The principle of comb-fit connection is...
The surface of the aluminum material that makes up the base and fins of the heat sink is covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal will bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.
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【Features】 ◯ It is based on the same principle as peeling the surface of a roasted rice cake and sticking the soft part to it. ◯ The bonding strength is far superior to simply pressing the fins into the base, as it combines the stress generated during insertion and the work hardening caused by the bending of the fin joint. ◯ It is carefully manufactured under strict management. ● For more details, please contact us or download the catalog.
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One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of the CPU, which is the heart of the computer, demands further acceleration, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks, ranging from those for computers to large ones for automotive equipment.