The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.
We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated from the devices if cooling is not performed during operation. 【Features】 〇 A radiator for electronic components that prevents device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-laminated hollow double-sided base type *Online meetings are also possible, so please feel free to contact us.
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A heat sink is an electronic component radiator that prevents the destruction of devices by quickly transferring and cooling heat. It typically consists of a base plate that attaches to the heat-generating component and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or employing cooling media such as water. In LSI coolers, high-efficiency thermal management is achieved through heat sinks, continuously pursuing high performance supported by thermal theory. ● For more details, please contact us or refer to the catalog.
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One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of the CPU, which is the heart of the computer, demands further acceleration, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks, ranging from those for computers to large ones for automotive equipment.