[Book] Trends in the Development of Next-Generation High-Speed and High-Frequency Transmission Materials (No. 2274) [Available for Preview]

- Low dielectric resin, high-frequency circuit boards, semiconductor package materials, optoelectronic integration -
★ A comprehensive collection of devices and materials supporting high-speed, large-capacity communication driven by the spread of 5G/6G and generative AI!
★ Requirements for materials used in 2.xD, 3D packaging, chiplets, and next-generation packages, along with development examples from various companies.
----------------------------
Chapter 1: Development Trends and Wiring Formation of High-Speed Communication Printed Circuit Board Materials
Chapter 2: Development Trends of Low Dielectric Resins and Evaluation of Dielectric Constants
Chapter 3: Material Development for Advanced Semiconductor Packages
Chapter 4: Development Trends of Electronic Components for High-Speed, High-Frequency Communication
Chapter 5: Development Trends of Optical Interconnects and Integration Technologies
----------------------------
● Publication Date: December 27, 2024 ● Format: A4, 600 pages
● Authors: 56 individuals ● ISBN: 978-4-86798-054-5
----------------------------

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration
Related Links
Technical Information Association Site