Quickly transfers heat.
This is a radiator for electronic components that prevents the destruction of devices by quickly transferring and cooling heat. It mainly consists of a base plate to which the heat-generating element is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. *Online meetings are also available, so please feel free to contact us.*
Inquire About This Product
basic information
【Features】 〇 Determined by thermal resistance value (℃/W) 〇 The smaller the value, the better the cooling capability of the heat sink. 〇 The thermal resistance value of the heat sink is derived from the following formula. Thermal resistance value (℃/W): Hr = (T1 - T2) / Q T1 - T2 = △T T1: Temperature of the semiconductor device (℃) T2: Ambient temperature (℃) Q: Heat generated from the semiconductor (W) △T: Temperature rise (℃) ● For more details, please contact us or download the catalog (digest version).
Price information
-
Delivery Time
Applications/Examples of results
For more details, please contact us.
catalog（1）
Download All Catalogs![[Comprehensive Catalog] Electronic Component Radiator "Heat Sink"](https://image.www.ipros.com/public/catalog/image/01/652/49775/IPROS47137022288797566888.jpeg?w=120&h=170)
Company information
One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of the CPU, which is the heart of the computer, demands further acceleration, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks, ranging from those for computers to large ones for automotive equipment.