Support from thermal design to provide the right products! Free provision of analysis using simulation software and actual measurement data for thermal countermeasures!
LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We aim to shorten development time and propose suitable costs. 【Features】 〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also available, so please feel free to contact us.
Inquire About This Product
basic information
If you would like a free diagnosis, please make a request through the contact form.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
If you would like a free diagnosis, please make your request through the contact form.
catalog（2）
Download All Catalogs
![[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service](https://image.www.ipros.com/public/catalog/image/01/692/455634/IPROS65342650720638773308.jpeg?w=120&h=170)
Company information
One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of the CPU, which is the heart of the computer, demands further acceleration, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks, ranging from those for computers to large ones for automotive equipment.
![[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)](https://image.www.ipros.com/public/product/image/4a8/2000635052/IPROS57554393276356367500.png?w=280&h=280)
