[Book] Latest Trends in Next-Generation Semiconductor Packaging (No. 2197)

[Available for preview] ~ 2.XD, 3D integration and substrate materials, encapsulation and bonding technologies, heat dissipation materials ~

Book Title: Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes ★ As the miniaturization of integrated circuits approaches its limits, the differentiation of advanced semiconductors hinges on packaging technology! This book covers the transformation of packaging technology associated with chiplets and 3D integration, along with new materials and process technologies. ■ Key Points of This Book - Development status of next-generation packaging technologies such as FOWLP, 2.XD, silicon bridge, and 3D... - Hybrid bonding technology and new bonding materials that are key to 3D stacking. - Required characteristics of sealing materials for new applications and the suppression of cracks and delamination. - Build-up processes that achieve fine wiring and high density in package substrates. - Package structures that demonstrate the performance of next-generation WBG semiconductors, along with high-heat-resistant sealing and bonding materials. - Causes and countermeasures for defects such as cracks, voids, and whiskers in solder mounting. - Compatibility of low dielectric properties and other characteristics (heat resistance, low CTE, etc.) in films for multilayer substrates for high-speed communication. - Techniques for the densest packing of fillers for high thermal conductivity, and the design of heat dissipation materials that are both highly thermally conductive and low dielectric.

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