Substrate Product List and Ranking from 105 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 三和電子サーキット Osaka//others
  3. 東西電気産業 本店(大阪)、東京店 Osaka//Interior Design
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//others
  5. 5 河村産業 Mie//others
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Substrate Product ranking

Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.

  1. Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店
  2. Noise Cut Transformer NCT-I3 電研精機研究所
  3. Ideal for surface mount heater applications without adhesive! 'SUS/Polyimide substrate' 河村産業
  4. 4 Noise Cut Transformer NCT-R5-J2 電研精機研究所
  5. 4 JL Irregular Insert Series S Insert ジャパンライフ

Substrate Product List

61～90 item / All 379 items

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[Data] Shirutoku Report No. 4 #Interface Circuit

[Data] Shirutoku Report No. 4 #Interface Circuit

Promote development design! Custom measurement and interface circuits.

★★Shirutoku Report: Useful Information You Can Benefit From★★ This report introduces the use of "interface circuits" that make measurement convenient, which is being developed by the Custom Technology Division. Our company occasionally prepares highly versatile "interface circuits" as originals, and this time we are featuring one of those examples. Proposing solutions to our customers' challenges is a hallmark of our services. If you are interested, we look forward to hearing from you. 【Contents (Excerpt)】 ■ Providing services centered around custom measurement ■ What is an interface circuit? ■ Image of the configuration of an interface circuit (analog isolation circuit board) ■ Production board for the interface circuit (analog isolation circuit board) *For more details, please refer to the PDF document or feel free to contact us.

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[Data] Shirutoku Report No. 18 # Substrate Structure and Package

[Data] Shirutoku Report No. 18 # Substrate Structure and Package

A suitable structural examination is necessary due to the mounted components and wiring density! An explanation of the structure of the substrate.

★★Shirutoku Report: Useful Information You Should Know★★ This report introduces the "Structure of Circuit Boards." It includes topics such as "Classification by Board Structure," "Conductor Materials and Solder Resist," and "The Importance of Initial Considerations in Board Structure." Our company is also capable of supporting circuit board design from initial considerations, including board structure. Please feel free to reach out if you need assistance. 【Contents】 ■ Classification by Board Structure ■ Conductor Materials and Solder Resist ■ The Importance of Initial Considerations in Board Structure ■ About Flexible Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*

  • Parts and Materials
  • Substrate

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[Data] Shirutoku Report No. 23 #BGA Circuit Board Design

[Data] Shirutoku Report No. 23 #BGA Circuit Board Design

Particularly frequent requests! Circuit board design for small, high-density implementations used in IoT devices and wearable devices!

★★Shirutoku Report: Useful Information You Should Know★★ In WTI's circuit board design, we handle various types of board designs, including large-scale circuit boards, multilayer wiring boards, high-density mounting boards, and flexible printed circuits (FPC). One of the most requested designs is for small, high-density mounting boards used in IoT devices and wearable devices. To reduce the size of products and lower board costs, it is common to adopt BGA packages for microcontrollers and FPGAs. This report discusses 'BGA Board Design.' We encourage you to read it. [Contents] ■ About BGA Board Design *For more details, please refer to the PDF document or feel free to contact us.*

  • Electrical Equipment Testing
  • Facility Design
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Circuit board production Original circuit board

Circuit board production Original circuit board

We will create original circuit boards in various shapes according to your wishes.

The basics are domestically produced. They are assembled in domestic factories where heat management during soldering and electrostatic measures are well managed. Since they are assembled in domestic factories, you can be assured. Aging will be done before shipment. However, we will take great care with inspections, packaging, and transportation that involve the risk of human contact.

  • board
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Vacuum chuck (standard type hole diameter φ0.5 and above)

Vacuum chuck (standard type hole diameter φ0.5 and above)

Cost reduction and weight reduction with a vacuum chuck made of honeycomb panels!

Morishin's vacuum chuck is a highly popular product that features a simpler structure compared to traditional porous materials and processed products, allowing for cost reduction through lightweight design. It can be manufactured in custom sizes ranging from a minimum of approximately 100mm square to a maximum of about 2000mm x 4000mm. Additionally, it is possible to set multiple suction areas on a single suction panel. We can accommodate everything from custom orders starting from one piece to mass production, so please feel free to contact us. For requests for quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of the case studies from the "Download" section.

  • Aluminum alloy door
  • Substrate

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Vacuum chuck (made of honeycomb panel) [ultra-fine hole type φ0.03mm]

Vacuum chuck (made of honeycomb panel) [ultra-fine hole type φ0.03mm]

If it's a honeycomb panel, we can produce custom vacuum chucks at low prices and with short delivery times, starting from just one piece!

Morishin's vacuum chuck is a highly popular product that features a simpler structure compared to traditional porous and cast products, allowing for cost reduction through lightweight materials. It can process suction holes with a diameter of 30μm, minimizing deformation of the workpiece. Dimensions can be customized freely within 2000mm x 4000mm, and it is also possible to set multiple suction areas on a single vacuum chuck. We can accommodate everything from custom orders for single items to mass production, so please feel free to contact us. For quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of case studies from the "Download" section.

  • Aluminum alloy door
  • Interior construction
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Numerous case studies: Contract development of embedded system solutions.

Numerous case studies: Contract development of embedded system solutions.

There are many examples of hardware, software, and testing and evaluation!

Our company provides services ranging from embedded board design/development, such as microcontrollers, to firmware, application software development, testing, evaluation, and supply of contracted developed products. In addition to our development achievements in the construction management system "Concrete Filling Watcher," we have also been responsible for the operation panel, motor control board, and firmware design of the "Automatic Pet Feeder." Please feel free to contact us if you have any requests. 【Development Project Examples】 ■ Concrete Filling Watcher (Design and Manufacturing) ■ Automatic Pet Feeder (Board Design and Firmware Design) ■ Supplement Automatic Dispenser (Board Design and Firmware Design) ■ Momentary Disconnection Testing Machine for HDD/SSD Testers (Board Design, Firmware Design, FPGA Design, Structural Design) *For more details, please refer to the related links or feel free to contact us.

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Aluminum foil etched circuit board

Aluminum foil etched circuit board

Low-cost large-area flexible printed circuit boards! Lightweight and long, they can also be supplied in roll form.

We are etching laminated materials of aluminum foil and film to form circuits. The thickness of the aluminum foil and the type and thickness of the film can be adjusted according to your requirements.

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MARUWA Alumina Substrate

MARUWA Alumina Substrate

Using carefully selected high-purity alumina.

Our alumina substrates are produced using carefully selected high-purity alumina raw materials and under strict quality control, ensuring consistently stable quality and excellent characteristics.

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Thin film circuit board thin film metallization

Thin film circuit board thin film metallization

MARUWA's thin film circuit boards are substrate materials created as a result of the fusion of various proven ceramic materials and the thin film metallization technology developed over many years.

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. By combining the thin film metallization technology that MARUWA has cultivated over many years with the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. Using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

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High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

High-Temperature Co-fired Ceramic Multilayer Substrate (HTCC)

Solder with excellent heat resistance for plated electrodes! Achieving high reliability, high density, and multifunctional products for various applications!

We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.

  • Safety and consumables
  • Substrate

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Glazed processed substrate

Glazed processed substrate

Glazed processed substrate

It is a glazed substrate with excellent surface smoothness and durability, coated with an alkali, lead-free amorphous glass on the surface of an alumina substrate. It is used in thermal print heads and other applications.

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Aluminum nitride substrate

Aluminum nitride substrate

Aluminum nitride products developed using ceramic materials technology.

Aluminum nitride products developed using ceramic materials technology possess excellent thermal conductivity, high electrical insulation, and characteristics such as thermal expansion similar to silicon, making them noteworthy as materials for high thermal conductivity substrates. They are used in power transistor module substrates, LED mount substrates, and IC packages.

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Silicon nitride substrate

Silicon nitride substrate

Silicon nitride products developed using ceramic materials technology.

Silicon nitride products developed using ceramic material technology are used in power semiconductor substrates and other applications due to their high strength, high toughness, and high thermal conductivity, making them suitable materials for high reliability requirements.

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Passcon Inc. Company Profile

Passcon Inc. Company Profile

We will strive to meet our customers' needs for high quality and high precision!

Since its establishment, Pascon has been offering various services related to printed circuit boards, focusing on printed circuit board design, procurement of electronic components, assembly, and the production of inspection fixtures. We will continue to strive to meet our customers' needs for high quality and high precision, so we appreciate your continued support. 【Business Activities】 ■ Printed circuit board design using CAD ■ Circuit diagram input using CAD ■ Board manufacturing (single-sided to multi-layer, flexible, etc.) ■ Development and sales of inspection equipment and assembly machines, software development ■ Production of inspection equipment, fixtures, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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[Case Study] Improving the Loss Rate of Expensive Materials

[Case Study] Improving the Loss Rate of Expensive Materials

Further cost cuts for mass production! We will strive to solve problems with a broad perspective!

In the case of fine substrates that are chip-processed into products, even a portion of the outer circumference becoming unusable due to the holder results in loss. For expensive materials like crystal substrates, even a few sheets of loss cannot be overlooked. In response to clients' demands for cost-cutting, it was necessary to review the coating process. Our company has been solving customer challenges through film formation design and the provision of optical components, but for this matter, we advanced the review of the substrate holding method. By improving the deposition axis and creating a method to secure from the top and sides, we made it possible to coat the entire surface of the substrate. As a result, there are no longer any areas without film adhesion, allowing us to turn all materials into products without waste, leading to significant cost reductions. 【Case Overview】 ■ Challenge: Eliminate material loss caused by non-adhesion due to vacuum deposition ■ Solution: Improved production methods to enable coating over the entire substrate ■ Future Outlook: Strive to solve challenges with a broader perspective beyond film formation design *For more details, please refer to the PDF document or feel free to contact us.

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Circuit board design, manufacturing, and assembly services

Circuit board design, manufacturing, and assembly services

We provide a one-stop service for optimal electronic equipment contract manufacturing in collaboration with partner companies with distinctive features.

Our company offers "circuit board design, manufacturing, and assembly services." We accept comprehensive orders from the design of printed circuit boards to board manufacturing and assembly (mounting). By collaborating with specialized companies for board manufacturing and assembly, we can deliver completed products to our customers, thereby achieving a reduction in labor hours and shortening delivery times. 【Features】 ■ Quick delivery ■ Re-manufacturing from raw printed circuit boards ■ High quality for peace of mind *For more details, please refer to the PDF document or feel free to contact us.

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Achieving short delivery times for multilayer printed circuit boards *Delivery possible in as little as 2 days!

Achieving short delivery times for multilayer printed circuit boards *Delivery possible in as little as 2 days!

High quality, high performance! Delivery of high multilayer printed circuit boards in as little as 2 days.

At Fuji Print Industry Co., Ltd., we have achieved short delivery times for multilayer printed circuit boards. High-difficulty boards that require severe precision and intricacy are our specialty. The technical skills cultivated through cutting-edge board manufacturing are embodied in all of our products. We deliver high-quality, high-performance multilayer printed circuit boards with more than 10 layers in as little as 2 days. 【Product Lineup】 - Single-sided printed circuit boards - Double-sided printed circuit boards - Multilayer printed wiring boards For more details, please contact us or download the catalog.

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Introduction to Toa Electronics Group's Electronic Equipment Assembly Production System

Introduction to Toa Electronics Group's Electronic Equipment Assembly Production System

We provide inspection equipment to maintain high quality! We aim to improve quality and reduce defect rates.

The Toa Electronics Group "Suntech Toyoake Factory" obtained certification for the international standard for quality management systems, ISO 9001, from the certification body "ASR Co., Ltd." on December 19, 2006. We are advancing the automation and in-house production of our manufacturing equipment with the aim of establishing a system that can consistently produce "high-quality" products, regardless of the skills of the operators. To maintain high quality, we inspect printed circuit boards using 2D and 3D automatic visual inspection machines. Additionally, we utilize CCD cameras and our proprietary centralized management system to capture images of the presence of components, positional deviations, differences in types, and variations in color and shape of components, thereby establishing a system for quality judgment. [Features] ■ Commitment to quality / ISO 9001 certification ■ In-house production of jigs to improve production efficiency ■ Inspection system to maintain high quality *For more details, please refer to the PDF document or feel free to contact us.

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Tohoku University Technology:Nitride semiconductor freestanding substrate production method: T14-121

Tohoku University Technology:Nitride semiconductor freestanding substrate production method: T14-121

Able to product GaN at low cost by forming of nitride semiconductor crystal boules

Recently, III-nitride semiconductors (GaN and InGaN) have been attracting attention as semiconductor materials for light-emitting devices such as LED and lasers. This nitride semiconductor has a bandgap energy with wide range wavelengths from infrared to ultraviolet light, and it is a promising material for blue & green LED and semiconductor lasers with UV to infrared region emission wavelengths. However, in the case of nitride semiconductors, the equilibrium vapor pressure between the gas and solid phases of nitrogen is much higher than the conventional III-V materials, so it is not possible to fabricate GaN single crystal substrates at low cost. Another option is to use freestanding GaN substrates, but the current fabrication techniques are costly. 　This invention is able to fabricate nitride semiconductor freestanding substrates with low threading dislocation density at a low cost. This invention comprises a total of seven steps, from the process of forming a buffer layer having a nitride semiconductor on the growing substrate main surface, to the process of fabricating a plurality of nitride semiconductor freestanding substrates.

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Tohoku University Technology: Substrate with AlN Film and Manufacturing Method: T13-034

Tohoku University Technology: Substrate with AlN Film and Manufacturing Method: T13-034

It is possible to produce a "super high quality" aluminum nitride film on a low-cost sapphire substrate!

Ultraviolet light-emitting devices are widely attracting attention as next-generation light sources for applications such as alternatives to fluorescent lamps, high-density DVDs, biochemical lasers, decomposition of pollutants using photocatalysts, He-Cd lasers, and alternatives to mercury lamps. These ultraviolet light-emitting devices consist of AlGaN-based wide bandgap semiconductors, which are layered on heterogeneous substrates such as sapphire. However, there have been challenges with the AlN films grown on sapphire, as they contain numerous threading dislocations and exhibit poor quality. The present invention significantly improves the crystallinity of the AlN films through a simple method of thermally treating substrates with AlN films grown on sapphire in a mixed gas of N2/CO.

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Ceramic balls for crushing

Ceramic balls for crushing

Choose the material that suits your purpose! We offer a variety of hard material balls.

Ito Manufacturing Co., Ltd., a manufacturer specializing in general scientific and physical instruments primarily in the field of powder technology, offers "ceramic balls for grinding." The hard material balls include high-purity alumina balls, high-purity alumina beads, alumina balls, zirconia balls, and silicon nitride balls. Please select the material that suits your application. 【Hard Material Balls】 ■ High-purity alumina balls (Al2O3-99.9% or higher) ■ High-purity alumina beads (Al2O3-99.99%) ■ Alumina balls (Al2O3-99.5%) ■ Zirconia balls (ZrO2-95%) ■ Silicon nitride balls (Si2N4-92%) ■ Titanium oxide balls (TiO2-77.7%, Al2O3-17.4%, SiO2-4.6%) ■ Silicon carbide balls (SiC-97% and others) ■ High-purity quartz balls, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Meter switch sensor control, information acquisition, and analysis system case study

Meter switch sensor control, information acquisition, and analysis system case study

We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT of devices through the integration of "control boards" and "smartphone applications." ■Example: Control, information acquisition, and analysis system for meters, switches, and sensors → Development of communication control boards such as Wi-Fi, control viewing applications, and big data servers. 1. Communication prioritized between machines and devices. Data is sent to smartphones via a Wi-Fi module using serial communication. 2. Accumulation and computation of machine information, as well as display of machine information. Broadly perform data transfer to the server, data reception, and information display. 3. Accumulation of information transferred from the application. Transmission of various service information. 4. Management of data sent from the server. It is possible to provide an introduction to operational status. ★In addition, we have numerous achievements in in-house development and contract development! ★For more details, please refer to the case materials available for download in the "PDF Download" section below.

  • IoT
  • Substrate

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Control of machine meters, switches, sensors, etc. - IoT development case studies

Control of machine meters, switches, sensors, etc. - IoT development case studies

We provide consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Development of communication control boards for controlling machine meters, switches, sensors, etc., and for Wi-Fi integration with smartphones, as well as engine information applications. 1. Communication control of meters, switches, sensors, etc., in machines and devices via boards Data transmission to smartphones through a Wi-Fi module using serial communication. 2. Various information can be processed on the smartphone app: - Accumulation and calculation of engine information (e.g., parts lifespan and failure prediction) - Display of engine information (e.g., meters) - Display of fault diagnosis (diagnostic) information - Data transfer to the server (engine information) - Data reception from the server and information display. 3. Data management and operational status introduction in offices and other locations are made possible. ★ We also have numerous achievements in in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.

  • IoT
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Real-time Factory Operation System (System Screen Edition) IoT Development Case Study

Real-time Factory Operation System (System Screen Edition) IoT Development Case Study

We provide consistent in-house support for substrate and software development! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■ Case Study: Real-Time Factory Operation Monitoring System - Check operational status in real-time via a web browser or dedicated app - Monitor the number of units operating in real-time and the total number of units operating in a day - Access permissions can be granted only to administrators - Screen display items can be customized according to customer needs ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.

  • IoT
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Special Printed Circuit Board Manufacturing Service for LED Lighting (Metal Base Board)

Special Printed Circuit Board Manufacturing Service for LED Lighting (Metal Base Board)

Ideal for LED lighting products with high temperatures. Significantly reduces lifespan deterioration due to reasons other than the LED chip.

We offer a variety of materials, including aluminum and copper, in different thicknesses, allowing for the production of metal base substrates with various specifications. LEDs are characterized by their energy efficiency, brightness, and long lifespan; however, one drawback is that their lifespan can be reduced for reasons other than the LED chip itself due to heat generation, which can be problematic. A metal base substrate is designed to dissipate the heat generated by the LED during operation. By using a substrate made of metals with good thermal conductivity, such as aluminum or copper, we can effectively dissipate the heat generated by the LED. For more details, please contact us or download the catalog.

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Printed circuit board manufacturing - single-sided board

Printed circuit board manufacturing - single-sided board

Standard materials: Galapagos substrate, paper phenol, composite.

We use FR-4 (glass epoxy substrate), FR-1 (paper phenolic), and CEM-3 (composite) as standard materials. We offer a wide range of thicknesses from 0.5mm to 2.0mm to meet our customers' needs. *Other thicknesses can also be accommodated by using double-sided materials. We can ship in as little as 1 business day. For more details, please contact us or refer to our catalog.

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Printed circuit board manufacturing double-sided flexible circuit board

Printed circuit board manufacturing double-sided flexible circuit board

A flexible substrate with a total thickness of 100μ is possible with the thinnest material. Halogen-free options are also available.

Like one-sided flexible circuits, we have a variety of materials in stock. The thinnest option allows for flexible substrates with a total thickness of 100μ, and of course, halogen-free options are also available. For more details, please contact us or refer to our catalog.

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Printed circuit board manufacturing - build-up boards

Printed circuit board manufacturing - build-up boards

It is a method of forming a build-up layer on top of a core substrate.

The precision of printed circuit boards has advanced, and the demand for printed wiring boards using the build-up method has increased. The build-up method is a construction technique that forms build-up layers on top of a core substrate. The connection between the core substrate and the build-up layers is made using laser vias. By using this method, it becomes possible to achieve higher density wiring. Currently, it can accommodate up to 2-layer builds (two layers of build-up layers above and below). Additionally, stack vias and filled vias are also supported. There are also achievements in manufacturing rigid-flex boards and multilayer flex boards using the build-up method. For more details, please contact us or refer to the catalog.

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Special Printed Circuit Board Manufacturing - Impedance Control Board

Special Printed Circuit Board Manufacturing - Impedance Control Board

Control the pattern width and interlayer thickness to perform impedance control.

Based on our extensive past experience, we control the pattern width and layer thickness to perform impedance control. By using Polar's impedance simulation software 'Si8000', we can pre-calculate the impedance values of the completed circuit boards, enabling accurate impedance control. Additionally, we can simulate the layer configuration, line width, and line spacing during the pattern design phase, allowing us to propose specifications that facilitate easier impedance control. For measuring the impedance of the completed circuit boards, we use the 'MZPC50' measuring instrument from Microcraft Co., Ltd., and we can provide measurement results (using the TDR method). For more details, please contact us or refer to our catalog.

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