[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197) [Available for Preview]

- 2.XD, 3D Integration and Substrate Materials, Encapsulation and Bonding Technologies, Heat Dissipation Materials -
★ As the miniaturization of integrated circuits approaches its limits and the differentiation of advanced semiconductors becomes crucial, packaging technology holds the key! This publication covers the transformation of packaging technology associated with chiplets and 3D integration, along with new materials and process technologies.
---------------------
■ Table of Contents
Chapter 1: Advanced Semiconductor Packaging Technologies and Their Structures, Process Technologies
Chapter 2: Implementation Technologies and Heat Dissipation Measures for Next-Generation Power Semiconductors
Chapter 3: Design of Semiconductor Encapsulation Materials, Required Characteristics, and Characteristic Improvement Technologies
Chapter 4: Adhesion and Bonding Technologies in Semiconductor Packaging and Reliability Evaluation
Chapter 5: Material Technologies for Printed Circuit Boards and Wiring Formation, Processing Technologies
Chapter 6: Development Trends and Thermal Property Evaluation of Heat Management Materials
Chapter 7: Analysis and Inspection Technologies for Semiconductor Packages
---------------------
● Publication Date: April 28, 2023 ● Format: A4, 613 pages
● Authors: 56 ● ISBN: 978-4-86104-945-4
---------------------

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration
Related Links
Technical Information Association site