Utilizing the excellent thermal conductivity of aluminum for heat dissipation and heat absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.
Heat sinks are utilized as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. [Contents] - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin type heat sink - H Series: Multipurpose, general-purpose fin type heat sink *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out.
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The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated from the devices themselves if cooling is not performed during operation. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, high-efficiency heat management is achieved through heat sinks, and we continue to pursue high performance supported by thermal theory.
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Download All Catalogs![[Comprehensive Catalog] Electronic Component Radiator "Heat Sink"](https://image.www.ipros.com/public/catalog/image/01/652/49775/IPROS47137022288797566888.jpeg?w=120&h=170)
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One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of the CPU, which is the heart of the computer, demands further acceleration, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks, ranging from those for computers to large ones for automotive equipment.
![[Case Study] Aluminum Extrusion Heat Sink](https://image.www.ipros.com/public/product/image/224/2000355542/IPROS32877600373320369243.jpeg?w=280&h=280)
