Thermal management in electronics! Optimal heat sinks for performance and cost.

For thermal management of high-efficiency inverters, use a simple heat sink! Professional catalog available.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be made freely according to specifications for each output capacity - Simple structure that does not require wind tunnel sheet metal - Both sides of devices such as power modules can be mounted 【YK Series/YU Series】 - Single-sided base type - Fin arrangement can be freely configured according to unit composition ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type - Selection from standard lineup, customization is also possible ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, customization is also possible ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages such as TO220 - Many standard lineup options available, dimension customization is also possible ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, designed for air cooling - Small-scale prototypes can be made, dimension and processing customization is also possible

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