For thermal management of high-efficiency inverters, use a simple heat sink! Professional catalog available.
With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be made freely according to specifications for each output capacity - Simple structure that does not require wind tunnel sheet metal - Both sides of devices such as power modules can be mounted 【YK Series/YU Series】 - Single-sided base type - Fin arrangement can be freely configured according to unit composition ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type - Selection from standard lineup, customization is also possible ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, customization is also possible ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages such as TO220 - Many standard lineup options available, dimension customization is also possible ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, designed for air cooling - Small-scale prototypes can be made, dimension and processing customization is also possible
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basic information
【Regarding Design Support】 - Optimally design heat sinks according to various heat dissipation conditions. - Create evaluation models and enable actual performance measurement of heat sinks. - Support speed up from product development to evaluation. 【Regarding Production Support in Vietnam】 - Cost measures for heat sinks for low-capacity models. - Product supply measures for the ASEAN supply chain. - Custom manufacturing for specific models is also possible. *Online meetings are also available, so please feel free to contact us.
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One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of the CPU, which is the heart of the computer, demands further acceleration, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks, ranging from those for computers to large ones for automotive equipment.
