三和電子サーキット List of Products and Services

This document provides a simple diagrammatic explanation of the printed circuit board manufacturing process. - Types and characteristics of main materials - Types of printed circuit board manufacturing methods - Types of surface treatments And more are also included. *Some specifications and processes are unique to our company. *This document can be viewed via download. *You can also download an introduction to our special circuit boards. ~Campaign Announcement~ We are currently running a limited-time discount campaign on design and initial costs for new customers only. ■Period: Until March 7, 2025 If you have a request to reduce initial costs, please take advantage of this opportunity! For more details, feel free to contact us through our company website.

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Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

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We solve your heat-related problems with Sanwa Electronics Circuit's heat dissipation substrates. In IoT devices such as 5G, the amount of heat generated by components is increasing, and due to higher density, fanless structures are required, necessitating effective heat dissipation in limited areas. LED lighting also generates more heat with increased brightness, making it essential to efficiently dissipate heat. Additionally, there is a demand for integration into limited spaces and for designs that accommodate various shapes. 【Products We Handle】 ■ Copper Inlay Substrates - By embedding copper coins into the substrate, efficient heat dissipation to the backside is possible. - Various diameters of copper coins are always in stock. ■ Metal Base Substrates - Single-sided boards made of aluminum or copper are available. - Our technology allows for the attachment of heat dissipation sheets to create double-sided boards. ■ Bendable Aluminum Substrates - Thin aluminum base substrates with a thickness of 0.40mm can be bent into shape. - The use of flexible resin and aluminum allows for the maintenance of bent shapes. ■ Thin Rigid Substrates - We can accommodate incredibly thin double-sided rigid substrates down to 0.04mm. *For more details, please feel free to contact us. Our sales representatives will provide you with an explanation right away.

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We would like to introduce our "Pattern Design (CAD Design) and Prototype Implementation." By conducting transmission line analysis, it is possible to implement countermeasures from the design stage. Additionally, "Prototype Implementation" allows for the direct output of the bill of materials from CAD, enabling the arrangement of components and other tasks in parallel with PCB design and manufacturing, thereby reducing the total lead time. 【CAD Software】 Zuken: CR-8000/Design Force, CR-5000/Board Designer, CR-5000/PWS Cadence: Allegro X Designer, OrCAD(R) PCB Designer Professional 【Analysis Software Used】 ■ SI Analysis - Siemens: Hyper Lynx SI - Cadence: Allegro PCB SI ■ EMI Countermeasures and PI Analysis - NEC: DEMITASNX *For more details, please refer to the PDF document or feel free to contact us.

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The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used only for several bends or during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between other substrates, all suitable for multiple bends. Please feel free to contact us when you need assistance. 【Specifications (Partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

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"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide them in small quantities. They are used in a wide variety of electronic devices and precision instruments, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided, double-sided ■ Board thickness: Base thickness 25μm, 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a substrate thickness of 0.04t, while still being rigid. This is suitable for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Functional Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate. This allows us to provide copper-thick hybrid circuit boards with continuous wiring. By forming unevenness through step formation in part of the circuit, we can enable height adjustment of mounted components and impart functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Silicone Embedded Substrate." By filling the spaces between the circuits where LED elements are mounted with silicone ink that has high reflectivity and weather resistance, we can suppress the degradation of the resin substrate. Additionally, by combining this with a step process, it is possible to form silicone ink on the circuit by changing the height of the circuit. [Applications] ■ Substrate boards for chip LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Silicone Printed Circuit Board." Our silicone ink has high weather resistance against heat and the recently noted UV-C, as well as a high reflectivity. Due to its tendency to bleed, it is necessary to maintain a larger clearance with the circuit. However, thanks to our unique technology, we can provide silicone ink-coated boards with a minimum clearance of 0.2mm from the edges of the mounted circuit. 【Applications】 ■ Heat-resistant, UV equipment-related, etc. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Solder Mask Plugging Board." By embedding solder mask ink into the through-hole sections, it is possible to cover them. This prevents flux and solder from wicking up to the surface during assembly. Please feel free to contact us if you have any inquiries. 【Applications】 ■ Device boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole section using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during assembly. Please feel free to contact us when you need assistance. 【Applications】 ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Narrow Pitch Edge Through-Hole Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter boards ■ Module boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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We would like to introduce our "Side Coated Substrate." Powder falling from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder from falling off the edges caused by friction with guide rails during substrate transport. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Our company is capable of providing printed circuit boards with special structures tailored to your requirements, thanks to our unique three-layer substrates and the bonding structures of materials and copper foil. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and the specific implementation needs of individual products. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or materials *For more details, please refer to the PDF document or feel free to contact us.

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"Fluororesin substrates" are printed circuit boards with low dielectric constant and low dielectric loss, exhibiting very good frequency characteristics. They can be tailored to high-frequency characteristics according to the application. Additionally, we can handle both domestic and overseas manufacturers. Please feel free to consult us when you need assistance. 【Material Types】 ■General FR-4 material ■PPE material ■LCP material ■Fluororesin material *For more details, please refer to the PDF document or feel free to contact us.

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The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and other factors. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, and other factors *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It enables the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Enables the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate." By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when needed. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." Its features include flexibility similar to that of a flexible circuit, while also being able to maintain a bent shape, which is a significant advantage. It also possesses thermal conductivity as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Possesses thermal conductivity *For more details, please refer to the PDF document or feel free to contact us.

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The "metal base substrate" is a high heat dissipation substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Product Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We provide substrates that enhance high current capacity and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards ・Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards ・Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. [Features] - Efficiently dissipates heat to the backside by incorporating copper coins - Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce the "multilayer boards" that we handle. We can accommodate layer counts from 4 layers to 36 layers, with board thicknesses ranging from thin boards to a maximum of 8mm. We also support micro-diameter vias and impedance control. Additionally, we offer various substrate materials tailored to different applications, and we can accommodate chip-on-hole configurations as well. 【Features】 ■ Layer count: Supports from 4 layers to 36 layers ■ Board thickness: Supports from thin boards to a maximum of 8mm ■ Supports micro-diameter vias ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole configurations *For more details, please refer to the PDF document or feel free to contact us.

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The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored to various applications that require heat dissipation, with aluminum thicknesses of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications that require heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

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We would like to introduce our "Edge Through-Hole PCB" that we handle. It enables high-density mounting, significantly contributing to the miniaturization of device boards and module boards, as well as improving the mounting density of motherboards. Additionally, we have established mass production technology for narrow-pitch edge through-holes. Please feel free to contact us when you need assistance. 【Features】 ■ Enables high-density mounting ■ Allows for miniaturization of device boards and module boards ■ Significantly contributes to improving the mounting density of motherboards *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce the "IVH substrate" that we handle. It supports layer counts from 4 layers to 20 layers, and the VIA structure can accommodate various interlayer connections. It also supports ultra-small diameter VIAs. Additionally, it is compatible with impedance control and chip-on-hole, and we can provide various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 layers to 20 layers ■ VIA structure: Accommodates various interlayer connections ■ Supports ultra-small diameter VIAs ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole *For more details, please refer to the PDF document or feel free to contact us.

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We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various interlayer connections through laser or drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and a variety of substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various interlayer connections through laser or drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Accommodates various substrate materials for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

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Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

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"Fluororesin substrate" is a printed circuit board made from materials such as fluororesin-impregnated glass cloth. It has a very low dielectric constant and dielectric loss tangent, providing excellent high-frequency characteristics, making it suitable for high-frequency equipment applications. We offer products tailored to needs such as thin plates and small sizes. [Features] ■ Excellent high-frequency characteristics (relative permittivity and dielectric loss tangent) ■ Capable of high-density wiring that supports thin plates, fine pattern formation, and small-diameter vias ■ Products tailored to your needs *For more details, please refer to the PDF document or feel free to contact us.

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"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports fine pattern formation and high-density wiring compatible with small-diameter vias *For more details, please refer to the PDF document or feel free to contact us.

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A "single-sided board" is a printed circuit board that has circuits formed on only one side of the substrate. Our company offers various types of boards tailored to different applications, including high-density single-sided boards that enhance miniaturization and component mounting density, as well as power boards that support high current. We can also accommodate single-sided boards that excel in soldering using special molds. Additionally, we respond to requests for small lot sizes, router-processed products, and short delivery times. 【Features】 ■ The substrate mainly uses FR-4, CEM-3, and FR-1 materials. ■ We can also accommodate single-sided boards that excel in soldering using special molds. ■ We respond to requests for small lot sizes, router-processed products, and short delivery times. *For more details, please refer to the PDF document or feel free to contact us.

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A "double-sided board" is a printed circuit board that forms circuits on both sides of the substrate and connects the circuits on both sides through plated through-holes. Our company offers various types of substrates tailored to applications, including high-density boards for miniaturization and increased component placement flexibility, thin boards, COH boards, edge-plated through-hole boards, and thick copper boards for high current applications. We can also accommodate requests for short delivery times, primarily using FR-4 and CEM-3 materials. 【Features】 - Mainly uses FR-4 and CEM-3 materials - Can accommodate requests for materials that support high heat resistance, etc. - Can respond to requests for short delivery times *For more details, please refer to the PDF materials or feel free to contact us.

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The "device substrate" becomes a single electronic component by mounting elements through bonding and other methods. As the miniaturization of electronic components has progressed in recent years, device substrates are also required to be smaller and thinner. Our company can accommodate substrate thicknesses starting from 0.04mm, and we respond broadly to our customers' needs. 【Our Specifications】 ■ Thickness: 0.04mm to 5.0mm ■ Hole diameter: φ0.1 and above ■ Materials: BT resin, FR-4 (including HF), G-10, high heat-resistant substrates *For more details, please refer to the PDF document or feel free to contact us.

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Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

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Sanwa Electronic Circuit Co., Ltd. was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently produced printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004 and have since embarked on a new journey as Sanwa Electronic Circuit Co., Ltd. This integration has consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory, resulting in a rich variety of product specifications and a flexible production system capable of accommodating all lot sizes. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

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