LSIクーラー List of Products and Services

We offer a "Flexible Heat Sink" that elegantly addresses the heat dissipation challenges of curved surfaces. The newly conceived variable base structure heat sink allows for flexible deformation to match the curved shapes of cooling targets, such as perfect circles, partially opened shapes, and ellipses. This innovative structure fits even the curved surfaces that have been difficult to install on until now, maximizing heat dissipation effectiveness. 【Specifications】 ■ Material: Aluminum or aluminum alloy ■ Fin shape and size: Custom-made according to your requirements *For more details, please download the PDF or feel free to contact us.

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• Heat exchanger
• Parts and Materials

Introduction to the machining equipment owned by LSI Cooler Co., Ltd. At the LSI Cooler Fukushima factory, we have 21 machining centers and 2 5-axis vertical machining centers at our partner factories. The table working surface of the class 30 3-axis machining center is X: 1,100mm × Y: 500mm, allowing for handling of large workpieces. Additionally, with the 2 5-axis vertical machining centers owned by our partner factories, we can apply various approaches to the tool's work contact surface, making it fully capable of producing complex-shaped products. 【Features】 ■ A wide variety of machining centers available ■ Capable of handling large workpieces ■ Able to accommodate complex shapes *For more details, please refer to the related links or feel free to contact us.

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The "Alshu III" is an alcohol disinfectant stand equipped with a foot pedal. By stepping on the pedal, you can dispense disinfectant from the pump, allowing for disinfection without directly touching the push area, thereby reducing the risk of infection through contact with the push area by multiple people. Since it is foot-operated, no power supply is required, making it easy to use in various places such as schools, restaurants, hospitals, and local governments. 【Features】 ■ Allows hand disinfection without touching the pump ■ Compatible with commercially available bottles ■ No assembly required ■ Made in Japan (high quality) ■ Available in sizes for children, etc. *We can accommodate short delivery times for bulk purchases, so please consult us. *For purchases, please contact us directly through the link below.

• Safety and consumables

The "Alshu III" is an alcohol disinfectant stand equipped with a foot pedal. By stepping on the pedal, disinfectant can be dispensed from the pump, allowing for disinfection without directly touching the push area, thereby reducing the risk of infection through contact with the push area by multiple people. Since it is foot-operated, no power supply is needed, making it easy to use in various locations such as office reception areas, factory entrances, meeting room entrances, and employee cafeteria entrances. 【Features】 - Allows hand disinfection without touching the pump - Compatible with commercially available bottles - No assembly required - Made in Japan (high quality) - Available in sizes for children, etc. *We can accommodate short delivery times for bulk purchases, so please consult us. *For purchases, please contact us directly through the link below.

• Safety and consumables

As specialists in thermal radiation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural cooling heat fins as well as forced air cooling solutions. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Sink for Driver Circuits P Series" - Heat sinks with mounting terminals for TO-220 packages. - A wide range of standard lineups is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We offer heat fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fishing lights. *Online meetings are also possible, so please feel free to contact us.

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With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be made freely according to specifications for each output capacity - Simple structure that does not require wind tunnel sheet metal - Both sides of devices such as power modules can be mounted 【YK Series/YU Series】 - Single-sided base type - Fin arrangement can be freely configured according to unit composition ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type - Selection from standard lineup, customization is also possible ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, customization is also possible ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages such as TO220 - Many standard lineup options available, dimension customization is also possible ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, designed for air cooling - Small-scale prototypes can be made, dimension and processing customization is also possible

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Heat sinks are utilized as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. [Contents] - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin type heat sink - H Series: Multipurpose, general-purpose fin type heat sink *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out.

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LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We aim to shorten development time and propose suitable costs. 【Features】 〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also available, so please feel free to contact us.

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The comb-fit heat sink has achieved high-performance heat dissipation through its unique aluminum pressure welding technology. It features excellent heat dissipation characteristics and robustness. 【Features】 ● YX Series → Composed of three parts: left, right, and intermediate fins → The number of intermediate fins can be changed to freely set the width of the fins (width: up to 500mm) → For high-performance forced air cooling ● YK/YU Series → Composed of separate parts for the base and fins → Fins can be freely configured → For high-performance forced air cooling ● YC Series → For water cooling ● Comb-fit Joining Principle → The surfaces of the aluminum base and fins that make up the heat sink are covered with a hard oxide film exposed to air → By instantly removing the hard oxide film and pressing the fresh surfaces of the fins and base together under pressure, the metals bond, improving thermal conductivity between the base and fins → The stress generated during press-fitting and work hardening are combined to join the fins and base → The bonding strength is incomparable to simply pushing the fins into the base *Online meetings are also possible, so please feel free to contact us.

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Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. This product employs forced cooling using water, achieving a simple and low-cost water-cooled heat sink made from aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are possible) ■ Low cost ■ Specification verification is supported by simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated from the devices if cooling is not performed during operation. 【Features】 〇 A radiator for electronic components that prevents device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-laminated hollow double-sided base type *Online meetings are also possible, so please feel free to contact us.

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We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also possible, so please feel free to contact us.

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We are pursuing high performance in heat sinks and radiators. Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

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We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The multi-purpose, general-purpose F/H/M series heat sinks are aluminum extruded fin-type heat sinks. *Online meetings are also possible, so please feel free to contact us.

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We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface mount devices are of the aluminum extrusion type and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

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We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

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The surface of the aluminum material that makes up the base and fins of the heat sink is covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal will bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.

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This is a radiator for electronic components that prevents the destruction of devices by quickly transferring and cooling heat. It mainly consists of a base plate to which the heat-generating element is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. *Online meetings are also available, so please feel free to contact us.*

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