[Case Study] High-Density Substrate Inspection in Semiconductor Manufacturing Equipment
Please utilize Takaya's flying probe tester in the high-density substrate inspection process for semiconductor manufacturing equipment.
High-precision inspections compliant with IEC60384-1 are possible. The characteristics of electronic components such as fixed capacitors are guaranteed according to international standards, achieving improved quality for high-density circuit boards. We provide flexible responses to design changes and prototypes, offering cost-effective inspection solutions. 【Implementation Achievements】 - Conducted inspections of high-density mounted circuit boards, achieving quality assurance tailored to precision boards. - Enabled inspections compliant with the IEC60384-1 standard (performance criteria for fixed capacitors), ensuring product quality that meets international standards. 【Customer Challenges】 Narrow Pitch Between Components: In high-density circuit boards, the space between components is extremely narrow, making physical contact difficult with traditional jig-based inspections. There is a risk of reduced inspection accuracy, especially in narrow pitch areas below 0.2mm and for components with a high number of pins. Need for Compliance with Standards: As compliance with international standards represented by IEC60384-1 is required, a system that reliably implements inspection items based on these standards is necessary. It is particularly important to measure the characteristics of fixed capacitors and special components with precision and speed. Limitations of Inspection Coverage: In designs where the number of test points has decreased, there is a risk of reduced inspection coverage due to insufficient physical access.
- Company:タカヤ
- Price:Other