substrate Product List and Ranking from 41 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 東西電気産業 本店(大阪)、東京店 Osaka//Interior Design
  3. 太洋テクノレックス 本社　和歌山 Wakayama//others
  4. 4 三和電子サーキット Osaka//others
  5. 5 デンカ Tokyo//others
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substrate Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店
  2. Transparent FPC (Transparent Flexible Printed Circuit Board) 太洋テクノレックス 本社　和歌山
  3. Noise Cut Transformer NCT-R5-J2 電研精機研究所
  4. 4 Noise Cut Transformer NCT-I3 電研精機研究所
  5. 4 JL Irregular Insert Series S Insert ジャパンライフ

substrate Product List

106～120 item / All 378 items

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PHILIPS UV-C Upper Air Sterilizer *Documentation with case studies available

PHILIPS UV-C Upper Air Sterilizer *Documentation with case studies available

Utilizing ultraviolet light, inactivates 99% of the novel coronavirus attached to surfaces in just 6 seconds! PHILIPS 'UV-C Upper Air Sterilizer'

This is a UV-C sterilization device installed on ceilings and walls that sterilizes indoor air and can be used continuously in places where people are present. It utilizes natural air convection to cover the entire indoor space and is designed to eliminate maintenance efforts by not requiring electric fans or similar devices. When installed near air conditioning vents or doors, it can further promote the circulation of upper air and enhance sterilization efficiency. In indoor spaces with a ceiling height of 2.5 to 4.0 meters, a general guideline is to install one unit for every 50 square meters. *Note* This product directly irradiates UV-C into the air, and to use it safely, adequate light distribution planning and installation considerations are necessary. Therefore, installation is generally carried out by Signify-certified installation partners. Our company is a Signify-certified installation partner and primary distributor, so please feel free to contact us. *PHILIPS is a global lighting brand developed, manufactured, and sold by Signify.*

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Board "RasPi_HAT (Raspberry Pi HAT)"

Board "RasPi_HAT (Raspberry Pi HAT)"

You can freely solder and use the free through holes! Introducing the expansion HAT board.

The "RasPi_HAT" is an expansion HAT board that allows you to connect three HAT boards to a Raspberry Pi. You can attach a Raspberry Pi 3 or Raspberry Pi ZERO (WH) to the lower left part of the board, and other HAT boards can be attached elsewhere. There are free through-holes in the lower right part of the board, allowing you to solder and use it like a universal board. 【Features】 ■ All GPIO pins are connected to the array ■ Pins for UART and I2C for external connections are provided (JST EH connector) ■ Power can be supplied to the Raspberry Pi mounted in the lower left via USB, from a DC jack on the board, or from the EH connector *For more details, please refer to the PDF document or feel free to contact us.

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias is also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports fine pattern formation and high-density wiring compatible with small-diameter vias *For more details, please refer to the PDF document or feel free to contact us.

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Printed Circuit Board "Fluororesin Substrate"

Printed Circuit Board "Fluororesin Substrate"

High-density wiring compatible with thin plates, fine pattern formation, and small-diameter vias is also possible!

"Fluororesin substrate" is a printed circuit board made from materials such as fluororesin-impregnated glass cloth. It has a very low dielectric constant and dielectric loss tangent, providing excellent high-frequency characteristics, making it suitable for high-frequency equipment applications. We offer products tailored to needs such as thin plates and small sizes. [Features] ■ Excellent high-frequency characteristics (relative permittivity and dielectric loss tangent) ■ Capable of high-density wiring that supports thin plates, fine pattern formation, and small-diameter vias ■ Products tailored to your needs *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the back side with built-in copper coins! It is possible to reduce heat generation across the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. [Features] - Efficiently dissipates heat to the backside by incorporating copper coins - Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Thick copper substrate"

High thermal conductivity substrate "Thick copper substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance high current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We provide substrates that enhance high current capacity and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards ・Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards ・Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Metal base substrate"

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high heat dissipation substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Product Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Back Drill Substrate"

High-speed signal, high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It enables the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Enables the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency hybrid substrate "Hybrid substrate"

High-frequency hybrid substrate "Hybrid substrate"

The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.

The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and other factors. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, and other factors *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency compatible substrate "Fluororesin substrate"

High-frequency compatible substrate "Fluororesin substrate"

Materials with excellent frequency characteristics! Capable of supporting high-frequency characteristics according to usage applications.

"Fluororesin substrates" are printed circuit boards with low dielectric constant and low dielectric loss, exhibiting very good frequency characteristics. They can be tailored to high-frequency characteristics according to the application. Additionally, we can handle both domestic and overseas manufacturers. Please feel free to consult us when you need assistance. 【Material Types】 ■General FR-4 material ■PPE material ■LCP material ■Fluororesin material *For more details, please refer to the PDF document or feel free to contact us.

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Side-coated substrate

Side-coated substrate

Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.

We would like to introduce our "Side Coated Substrate." Powder falling from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder from falling off the edges caused by friction with guide rails during substrate transport. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Tent Through Hole PCB

Tent Through Hole PCB

Prevent the flow of resin such as sealing resin after component mounting and flux during mounting!

The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole section using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during assembly. Please feel free to contact us when you need assistance. 【Applications】 ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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Silicone embedded substrate

Silicone embedded substrate

By changing the height of the circuit, it is possible to form silicone ink on the circuit as well!

We would like to introduce our "Silicone Embedded Substrate." By filling the spaces between the circuits where LED elements are mounted with silicone ink that has high reflectivity and weather resistance, we can suppress the degradation of the resin substrate. Additionally, by combining this with a step process, it is possible to form silicone ink on the circuit by changing the height of the circuit. [Applications] ■ Substrate boards for chip LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Functional step board

Functional step board

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Functional Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate. This allows us to provide copper-thick hybrid circuit boards with continuous wiring. By forming unevenness through step formation in part of the circuit, we can enable height adjustment of mounted components and impart functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

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