List of Electrical Equipment Testing products
- classification:Electrical Equipment Testing
136~180 item / All 293 items
Helps comply with new regulations and standards! Capable of handling a wide range of workloads.
- others
- Other measuring instruments
- Electrical Equipment Testing
An AC measurement standard that combines high accuracy with the ease of use of a digital multimeter.
- others
- Other measuring instruments
- Electrical Equipment Testing
Instant judgment, easily understood at a glance! This is a high-speed insulation resistance tester equipped with a comparator function.
- Electrical Equipment Testing
- Solar power generation equipment
It is a multifunctional digital phase characteristic testing device capable of 5A output.
- Electrical Equipment Testing
- Other analytical equipment
Equipped with isothermal heating continuous testing and isothermal heating intermittent testing modes! The main unit has a splash-proof design, making it safe for outdoor use.
- Electrical Equipment Testing
This is an Ior leak high tester equipped with a live line megohm function that was impossible with an insulation resistance meter.
- Electrical Equipment Testing
- Automatic Control Equipment
Safe! Speedy! Simultaneous measurement of voltage and current without contact.
- Other measuring instruments
- Electrical Equipment Testing
Display voltage and current on one screen.
- Other measuring instruments
- Wiring devices
- Electrical Equipment Testing
Dustproof and waterproof structure! It is also possible to fix the cable and sensor to the winding part for real-time measurement.
- Electrical Equipment Testing
I have assembled a set of tools necessary for the electrical work technician skill exam.
- Piping and electrical wiring materials
- Water and sewerage pipe fittings
- Electrical Equipment Testing
The ON/OFF status is easy to understand with the LED indicator.
- Other measuring instruments
- Electrical Equipment Testing
The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.
- Other analytical equipment
- Electrical Equipment Testing

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Flux cleaning for electronic circuits and components! A cleaning system that enhances not only high quality but also ecology and economy.
- Safety and consumables
- Electrical Equipment Testing
Equipped with Bluetooth functionality, allowing for easy transfer of measurement data.
- Electrical Equipment Testing
Achieve powerful deodorization and disinfection! Solve all your tank problems at once!
- Drainage and ventilation equipment
- others
- Electrical Equipment Testing
R&D small tabletop spin coater. Lightweight coater for MAX 2 inches. Built-in vacuum pump. Machine and equipment settings are easy to operate.
- Electrical Equipment Testing
We will set various operational methods, investigate appropriate operational methods in advance, and make proposals!
- Electrical Equipment Testing
We propose the optimal performance testing equipment tailored to your needs!
- Electrical Equipment Testing
We provide one-stop support for the introduction and operation of equipment and devices for various purposes. We are committed to solving our customers' challenges!
- Solar power generation equipment
- DC Power Supply
- Electrical Equipment Testing
Providing further peace of mind and safety to the power system! We are fully committed to solving our customers' challenges.
- maintenance
- Other Management Services
- Electrical Equipment Testing
Transitional thermal measurement possible power cycle testing, with a customized luminescence/OBIRCH analysis device, where a skilled team thoroughly evaluates and analyzes power devices!
- Electrical Equipment Testing
An electronic breaker that significantly reduces the basic electricity charge.
- Electrical Equipment Testing
Pursuing greater customer satisfaction with abundant test data and evaluation techniques.
- Electrical Equipment Testing
- Analysis and prediction system
- others
[Minimum and Lightweight Class, Easy Operation Settings] Ideal for business trips and travel, this lightweight handheld type is easy to carry. Body weight: 3.3 kg.
- Electrical Equipment Testing
Observe the crystal structure with EBSD! Data can be obtained for each metal.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Visualize the features that appeared in the graph! You can check the distribution of crystal sizes and the orientation of crystal orientations.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
I will introduce an example of analysis using EBSD for pipes (austenite).
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal size distribution and residual stress.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of analyzing EBSD patterns (Kikuchi patterns) at gold wire bond joints.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Testing equipment for understanding the various performances of redox flow batteries (RFB).
- Electrical Equipment Testing
Introducing our various products for the increasingly diverse electrical equipment!
- Electrical Equipment Testing
- Other measuring instruments
- DC Power Supply
Become a reliable generator during disasters! We will introduce examples of load testing for emergency generators.
- maintenance
- Electrical Equipment Testing
- Other construction services
KYORITSU: Pursuing maximum measurement speed on-site!
- Other measuring instruments
- Electrical Equipment Testing
Expand the applications of maintenance and preservation based on safety design, ensuring high reliability and safety.
- Electrical Equipment Testing
Introducing how to check the expiration date of proof electric meters (sub-meters) and a Q&A!
- Power distribution and control panels
- Electrical Equipment Testing
Simulate with effective values using temperature controllers and more! Effective for sequence checks on-site!
- Other security systems
- Electrical Equipment Testing
We manufacture testing equipment related products such as brake control devices.
- Electrical Equipment Testing
- others