substrate Product List and Ranking from 106 Manufacturers, Suppliers and Companies | IPROS

Last Updated: Aggregation Period:Apr 08, 2026~May 05, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Apr 08, 2026~May 05, 2026
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 太洋テクノレックス 本社 和歌山 Wakayama//others
  3. 三和電子サーキット Osaka//others
  4. 4 ジャパンライフ Tokyo//Building materials, supplies and fixtures manufacturers
  5. 5 ケイツー Osaka//others

substrate Product ranking

Last Updated: Aggregation Period:Apr 08, 2026~May 05, 2026
This ranking is based on the number of page views on our site.

  1. Noise Cut Transformer NCT-I3 電研精機研究所
  2. Noise Cut Transformer NCT-F1 電研精機研究所
  3. JL Irregular Insert Series S Insert ジャパンライフ
  4. 4 Taiyo Techno Rex Co., Ltd. Company Profile 太洋テクノレックス 本社 和歌山
  5. 5 Bonded substrate 三和電子サーキット

substrate Product List

271~300 item / All 372 items

Displayed results

Bonded substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing printed circuit boards with special structures tailored to your requirements, thanks to our unique three-layer substrates and the bonding structures of materials and copper foil. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and the specific implementation needs of individual products. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or materials *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the edge of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide through holes with burr-free end faces.

We would like to introduce our "Narrow Pitch Edge Through-Hole Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter boards ■ Module boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! We can accommodate board thicknesses from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

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CAD design and prototype implementation

We provide support from CAD design of printed circuit boards and various analyses to prototype implementation.

We would like to introduce our "Pattern Design (CAD Design) and Prototype Implementation." By conducting transmission line analysis, it is possible to implement countermeasures from the design stage. Additionally, "Prototype Implementation" allows for the direct output of the bill of materials from CAD, enabling the arrangement of components and other tasks in parallel with PCB design and manufacturing, thereby reducing the total lead time. 【CAD Software】 Zuken: CR-8000/Design Force, CR-5000/Board Designer, CR-5000/PWS Cadence: Allegro X Designer, OrCAD(R) PCB Designer Professional 【Analysis Software Used】 ■ SI Analysis - Siemens: Hyper Lynx SI - Cadence: Allegro PCB SI ■ EMI Countermeasures and PI Analysis - NEC: DEMITASNX *For more details, please refer to the PDF document or feel free to contact us.

  • Drawing, tracing, CAD
  • substrate

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Achieving high-density implementation and high heat dissipation. Towards new possibilities with copper inlay substrates.

In the IoT era, we propose the use of copper inlay boards and metal-based substrates for heat dissipation solutions, as well as ultra-thin boards to enhance design flexibility for product miniaturization and thinness.

We solve your heat-related problems with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the amount of heat generated by components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate various shapes. 【Products We Handle】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for the attachment of heat dissipation sheets to create double-sided boards. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be bent into shape. - The use of flexible resin and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

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[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

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Understand the printed circuit board manufacturing process in 5 minutes [Materials available].

You can also use it for new employee training and internal study sessions. *Currently running an initial discount campaign for new customers on design and circuit board manufacturing!

This document provides a simple diagrammatic explanation of the printed circuit board manufacturing process. - Types and characteristics of main materials - Types of printed circuit board manufacturing methods - Types of surface treatments And more are also included. *Some specifications and processes are unique to our company. *This document can be viewed via download. *You can also download an introduction to our special circuit boards. ~Campaign Announcement~ We are currently running a limited-time discount campaign on design and initial costs for new customers only. ■Period: Until March 7, 2025 If you have a request to reduce initial costs, please take advantage of this opportunity! For more details, feel free to contact us through our company website.

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Overseas manufactured printed circuit boards / domestically inspected products

Leave the printed circuit boards from Chinese manufacturers to us! We also handle re-inspections at domestic inspection companies.

Sasu Sanwa Co., Ltd. is engaged in the sale of printed circuit boards from Chinese manufacturers. Our company mainly handles manufacturers from Jiangxi Province, China, and we offer products at a lower price range than domestic products under our quality control. Additionally, we accommodate re-inspections at domestic inspection companies according to customer needs. 【Products】 ■ Single-sided printed circuit boards ■ Double-sided through-hole boards ■ Multi-layer printed circuit boards (2L-20L) ■ HID (1+N+1/2+N+2/3+N+3/Any Layer) ■ Flexible boards ■ Rigid-flex boards *For more details, please feel free to contact us.

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Printed Circuit Board Business: Mounting Capability and Precision

The maximum size is 250mm × 330mm, and it supports a thickness of 0.5mm to 3.0mm!

At Yoho Electronics, we focus on circuit board assembly and respond to our customers' diverse requests (short delivery times, low costs, small quantities of various types, and mass production). For surface mount technology (SMT) assembly, we achieve a precision with chip sizes of 0402, lead spacing of 0.3mm, and adjacent pitch of 0.1mm. The compatible chips include BGA, QFN, SOP, QFP, and LED, among others. The maximum size we accommodate is 250mm x 330mm, with board thickness ranging from 0.5mm to 3.0mm. 【Assembly Capability and Precision】 <Surface Mount Technology (SMT) Assembly> ■ Precision - Chip Size: 0402 - Lead Spacing: 0.3mm - Adjacent Pitch: 0.1mm ■ Compatible Chips: BGA, QFN, SOP, QFP, LED, etc. ■ Compatible Sizes - Maximum Size: 250mm x 330mm - Board Thickness: 0.5mm to 3.0mm *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to Color Filter Substrates

Capable of supporting colorization for EL and electronic paper! Flexible glass color filter substrate.

Kiso Komamicro Co., Ltd. began mass production of color filters (CF) for liquid crystal displays (LCD) in 1993, following the completion of the Micro Technology Research Institute and Kiso Komagata Factory. In 2000, in response to the colorization of mobile phones, we adapted to mass production of reflective CF. Additionally, we can mass-produce aimic-CF, a highly precise and fully barrier-capable flexible glass CF. Aimic-CF features glass that is made as thin as possible, bonded with a film as a support, allowing it to accommodate curved surfaces. We are also capable of partial mass production and prototyping of thin film metal patterning, such as ITO. 【Color Filter Substrate】 ■ Color filters for liquid crystal displays ■ Flexible glass (aimic) color filters ■ Color filters on films such as PET and PEN (under development) ■ Thin film patterning technology *For more details, please refer to our catalog or feel free to contact us.

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FPC - Flexible Printed Circuit Board (Flexible Substrate)

We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aerospace field!

Please leave the production from small-scale prototypes (for research and development purposes) to mass production to us. "FPC (Flexible Printed Circuit Board)" is a type of printed circuit board that is based on flexible and thin insulating materials such as polyimide, allowing for flexible bending. Taiyo Industry has the experience and track record to manufacture FPCs tailored to various needs. They are used in digital cameras, smartphones, laptops, robots, automobiles, car navigation systems, medical devices, aerospace, and more. Additionally, our company also supports halogen-free types, and please feel free to consult us about combinations of various types and thicknesses. 【Features】 - A type of printed circuit board - Good flexibility with materials like polyimide - Based on thin insulating materials - Flexibly bendable - Halogen-free types are also available *For more details, please refer to the PDF materials or feel free to contact us.

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High-frequency compatible FPC (fluorine composite material specification) flexible printed circuit board

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (Fluorine Composite Material Specification)" is a product designed to address low transmission loss and impedance matching. 〇 The fluorine composite material has particularly excellent inductive characteristics. 〇 Achieves extremely low transmission loss, enabling stable high-speed, large-capacity communication. ● FPC high-frequency analysis service (optional) It can be used in various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedWiringBoard #CircuitBoard #PrintedCircuitBoard #ShortDeliveryTime #MassProduction

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Bump FPC

Forming bumps (micro-protrusions) with a minimum diameter of Φ20µm at the terminal section of the FPC. The bumps are used as contact points and applied in high-precision circuit inspections, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. When combined with our contact clips and hand presses, it is ideal for testing fine-pitch insertion terminals and display lighting tests. *For more details, please refer to the PDF materials or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

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MR cylindrical mirror polishing machine retrofit and overhaul (mirror grinding machine)

[TAIYO] The MR cylindrical mirror polishing machine that has been in use for a long time can be renewed, and additional features can be added!

The cylindrical mirror polishing machine made by Mirak is highly durable and has been proven for long-term operation, but timely overhauls and retrofits are possible. Existing users are encouraged to consult with us. 【About the MR Cylindrical Mirror Polishing Machine】 We would like to introduce representative models of the MR cylindrical mirror polishing machine made by Mirak. The main applications include grinding and polishing with grinding wheels and mirror finishing with buffs. * Rolls for super calendars and elastic rolls * Rolls for various material rolling (grinding rolls for stainless steel, copper, aluminum) * Gravure printing cylinder rolls * Aluminum rolls * Piston rods for air and hydraulic systems * Plastic rolls (nylon, polyacetal, Teflon, etc.) * Stainless rolls * Carbide and ceramic rubber rolls We will provide detailed specifications of the products based on your requests. Please feel free to contact us first.

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Electrostatic Visualization Monitor [Portable Type]

Static electricity visible! Real-time monitoring of static electricity that cannot be confirmed with the naked eye!

■ For measuring the charge distribution on material surfaces and electrolytic copper! ■ For monitoring the charge of products on the manufacturing line and workers!

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Electrostatic Visualization Monitor [Bar Type Fixed Installation]

Static electricity visible! Real-time monitoring of static electricity that cannot be confirmed with the naked eye!

■Simultaneously measure a wide range of static electricity, such as film and LCD! Bar-type non-contact static electricity visualization system! ■Monitor static electricity that cannot be seen with the naked eye in real-time.

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Classic one-plate type! Stable electrical testing with motor drive!

The basic form of the electrical inspection system! It is used for electrical inspection of various substrates. (Rigid substrates, FPC, PCB, continuity testing, insulation testing, four-terminal testing)

This is a standard electric testing system of the one-plate type. With over 35 years of proven track record, the reliable TY-CHECKER series! (Continuity, insulation, four-terminal, micro-short, spark testing) Please feel free to consult us about various specifications. 【Features】 ■ Maximum inspection size: 550×340mm ■ Equipped with a micrometer adjustment mechanism for the lower jig. ■ Designed with safety considerations for both the working side and the back side. #CircuitBoardInspection #PowerOnTesting #ElectricalTesting #Open #Short #FourTerminal #Inspection

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[Presentation of Materials] Until FPC is Completed... (PowerPoint Version)

【Basic Knowledge - PowerPoint Version Download Available!】The standard manufacturing process of Taiyo Kogyo, which has focused on small quantities and a wide variety, has been compiled into a document!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Kogyo Co., Ltd. A PowerPoint version has been added! * The PowerPoint version can be downloaded from 'Sample Software'. How are flexible printed circuit boards made? This material is for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The download will provide a PDF version. * The PowerPoint version can be downloaded from 'Sample Software'. [The urban development and medical food technology site will only provide a PDF version] #CircuitBoard #FlexiblePrintedCircuitBoard #FlexibleCircuitBoard #FPC #Flex #BasicKnowledge

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  • Piping and electrical wiring materials
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Pressure Sensor Evaluation Kit [Thin, Flexible, Lightweight]

Let's detect pressure and center of gravity! Here is an introduction to surface pressure sensors.

We have prepared the following kit: - A pressure sensor with 128 arranged cells for load detection - A control board for processing the sensor signals - A PC application for displaying data signals (PC not included) < Sensor Specifications > - Sensor size: 50*35mm (sensor part only) - Method: Pressure-sensitive resistive film type - Cell size: 2×3mm - Number of cells: 128 cells (16×8) The above sensor can be customized. Each customized sensor is applied in various fields such as robotics, medical care, sports training equipment, toys, games, and ergonomic research.

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Taiyo Techno Rex Co., Ltd. Company Profile

This is the company introduction of Taiyo Techno Rex. (Company name change effective December 21, 2023)

Taiyo Industrial Co., Ltd. (Established December 1960) Taiyo Technolex Co., Ltd. (Name changed December 2023) [Thoughts Behind the New Company Name] The coined term "TECHNOLEX," derived from "Technology" and "Flexible," symbolizes the flexibility of our main product, FPC (Flexible Printed Circuit Board), as well as our commitment to adapt flexibly to new technologies and areas such as technology trading, beyond conventional methods. We are evolving, stepping out of the confines of "industry" and looking towards a transition to a more global market.

  • Other analytical equipment
  • substrate

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One-stop service for FPC production <Presentation of explanatory materials with a glossary>

Consistent support from development design to parts procurement, manufacturing, implementation, and assembly with short delivery times. Capable of small lot and diverse prototype and mass production.

Our company handles everything from the design to manufacturing and assembly of FPC (Flexible Printed Circuit Boards) in a one-stop service. We can flexibly respond to a wide range of needs, including trials for prototypes and development projects, one-off and irregular orders, and mass production, all while providing short delivery times. Since we use sheet-like substrates, we can produce small lots without a minimum quantity requirement. The initial lead time for mass production is a minimum of three weeks. We thoroughly manage quality using various inspection equipment, and we have extensive experience in fields that require particularly high quality, such as automotive and medical applications. 【Features】 ■ Enables shorter lead times for product development and reduced development costs through small-lot prototyping. ■ Allows for rapid startup during mass production and flexible responses to production lot variations. ■ Provides consistent support from design to board assembly (including mounter support and in-house metal mask manufacturing). ■ Supports component procurement for both prototypes and mass production. ■ Proposes appropriate methods and tools (jigs) for FPC manufacturing from production planning. ★ Currently, we are offering materials that include a glossary of FPC-related terms and information about the products we handle. Please check them out via "PDF Download." Feel free to contact us with any inquiries.

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[Data Presentation] FPC Glossary, PDF search OK. For use as an introductory mini-dictionary!

We have compiled terms used in meetings related to FPC manufacturing. Please use it as an introductory mini-dictionary and an offline search tool.

Thank you for taking a look. With over 40 years of experience in flexible printed circuit board manufacturing, we offer a one-stop service from prototyping to mass production. There are things that can only be done by TAIYO. *The following content is from the complete edition "Everything You Need to Know About FPC in One Book! *Includes Glossary." Highly recommended! [Content of the materials] 1. Solve all your FPC problems at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Information on various types of FPC (ultra-fine wires, multilayer, high frequency, and more) 7. FPC glossary 8. Greetings and company overview (Total of 36 pages) We hope this information will be helpful in your consideration of flexible printed circuit boards. Taiyo Industry will sincerely respond to your inquiries regarding FPC.

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High thermal conductivity metal substrate "Denka Hit Plate"

High thermal conductivity metal substrate that achieves thermal resistance equal to or lower than that of alumina substrates.

The "Denka Hit Plate" is a high thermal conductivity metal base substrate formed from an epoxy-based insulating layer filled with a highly thermally conductive inorganic filler on an aluminum base, achieving thermal resistance equivalent to or lower than that of alumina ceramic substrates. It is used in a wide range of fields, including air conditioner inverters, automotive components, motorcycle electrical parts, and power supplies for communication equipment, and has received high praise from the market. [Features] ■ High thermal conductivity (up to 10W/mK available) ■ High reliability (withstand voltage, heat resistance, heat shock resistance, durability) *For more details, please download the PDF or feel free to contact us.

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High thermal conductivity ceramic substrate "Denka AN Plate"

High thermal conductivity ceramic plates realized through high reliability and technology.

The "Denka AN Plate" is a high thermal conductivity ceramic substrate made from aluminum nitride, which has a thermal conductivity approximately seven times that of alumina. It is mainly used as a ceramic circuit board for power modules that require high thermal conductivity and high voltage resistance characteristics. In addition to the standard type (150W/mK), we offer various grades including a high thermal conductivity type (180W/mK), a high reliability type with excellent heat cycle resistance, and a thick plate type for even higher voltage resistance. 【Features】 ■ High thermal conductivity: About seven times that of alumina ■ High insulation: Low dielectric constant with excellent electrical properties comparable to alumina ■ Mechanical properties: High strength equivalent to alumina ■ Low thermal expansion rate: Thermal expansion rate close to that of silicon *For more details, please download the PDF or feel free to contact us.

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PCIe crossover adapter board

PCIe host-device conversion adapter board compatible with various FPGA evaluation boards from Intel/Xilinx.

The 【AB16-PCIeXOVR】 is a conversion adapter board for host-device communication that supports 1/4/8-lane PCIe (PCI-Express) and can be applied to evaluation boards from Intel/Xilinx that implement the PCIe interface. The adapter board features 8-lane PCIe sockets on both the component side and the solder side, directly connecting the transmit and receive signals lane by lane to function as host side/device side. This adapter is ideal for developing FPGA applications that implement PCIe host side functionality. Additionally, this adapter is required when evaluating the NVMe-IP core from DesignGateway.

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3D LED PCB

Implementation process cost reduction! Printed circuit boards can also be 3D wired!

The "3D LED PCB" is a product of Shirato Printed Circuit Board Manufacturing Co., Ltd., which manufactures various printed circuit boards, designs printed circuit board circuits, and assembles electronic components. Heat dissipation materials can be selected from aluminum or copper. We can provide a polyhedron substrate (multiple substrates) as a single substrate, reducing the implementation process costs. 【Features】 ■ Polyimide-based insulation layer (0.8W/m-k) with an insulation layer thickness of 17μm ■ Insulation withstand voltage of 2.5kV/DC ■ The insulation breakdown voltage after bending is almost equivalent to an insulation breakdown voltage of 5.0kV/DC ■ Heat dissipation materials can be selected from aluminum or copper *For more details, please refer to the PDF document or feel free to contact us.

  • Safety and consumables
  • substrate

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Deep Ultraviolet Compatible Printed Wiring Board 'DEEP UV-LED PWB'

Deep ultraviolet (UV-C) reflectance over 70%! No discoloration even after over 2000 hours of UV exposure testing. Compatible with high thermal conductivity.

The "DEEP UV-LED PWB" is a metal printed wiring board that has high reflectivity and light resistance against deep ultraviolet light. It achieves over 70% reflectivity for UV-C (deep ultraviolet region 250nm). It also has over 80% reflectivity for UV-A and UV-B. There are test results showing "no discoloration and no decrease in reflectivity even after 2000 hours of exposure under 365nm conditions." It is also suitable for embedded applications such as deep ultraviolet LEDs. 【Features】 ■ UV-C deep ultraviolet region: Reflectivity over 70% ■ UV-A UV-B: Reflectivity over 80% ■ Insulation layer thermal conductivity: Can support over 5W ■ Heat dissipation materials: Available in aluminum or copper (2 types)

  • Safety and consumables
  • substrate

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Substrate "HIGH POWER LED PWB"

Covers a wide range from near ultraviolet 360 to 740 nm! Uses light-resistant white ink!

The "HIGH POWER LED PWB" is a product of Shirato Print Wiring Manufacturing Co., Ltd., which engages in the manufacturing of various printed circuit boards, circuit design of printed circuit boards, and assembly of electronic components. It has excellent light resistance, showing no degradation even after 2000 hours of exposure to deep ultraviolet light at 254nm. Due to its inorganic materials, it can withstand temperatures above 350°C. The base material can be selected from aluminum or copper. 【Features】 ■ The COB mounting section has an insulation withstand voltage of 2kV at 80μm ■ White ink with light resistance and reflectivity of over 90% ■ Covers a wide range in the near-ultraviolet region from 360 to 740nm ■ Withstands temperatures above 350°C due to inorganic materials ■ Patent pending *For more details, please request materials or view the PDF data available for download.

  • Safety and consumables
  • substrate

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Zero One Pyroelectric Infrared Sensor Expansion Board 'ADRSZPY'

The dome-shaped Fresnel lens enables a wide detection range of 120 degrees!

The "ADRSZPY" is a pyroelectric infrared sensor expansion board specifically for the Raspberry Pi Zero. It enables a wide detection range of 120 degrees thanks to the dome-shaped Fresnel lens. This makes it easy to create simple security and monitoring systems. Additionally, the LED makes it easy to check the operating status, which is helpful during experiments and maintenance. 【Features】 ■ Compact "pHAT" size ■ Easy experimentation with pyroelectric human sensors ■ Equipped with an LED that shows the operating status of the pyroelectric infrared sensor *For more details, please refer to the PDF document or feel free to contact us.

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