substrate Product List and Ranking from 41 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 東西電気産業 本店(大阪)、東京店 Osaka//Interior Design
  3. 太洋テクノレックス 本社　和歌山 Wakayama//others
  4. 4 三和電子サーキット Osaka//others
  5. 5 デンカ Tokyo//others
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substrate Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店
  2. Transparent FPC (Transparent Flexible Printed Circuit Board) 太洋テクノレックス 本社　和歌山
  3. Noise Cut Transformer NCT-R5-J2 電研精機研究所
  4. 4 Noise Cut Transformer NCT-I3 電研精機研究所
  5. 4 JL Irregular Insert Series S Insert ジャパンライフ

substrate Product List

91～105 item / All 378 items

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Printed circuit board manufacturing - build-up boards

Printed circuit board manufacturing - build-up boards

It is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, and the demand for printed wiring boards using the build-up method has increased. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, it can accommodate up to 2-layer builds (two layers of build-up layers above and below). Additionally, stack vias and filled vias are also supported. There are also achievements in manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to the catalog.

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Special Printed Circuit Board Manufacturing - Impedance Control Board

Special Printed Circuit Board Manufacturing - Impedance Control Board

Control the pattern width and interlayer thickness to perform impedance control.

Based on our extensive past experience, we control the pattern width and layer thickness to perform impedance control. By using Polar's impedance simulation software 'Si8000', we can pre-calculate the impedance values of the completed circuit boards, enabling accurate impedance control. Additionally, we can simulate the layer configuration, line width, and line spacing during the pattern design phase, allowing us to propose specifications that facilitate easier impedance control. For measuring the impedance of the completed circuit boards, we use the 'MZPC50' measuring instrument from Microcraft Co., Ltd., and we can provide measurement results (using the TDR method). For more details, please contact us or refer to our catalog.

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Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)

This is a substrate with resin embedded in the through holes and pads placed on top of it.

This is a circuit board designed to secure mounting space for components by embedding resin into through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.

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Benefits of K2: Reducing initial costs of flexible circuit boards.

Benefits of K2: Reducing initial costs of flexible circuit boards.

Mold cost 0 yen! Cut initial costs to manufacture flexible substrates cheaply and quickly!

At K2, we do not create molds or Thomson molds (Victoria type) for small lot production of flexible printed circuits, allowing us to respond to generally time-consuming flexible circuit manufacturing with short lead times. Since there are no costs for creating molds, we can significantly reduce the initial costs, making our prices attractive. Additionally, this method allows for individual correction of each circuit board, which is a benefit for high quality. 【Features】 ■ No mold costs for flexible printed circuits ■ Short lead times ■ High quality *For more details, please refer to the PDF document or feel free to contact us.

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Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

Supporting all types of printed circuit board manufacturing! 'K2's Special Board Manufacturing'

We can manufacture special circuit boards that align with your design philosophy! We also accommodate high-difficulty designs and specifications.

Our company possesses a series of equipment necessary for substrate manufacturing, including plating process equipment and manufacturing lines for build-up substrates. We can also consistently produce special substrates that require advanced processing technology and precision, and we can provide them in a short delivery time. Additionally, our specialized staff will thoroughly respond to inquiries after delivery, such as requests for environmental surveys or questions after substrate manufacturing. 【Features】 ■ Flexible response to detailed customer requests ■ Detailed data checks contribute to reducing delivery times and costs ■ Short delivery times possible through in-house integrated production and thorough delivery management *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Have you ever been turned down for special substrate manufacturing?

Have you ever been turned down for special substrate manufacturing?

Accurate technical advice is possible! By introducing advanced equipment, we can accommodate a wide range of special substrates.

Our company is capable of handling a wide range of special substrates by creatively utilizing various equipment available in-house, including advanced DI (Direct Imaging) equipment. Additionally, since over 90% of our staff are full-time employees, we are able to accumulate a broad knowledge and expertise regarding substrates by inheriting past experiences, allowing us to provide accurate technical advice to our customers. Please feel free to consult us regarding any special substrates. 【Special substrates we can handle】 ■ Build-up substrates ■ Heat dissipation substrates ■ Impedance control substrates ■ Rigid-flex and multilayer flex substrates ■ Cavity substrates ■ Fine patterns *For more details, please refer to the PDF document or feel free to contact us.

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Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Same manufacturing line as trial production! With a 100% equipment utilization rate, short delivery times for medium lot production are possible.

Our company is equipped with large-capacity facilities as a prototype manufacturer, allowing us to produce not only small lots but also medium-lot prototypes and medium-volume production with short lead times. Thanks to the 100% operational rate of our large-capacity equipment, we can respond without any issues to sudden requests, even when the quantities are large. We have secured sufficient inventory even during periods when material procurement was difficult, ensuring there are no delays in delivery. 【Features】 - Capable of producing small lots as well as medium-lot prototypes and medium-volume production with short lead times - 100% equipment operational rate - Sufficient inventory secured, with no delays in delivery - Initial costs do not become excessively high - Capable of handling special substrates such as flexible and rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

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Are you having trouble with substrate manufacturing and component mounting?

Are you having trouble with substrate manufacturing and component mounting?

We respond to various requests! We can handle everything from circuit board design to component assembly in one go.

We value conversations with our customers and design simple and easy-to-understand printed circuit boards. We have experience in various types of board design, including power supply, analog, and high-frequency boards, and we respond to various requests for component mounting based on quantity and requirements. Our assembly factories also have areas of expertise, so we partner with over 10 factories and coordinate according to the specific needs of each project. We can accommodate requests for ultra-short delivery times in conjunction with board manufacturing. 【Board Design】 ■PADS ■Quadcept ■CR8000 ■CR5000 *For more details, please refer to the PDF materials or feel free to contact us.

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We won't lose! Leave it to us for quick turnaround on build-up substrates.

We won't lose! Leave it to us for quick turnaround on build-up substrates.

High quality and quick delivery are possible! If you have any concerns, please feel free to consult with us!

K2 has all the necessary equipment for circuit board manufacturing in-house. Since we can complete all processes without relying on outsourcing, we are able to respond to short delivery times. Additionally, our factory operates on Saturdays, allowing us to count Saturdays as manufacturing days. "We don't accommodate ultra-short delivery times," "We were turned down for consultations on special circuit board manufacturing," "We have concerns about the quality of the circuit boards." We will solve these issues using K2's unique know-how. 【What K2 can do】 ◆ Number of layers We have numerous manufacturing achievements from 1 to 4 layers. ◆ Capable of manufacturing with various materials and specifications We also handle complex specifications such as high-frequency build-up boards and build-up rigid-flex boards. *Depending on the specifications, we can manufacture in as little as one week. For more details, please download our catalog or feel free to contact us.

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NEXTERION(R)『PreScora』

NEXTERION(R)『PreScora』

An innovative solution that provides high-performance diagnostic consumables compatible with custom formats.

"PreScora" enables the production of highly customized coated and pre-cut substrates for demanding applications through our unique laser processing. In addition to standard formats in life sciences, such as SBS-compliant microplates and microscope slides, we can also process custom formats. Furthermore, the coating process is conducted in a clean room compliant with ISO Class 5 standards, allowing for the manufacturing of high-performance consumables with extremely high quality. [Features] ■ Our unique laser processing ■ For demanding applications ■ Capable of producing coated and pre-cut substrates ■ Supports various formats ■ Capable of marking logos, barcodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Plate glass and mirrors
  • Processing Technology
  • Glass blocks and crystallized glass

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NEXTERION® "Amino Silane Coating"

NEXTERION® "Amino Silane Coating"

Manufactured in a clean room compliant with ISO Class 5 standards! Physical and functional quality control.

"Amino silane coating" is a coating that binds to the surface through the ion attachment of amine groups formed on the surface and negatively charged phosphate groups of the DNA backbone. By using very short amino silanes, it achieves high signal sensitivity and very low background noise signals compared to conventional amino silane-coated substrates. Additionally, it is manufactured using standardized processes in an ISO Class 5 cleanroom environment, applying a strict quality control system. 【Features】 ■ Our optimized proprietary thin film formation process ■ Excellent reproducibility both within and between lots ■ Physical and functional quality control ■ Manufactured in a cleanroom compliant with ISO Class 5 standards ■ Related processes prepared to meet the needs of diagnostic companies *For more details, please refer to the PDF materials or feel free to contact us.

  • Plate glass and mirrors

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NEXTERION(R) "Epoxy Silane Coating"

NEXTERION(R) "Epoxy Silane Coating"

A circuit board that supports both standard and custom formats, easy to handle!

"Epoxy silane coating" is the most common surface chemistry technology and is widely used in diagnostic applications. A multifunctional epoxy silane layer is formed on the substrate, which covalently bonds with most types of biomolecules, including amino-modified or non-amino-modified DNA, RNA, and proteins. Additionally, a uniform epoxy silane layer is formed on a defect-free surface, allowing for highly efficient covalent bonding and significantly reducing background levels. 【Features】 ■ Widely used in diagnostic applications ■ Covalently bonds with most types of biomolecules ■ Easy-to-handle substrates ■ Various protocols for different applications are published ■ Compatible with both standard and custom formats *For more details, please refer to the PDF materials or feel free to contact us.

  • Plate glass and mirrors

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Dynamic Map "Millimeter Wave Wiring Circuit Board"

Dynamic Map "Millimeter Wave Wiring Circuit Board"

Patent research materials related to millimeter wave wiring circuit boards.

We provide a dynamic map titled "Millimeter Wave Wiring Circuit Board," which focuses on wiring board technology that supports millimeter wave and terahertz wave transmission, as well as related materials and electronic component technologies. This dynamic map utilizes recent domestic public patent information, where technical experts conduct patent research and classification to track the activities of companies and research institutions working on 6G. It visualizes the movements of technology through patent information, offering an overview of the advanced patent environment. 【Related Materials】 ■ Dynamic Map "Post 5G - 6G Low Dielectric and Low Loss Materials" ■ Dynamic Map "6G and Transmission Lines" ■ Dynamic Map "Metamaterial Application Development" ■ Patent Guidebook "Information and Communication Series" ■ Invention Derivation Guidebook "Information and Communication Series" *For more details, please download the PDF or feel free to contact us.

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Solar/Battery Charger Board for BeagleBone Black

Solar/Battery Charger Board for BeagleBone Black

The BeagleBone Black can be used in areas without power both indoors and outdoors. It is convenient to use in conjunction with a mobile router.

This product is a battery charger circuit board for operating the Texas Instruments Linux/ARM system: BeagleBone Black board with battery/solar power. It is convenient to use this product (OELBBBPWR01) in conjunction with a mobile router and LAN hub. It enables cable-free operation of the BeagleBone Black without the need for power lines or communication lines, allowing for use in areas without electricity. By combining this product with the BeagleBone Black, various IoT devices can be easily and affordably realized. Please use this product (OELBBBPWR01) by mounting it on the 46-pin expansion connector of the BeagleBone Black board. Additionally, you can charge a mobile phone from this product via the Micro USB connector (5V). By using this product, you can charge your mobile phone from a battery or solar panel during a disaster.

  • Other analytical equipment
  • Solar System Solar Module
  • Other civil engineering services

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BeagleBone Black PoE/PSE board

BeagleBone Black PoE/PSE board

You will be able to use PoE devices such as network cameras in a solar/battery environment.

Texas Instruments' Linux/ARM system: By using the BeagleBone Black board in conjunction with the battery charger circuit board OELBBBPWR01, it becomes possible to utilize PoE devices such as network cameras in solar/battery environments. This device (OELBBBPoE01) provides the functionality of PoE (Power over Ethernet) PSE (Power Sourcing Equipment).

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