List of Electrical Equipment Testing products

  • classification:Electrical Equipment Testing

136~180 item / All 288 items

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Manage jack pressure and remotely check hydraulic and water pressure measurements without manual intervention! Quickly and safely obtain data without entering the installation site!

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  • Other measuring instruments

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We offer a rich selection and reliable technology. With comprehensive guarantees, you can feel secure even after installation! For commercial air conditioners suitable for offices and stores, please c...

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  • Heating and cooling equipment and facilities

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[Special Selection] Designed for Severe Winter! Commercial Air Conditioner for Cold Regions | Sumi no Mori

Even in sub-zero temperatures, management that doesn't stop. ~Proposal for upgrading to next-generation commercial air conditioners designed for cold regions~ On winter mornings, offices and stores are not warming up. Is that slight "heating loss" directly linked to decreased employee performance and dissatisfaction from important customers? If your existing air conditioner has been installed for over 10 years, it poses a "hidden management risk." The latest commercial air conditioners for cold regions have evolved from mere heating devices into powerful infrastructure that supports stable operation during winter. [Three Reasons to Recommend Cold Region Models] Overwhelming defrosting performance: Maintains performance even in low outdoor temperatures. Continuous operation technology that doesn't stop heating creates a comfortable space. Cost reduction: The latest inverter technology significantly reduces electricity costs compared to older models. Avoidance of failure risks: Prevents high repair costs and losses from business interruptions due to sudden failures of aging models. From "still working" to "replace it while you can." Shall we get through the harsh winter with reliable peace of mind and efficient cost management? If you have any questions or would like a quote, please feel free to contact us. We will fully support you in replacing your commercial air conditioner!

This is a temperature calibrator for infrared radiation thermometers designed with a compact and lightweight structure so that calibration can be performed at the work site.

  • Other measuring instruments
  • Electrical Equipment Testing

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It is an infrared radiation thermometer that supports a wide temperature measurement range from -50 to +1000℃.

  • Other measuring instruments
  • Electrical Equipment Testing

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Helps comply with new regulations and standards! Capable of handling a wide range of workloads.

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  • Other measuring instruments
  • Electrical Equipment Testing

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An AC measurement standard that combines high accuracy with the ease of use of a digital multimeter.

  • others
  • Other measuring instruments
  • Electrical Equipment Testing

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Instant judgment, easily understood at a glance! This is a high-speed insulation resistance tester equipped with a comparator function.

  • Electrical Equipment Testing
  • Solar power generation equipment

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It is a multifunctional digital phase characteristic testing device capable of 5A output.

  • Electrical Equipment Testing
  • Other analytical equipment

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Equipped with isothermal heating continuous testing and isothermal heating intermittent testing modes! The main unit has a splash-proof design, making it safe for outdoor use.

  • Electrical Equipment Testing

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This is an Ior leak high tester equipped with a live line megohm function that was impossible with an insulation resistance meter.

  • Electrical Equipment Testing
  • Automatic Control Equipment

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Safe! Speedy! Simultaneous measurement of voltage and current without contact.

  • Other measuring instruments
  • Electrical Equipment Testing

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Display voltage and current on one screen.

  • Other measuring instruments
  • Wiring devices
  • Electrical Equipment Testing

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Dustproof and waterproof structure! It is also possible to fix the cable and sensor to the winding part for real-time measurement.

  • Electrical Equipment Testing

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I have assembled a set of tools necessary for the electrical work technician skill exam.

  • Piping and electrical wiring materials
  • Water and sewerage pipe fittings
  • Electrical Equipment Testing

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The ON/OFF status is easy to understand with the LED indicator.

  • Other measuring instruments
  • Electrical Equipment Testing

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The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.

  • Other analytical equipment
  • Electrical Equipment Testing

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

Flux cleaning for electronic circuits and components! A cleaning system that enhances not only high quality but also ecology and economy.

  • Safety and consumables
  • Electrical Equipment Testing

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Equipped with Bluetooth functionality, allowing for easy transfer of measurement data.

  • Electrical Equipment Testing

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Achieve powerful deodorization and disinfection! Solve all your tank problems at once!

  • Drainage and ventilation equipment
  • others
  • Electrical Equipment Testing

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R&D small tabletop spin coater. Lightweight coater for MAX 2 inches. Built-in vacuum pump. Machine and equipment settings are easy to operate.

  • Electrical Equipment Testing

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We will set various operational methods, investigate appropriate operational methods in advance, and make proposals!

  • Electrical Equipment Testing

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We propose the optimal performance testing equipment tailored to your needs!

  • Electrical Equipment Testing

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We provide one-stop support for the introduction and operation of equipment and devices for various purposes. We are committed to solving our customers' challenges!

  • Solar power generation equipment
  • DC Power Supply
  • Electrical Equipment Testing

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Providing further peace of mind and safety to the power system! We are fully committed to solving our customers' challenges.

  • maintenance
  • Other Management Services
  • Electrical Equipment Testing

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Transitional thermal measurement possible power cycle testing, with a customized luminescence/OBIRCH analysis device, where a skilled team thoroughly evaluates and analyzes power devices!

  • Electrical Equipment Testing

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An electronic breaker that significantly reduces the basic electricity charge.

  • Electrical Equipment Testing

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[Minimum and Lightweight Class, Easy Operation Settings] Ideal for business trips and travel, this lightweight handheld type is easy to carry. Body weight: 3.3 kg.

  • Electrical Equipment Testing

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Observe the crystal structure with EBSD! Data can be obtained for each metal.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

Visualize the features that appeared in the graph! You can check the distribution of crystal sizes and the orientation of crystal orientations.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

We will introduce an example of crystal analysis of intermetallic compounds at solder joints.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

We will introduce an example of analysis using EBSD for screws (Cu2Zn).

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

I will introduce an example of analysis using EBSD for pipes (austenite).

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

The EBSD method allows for the estimation of crystal size distribution and residual stress.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

We will introduce an example of analyzing EBSD patterns (Kikuchi patterns) at gold wire bond joints.

  • Electrical Equipment Testing
  • Other analytical equipment

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

Introducing our various products for the increasingly diverse electrical equipment!

  • Electrical Equipment Testing
  • Other measuring instruments
  • DC Power Supply

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Become a reliable generator during disasters! We will introduce examples of load testing for emergency generators.

  • maintenance
  • Electrical Equipment Testing
  • Other construction services

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KYORITSU: Pursuing maximum measurement speed on-site!

  • Other measuring instruments
  • Electrical Equipment Testing

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Introducing how to check the expiration date of proof electric meters (sub-meters) and a Q&A!

  • Power distribution and control panels
  • Electrical Equipment Testing

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Simulate with effective values using temperature controllers and more! Effective for sequence checks on-site!

  • Other security systems
  • Electrical Equipment Testing

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We manufacture testing equipment related products such as brake control devices.

  • Electrical Equipment Testing
  • others

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It is a portable TDR cable diagnostic device that inspects cables up to 6000 meters on an 11-level scale.

  • Electrical Equipment Testing

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