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  6. [Case Study] High-Density Substrate Inspection in Semiconductor Manufacturing Equipment

[Case Study] High-Density Substrate Inspection in Semiconductor Manufacturing Equipment

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TAKAYA APT Series

last updated:Nov 18, 2024

タカヤ
タカヤ
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Please utilize Takaya's flying probe tester in the high-density substrate inspection process for semiconductor manufacturing equipment.

High-precision inspections compliant with IEC60384-1 are possible. The characteristics of electronic components such as fixed capacitors are guaranteed according to international standards, achieving improved quality for high-density circuit boards. We provide flexible responses to design changes and prototypes, offering cost-effective inspection solutions. 【Implementation Achievements】 - Conducted inspections of high-density mounted circuit boards, achieving quality assurance tailored to precision boards. - Enabled inspections compliant with the IEC60384-1 standard (performance criteria for fixed capacitors), ensuring product quality that meets international standards. 【Customer Challenges】 Narrow Pitch Between Components: In high-density circuit boards, the space between components is extremely narrow, making physical contact difficult with traditional jig-based inspections. There is a risk of reduced inspection accuracy, especially in narrow pitch areas below 0.2mm and for components with a high number of pins. Need for Compliance with Standards: As compliance with international standards represented by IEC60384-1 is required, a system that reliably implements inspection items based on these standards is necessary. It is particularly important to measure the characteristics of fixed capacitors and special components with precision and speed. Limitations of Inspection Coverage: In designs where the number of test points has decreased, there is a risk of reduced inspection coverage due to insufficient physical access.

    Measurement and Inspection
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[Case Study] High-Density Substrate Inspection in Semiconductor Manufacturing Equipment

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**Benefits of Introducing Flying Probe Testers** **IEC60384-1 Compliant Testing:** Using flying probe testers, inspections are conducted in accordance with the requirements of IEC60384-1 (capacitance values, withstand voltage, leakage current, insulation resistance, etc.). Characteristic testing of fixed capacitors and other electronic components based on international standards is possible. **Narrow Pitch Compatible Flying Probe Testers:** Probing with a pitch of 0.15mm is possible, meeting the stringent measurement standards of IEC60384-1. High-precision measurement technology covers inspections of narrow pitch and multilayer boards. **High Flexibility:** No fixtures are required, allowing for rapid response to design changes or manufacturing process modifications. Inspections can be conducted in a short period even for small production runs or prototype boards. **Improved Reliability through Compliance:** By adhering to IEC60384-1, product reliability in the international market is strengthened. Ensuring compliance with standards enables quality assurance that meets customer requirements. **Enhanced Inspection Coverage:** Detailed inspections can be performed on internal wiring of narrow pitch components and multilayer boards. Detection of minute defects (short circuits, open circuits, resistance value anomalies, etc.) is achieved.

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**Effects of Implementation** Response to International Standards: Enables inspections based on international standards, including IEC60384-1, ensuring quality assurance for export products. Enhances the reliability of electronic components, including capacitors, and improves competitiveness in the global market. Realization of High-Precision Inspections: Compatible with narrow-pitch, high-density mounted boards, allowing for precise identification of defects. Meets the high-quality standards required for semiconductor manufacturing equipment. Cost Reduction and Efficiency: Reduces costs by eliminating the need for jigs, while also shortening inspection time. Keeps initial investment low and maximizes cost performance even in small-batch, diverse production. **Application Examples** Wafer Process Boards: Conducts characteristic measurements of fixed capacitors in compliance with IEC60384-1. Detects defects in wafer processing boards that require high precision. Test Equipment Boards: Inspects minute defects on high-density mounted boards. Semiconductor Exposure Equipment Boards: Conducts detailed inspections of boards that include narrow-pitch components and special designs.

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Flying Probe Tester APT-2400F

Flying Probe Tester APT-2400F

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Dual Side Flying Probe Tester APT-2600FD

Dual Side Flying Probe Tester APT-2600FD

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[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

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タカヤ

タカヤ

Information and Communications

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Founded in 1894 as a textile company, Takaya Textile expanded and established its electronics division in 1966, starting the assembly of transistor radios. Today, in addition to contract manufacturing services (EMS) related to electronic devices, the company actively manufactures and sells various electronics, including in-circuit testers (printed circuit board inspection devices) and RFID (a technology that enables information exchange through short-range wireless communication from tags containing IC information), as well as IT consulting and system solutions, both domestically and internationally. We continue to evolve as a corporate group that contributes to societal development, with textiles and electronics as our dual pillars.

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