List of チップ products
1486~1530 item / All 2771 items
Achieves high color reproduction with natural white light across the entire visible spectrum.
- Garden lighting/lights (LED/solar)
- Ceiling Lighting Fixtures
- Special lighting
Crushing cut powder to reduce overall volume! Available in single-axis and twin-axis types!
- Rock drills, demolition machines, and excavators
- others
We respond to requests such as 'I want to switch from plastic materials to environmentally friendly paper materials' and 'I want to make paper from original raw materials.' *Case studies available.
- others
Compact and lightweight! 30,000 center lumens 4K resolution projector.
- Audio and video equipment
- Spatial Design
Intuitive and flexible to operate! Highly recommended for 5G measurement and analysis.
- Other Software
Good visibility from any angle! Stable synchronized flashing is possible regardless of the region or location.
- Special lighting
It is possible to simultaneously build various AI algorithms and DSP algorithms and output the results!
- Audio and video equipment
For those looking for an alternative of equivalent quality to the Olympus OMCL series, which has been discontinued! The most versatile AFM probe/cantilever.
- Other analytical equipment
The luminous color and brightness are 720lm for warm white, 790lm for daylight, and 800lm for white.
- Fluorescent Light Type
[Available for preview] ~ 2.XD, 3D integration and substrate materials, encapsulation and bonding technologies, heat dissipation materials ~
- others

[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197) [Available for Preview]
- 2.XD, 3D Integration and Substrate Materials, Encapsulation and Bonding Technologies, Heat Dissipation Materials - ★ As the miniaturization of integrated circuits approaches its limits and the differentiation of advanced semiconductors becomes crucial, packaging technology holds the key! This publication covers the transformation of packaging technology associated with chiplets and 3D integration, along with new materials and process technologies. --------------------- ■ Table of Contents Chapter 1: Advanced Semiconductor Packaging Technologies and Their Structures, Process Technologies Chapter 2: Implementation Technologies and Heat Dissipation Measures for Next-Generation Power Semiconductors Chapter 3: Design of Semiconductor Encapsulation Materials, Required Characteristics, and Characteristic Improvement Technologies Chapter 4: Adhesion and Bonding Technologies in Semiconductor Packaging and Reliability Evaluation Chapter 5: Material Technologies for Printed Circuit Boards and Wiring Formation, Processing Technologies Chapter 6: Development Trends and Thermal Property Evaluation of Heat Management Materials Chapter 7: Analysis and Inspection Technologies for Semiconductor Packages --------------------- ● Publication Date: April 28, 2023 ● Format: A4, 613 pages ● Authors: 56 ● ISBN: 978-4-86104-945-4 ---------------------
Cost-effective and environmentally friendly! A next-generation food waste processor utilizing the power of bio bacteria manufactured and sold directly by our domestic company.
- Other store equipment and supplies
- Restaurant furniture and equipment
- Fertilizers and Pesticides
A flight conveyor (bucket conveyor) that can efficiently transport commercial food waste, etc., to a composting (fermentation decomposition) system by the "intermediate emission mechanism."
- Transportation System
- Other elevators and transport systems
- Fertilizers and Pesticides
Bulk registration of incoming data significantly improved operational efficiency! Here is a case study where labor costs were also reduced.
- Inventory Management System
The nozzle is made of super hard material, protecting the sealing area with a diaphragm to prevent wear. It's perfect for glazes and aggregate paints! If you were struggling with quick wear, this is i...
- paint
[Demo test currently accepting] It is used for crushing treatment aimed at recycling combustible waste such as waste plastic, old paper, packaging materials, and textiles.
- Rock drills, demolition machines, and excavators
For those looking for an alternative of equivalent quality to Olympus's discontinued OMCL series! The most versatile AFM probe/cantilever.
- Other analytical equipment
We will assist you with various software development tasks, from proposals to support.
- Other Software
Deploying image AI in harsh environments on PCs equipped with Hailo and NVIDIA AI modules.
- Other PCs and OA equipment

We have released a white paper on approaches to implementing image AI and edge AI in harsh environments.
Recently, various AI applications have reached a practical level. Their uses are diverse, and there are high expectations for their application in various locations. However, implementing them at the edge requires addressing the heat dissipation of high-heat-generating components while ensuring coordination with machine control and maintaining strict environmental durability through temperature control, vibration control, and mechanical design. Analog Tech has compiled an approach for implementing image AI and edge AI in field environments, along with platform information for implementation, in a white paper. Please refer to it. You can find more information in the following catalog download from Ipros: https://premium.ipros.jp/analogtech/catalog/detail/619854/
Make effective use of regional resources! Heat utilization is economical with biomass small furnaces!
- Biomass heat utilization technology
- District heating and cooling/heat source system
Contributing to the maintenance of safety in a wide range of areas!
- Other construction services
- Non-destructive testing
The solution catalog for the food and beverage industry has been completed.
This is a catalog of products from Sain that helps maintain a high hygiene environment for cleaning and sanitation tasks, improve safety, and enhance work efficiency.
RFID tag equipped with large-capacity memory compliant with EPC.
- Other Software

IoT Solutions Seminar for the Logistics and Manufacturing Industry: Utilizing IoT and Optimizing Operations in the SDGs Era
By engaging with the SDGs, companies can create both economic and social value, leading to the establishment of a circular system. Setting goals towards the 2030 commitment and implementing a PDCA cycle to achieve the SDGs within the company is the corporate strategy for "the era to come." Utilizing technology to realize the SDGs and create a more sustainable society is one of the things we, as companies, can do. In recent years, with the advancement of technology, particularly in logistics and manufacturing, operations have become more reliant on individuals, leading to challenges such as labor shortages and chronic automation issues. As a response, the use of IoT is gaining traction. Therefore, we are inviting the Japan Automatic Identification System Association (JAISA), which promotes the standardization and dissemination of automatic identification technology, and Nippon Pallet Rental Co., Ltd., which is working on optimizing logistics, to hold a seminar focused on the use of IoT and optimization of operations in the logistics and manufacturing industries. If you are interested in the key points for successful IoT implementation, how to proceed, and the latest case studies, please be sure to apply!
Easy-to-install integrated package! Layout can be customized according to output and tank capacity.
- Refrigeration units, boilers, cooling towers
To manage attendance using facial recognition, which is becoming more widespread, it can be easily implemented on a low budget. There is no need for card updates or issuance, which helps reduce operat...
- Entrance and exit control system

Sweden, an advanced IT country, is moving away from digital textbooks, and the use of ICT devices is "appropriate."
In Sweden, an IT advanced country, the move away from digital textbooks is progressing, and in the new school term starting in August 2023, more emphasis is being placed on reading time and handwriting practice, while the time spent using computers and tablets is being reduced. Additionally, Sweden's Minister of Education, Lotta Edholm, has announced the government's intention to overturn the decision by the National Agency for Education to mandate the use of digital devices in kindergartens, and reports indicate that the government plans to go further by completely abolishing digital learning for children under six years old. An international assessment of reading comprehension for fourth graders, the Progress in International Reading Literacy Study (PIRLS), has revealed that the reading skills of Swedish students have declined between 2016 and 2021. Politicians and experts have raised concerns that the highly digitized education system may have led to a decline in basic skills, and it seems that Minister Lotta Edholm has responded to this by initiating a move away from digitalization. For more details, click here: https://t-lenon.com/info/education/9031/
[Available for preview] - Low dielectric resin, high-frequency circuit boards, semiconductor package materials, optoelectronic fusion -
- others

[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274) [Available for Preview]
- Low dielectric resin, high-frequency circuit boards, semiconductor package materials, optoelectronic integration - ★ A comprehensive collection of devices and materials supporting high-speed, large-capacity communication driven by the spread of 5G/6G and generative AI! ★ Requirements for materials used in 2.xD, 3D packaging, chiplets, and next-generation packages, along with development examples from various companies. ---------------------------- Chapter 1: Development Trends and Wiring Formation of High-Speed Communication Printed Circuit Board Materials Chapter 2: Development Trends of Low Dielectric Resins and Evaluation of Dielectric Constants Chapter 3: Material Development for Advanced Semiconductor Packages Chapter 4: Development Trends of Electronic Components for High-Speed, High-Frequency Communication Chapter 5: Development Trends of Optical Interconnects and Integration Technologies ---------------------------- ● Publication Date: December 27, 2024 ● Format: A4, 600 pages ● Authors: 56 individuals ● ISBN: 978-4-86798-054-5 ----------------------------
【Easy-to-Install Desktop Type】 Compact size allows for placement anywhere without the need for installation work.
- others
High-performance dimple key cylinder capable of assembling a master key system.
- Other security systems
Simultaneous recovery of sludge and floating oil with one unit! Usable in NC, MC, and grinding operations.
- others
Sharp cutting edge penetrates in one go! Dry diamond bit that doesn't require water.
- Work tools
On-site manufacturing and pouring of soil-based pavement! Introduction to the construction and characteristics of Tough Coat.
- Exterior and paving materials <General>
- Paving Materials
PCI Express slot that achieves wide-ranging expandability! Equipped with a highly reliable industrial power supply.
- Other PCs and OA equipment
The allowable color coordinate deviation complies with CIE D50! It has excellent color rendering similar to 5000K.
- LED light source/module
Basic design assuming introduction to large-scale networks! Use of issued IC cards is also possible.
- others
High security and high power with a maximum of 40 sheets for bulk shredding! An environmentally friendly shredder promoting plastic reduction with a plastic usage rate of about 1%.
- Other PCs and OA equipment
A POS terminal that provides the best digital experience in its class!
- Payments, cards, and electronic money
- Payment agency
New compact-sized model! Equipped with a USB Type-C port that supports alternate mode.
- Desktop PC
Experience the prestigious FileMaker Server hosting service.
- Hosting Services
Crushing from construction waste wood to bark with one machine! Achieving an efficient manufacturing line without waste.
- Other resource recycling
- Wood processing
A new technology for rock-breaking methods using continuous drilling that enables efficient mechanical excavation of hard rock formations.
- Rock drills, demolition machines, and excavators
- Other civil engineering services
The latest wireless LAN standard IEEE 802.11ax (Wi-Fi 6/Wi-Fi 6E) and a wireless LAN combo module with unique features.
- others
Infinite visual beauty. A challenge to countless color reproductions entering a period of innovation.
- Notebook PC