components and impart functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

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Ultra-thin rigid substrate

Ultra-thin rigid substrate

It is possible to manufacture a double-sided board with a substrate thickness of 0.04t while being a rigid substrate!

We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a substrate thickness of 0.04t, while still being rigid. This is suitable for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Thin plate bending substrate

Thin plate bending substrate

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used only for several bends or during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between other substrates, all suitable for multiple bends. Please feel free to contact us when you need assistance. 【Specifications (Partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

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Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate'

Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate'

"5% weight reduction temperature is 534℃!" This is an adhesive-free stainless steel/polyimide substrate suitable for high-temperature planar heating heater applications.

Kawamura Industries provides stainless steel/polyimide materials by leveraging the know-how of polyimide coating technology developed over many years on stainless steel foil. **Features of Kawamura Industries' 'SUS/Polyimide Material'** - Excellent heat resistance due to being adhesive-free → 5% weight loss temperature (534°C) - High adhesion strength achieved through unique polyimide technology → Stainless steel/polyimide adhesion strength (2.4 kN/m) - Wide range of thickness options → Stainless steel thickness (15, 18, 20, 30, 50 μm) → Polyimide thickness (selectable between 5-25 μm) *For examples of properties, please refer to the PDF document or feel free to contact us.*

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Printed Circuit Board Business Products and Services

Printed Circuit Board Business Products and Services

Improved performance in heat dissipation, dust resistance, and water resistance! Ensures the reliability of the mounted circuit board.

At Yoho Electronics, we achieve high product quality and reduced lead times through a consistent production system, unique manufacturing technologies, and quality control measures. The supported substrates include double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), and ceramic boards. By molding (resin encapsulation) the assembled boards, we enhance performance in heat dissipation, dust resistance, and drip resistance, ensuring the reliability of the assembled boards. In addition to molding, we can also accommodate substrate coating. 【Products and Services】 <Supported Substrates> ■ Double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), ceramic boards, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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Business Introduction of Nitto Corporation

Business Introduction of Nitto Corporation

Ultra-precision grinding processing! Introduction to the business of Nitto Co., Ltd.

Nitto Corporation develops and manufactures glass substrates used in LCD (liquid crystal display panels) and hard disks as a manufacturer of flat glass, which is essential for information devices. In polishing processing, we pursue smoothness precision to the utmost limit, boasting a smoothness precision of 2 angstroms with our in-house developed equipment and high technical skills, meeting the needs of various high-tech industries including office automation equipment, telecommunications, home appliances, AV, and medical devices. In quality control, we provide highly reliable products under meticulous and stringent quality inspections in a clean room that maintains a high-level environment with a cleanliness class of 100. 【Features】 ○ Extreme smooth polishing processing ○ Highly reliable quality control ○ Thorough environmental management system ○ Monthly processing achievements of over several million pieces ○ Versatile cutting, chamfering, and centering processing ○ ISO 9001 certification obtained ○ ISO 14001 certification obtained For more details, please contact us or download the catalog.

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Compatible with various patterning【Thin Film Processing Substrate】

Compatible with various patterning【Thin Film Processing Substrate】

A thin film processing substrate capable of creating high-resolution patterns that meet customer needs!

The "thin film processing substrate" performs various metal and resin thin film patterning on glass and resin substrates. We can create high-resolution patterns that meet customer needs. Patterning can be done not only for linear shapes but also for complex shapes. [Features] ■ Patterning of metal and resin thin films on glass and resin substrates ■ Capable of creating high-resolution patterns ■ Metal thin film materials: chromium, aluminum, etc. *For more details, please refer to the catalog or feel free to contact us.

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Types and Examples of High-Performance FPC [Special Bump, Long and Ultra-Fine, High Flexibility]

Types and Examples of High-Performance FPC [Special Bump, Long and Ultra-Fine, High Flexibility]

A must-see for those struggling with cost reduction and space-saving for flexible printed circuit boards (flexible substrates)! We can provide optimal proposals tailored to your needs!

This document summarizes the types and applications of high-performance FPCs. High-performance FPCs are capable of solving various challenges such as cost reduction and space-saving. In this document, we introduce the characteristics and application examples of special bumps, long and ultra-thin FPCs, and highly flexible FPCs. More detailed information is also available, so please take a moment to read through it. 【Contents】 ■ Types of high-performance FPCs ■ Features ■ Application examples *For more details, please refer to the PDF document or feel free to contact us. #ShortLeadTime #MassProduction #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #UltraThin #Flexible

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High elongation FPC (Flexible Printed Circuit)

High elongation FPC (Flexible Printed Circuit)

Supports over 50% elongation! There are various applications such as wearable electronic devices and robots.

The "High Stretch FPC" uses copper circuits for fine circuits and electronic component mounting, and is designed for low-temperature soldering of electronic components. For areas that require stretching, elastic conductive materials are used, accommodating stretches of over 50%. By innovating the circuit shape of the elastic conductive materials and using our smart metal masks for thick film printing, it is possible to suppress changes in resistance values. 【Features】 ■ Compatible with low-temperature soldering of electronic components ■ Accommodates stretches of over 50% ■ Capable of suppressing changes in resistance values *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

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High-frequency compatible FPC

High-frequency compatible FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High Frequency Compatible FPC" and "High Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. [Examples of Applications] ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortDeliveryTime #MassProduction

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Electroforming technology

Electroforming technology

Micron-level ultra-fine processing is possible! It is widely applied in fields such as electronic components and semiconductors.

"Electroforming" is a technology that forms metal products with high precision by depositing a nickel plating layer through electroplating. There are three types of cross-sectional shapes to choose from: the "overhang type," which deposits the product to cover the photoresist; the "straight type," which has a linear thickness direction; and the "laminated type," which consists of multiple layers. It enables ultra-fine processing at the micron level, which is difficult with etching, and is widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field. [Features] ■ Enables ultra-fine processing at the micron level, which is difficult with etching ■ Reduces initial costs by eliminating the need for molds, allowing for the formation of three-dimensional cross-sectional shapes ■ Widely applied in electronic components, precision machinery parts, automotive parts, and the semiconductor field *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (LCP Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has moisture absorption characteristics that are less affected by humidity and other factors. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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High-frequency compatible flexible substrate (MPI specifications)

High-frequency compatible flexible substrate (MPI specifications)

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

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Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine pattern makes the wiring less noticeable.

- Use of polyimide with excellent heat resistance and flame retardancy. ⇒ [Compatible with reflow mounting] - For display devices such as digital signage, as well as medical devices and transparent film antennas! - We also accommodate small quantities and a variety of prototypes. For more detailed information, please contact us. #Transparent #Transparent FPC #Transparent Flex

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[Information] MR Cylindrical Mirror Polishing Machine (Cylindrical Mirror Grinding Machine) Comprehensive Model Introduction Catalog

[Information] MR Cylindrical Mirror Polishing Machine (Cylindrical Mirror Grinding Machine) Comprehensive Model Introduction Catalog

Pioneer of cylindrical mirror polishing machines! Introducing the Mirak (Taiyo Kogyo Group) equipment. (Cylindrical mirror grinding machine, mirror finishing, buff polishing, grinding wheel)

We would like to introduce a representative model of the Mirak MR cylindrical mirror polishing machine. Its main applications include grinding and polishing with grinding wheels and mirror finishing with buffs. * Rolls for super calendars and elastic rolls * Rolls for rolling various materials (grinding rolls for stainless steel, copper, aluminum) * Gravure printing cylinder rolls * Aluminum rolls * Piston rods for air and hydraulic systems * Plastic rolls (nylon, polyacetal, Teflon, etc.) * Stainless steel rolls * Carbide and ceramic rubber rolls For detailed specifications and other information about the products, we will provide guidance based on your requests. Please feel free to contact us.

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