analysis(se) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
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analysis Product List

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Analysis of airflow around the cooling tower

Analysis of airflow around the cooling tower

Reproducing the thermal flow conditions around cooling towers with unknown characteristics and behaviors!

Thermal fluid equipment related to building facilities often has many unknown characteristics and behaviors. Cooling towers are one such example, but by precisely setting the structure, flow conditions, and thermal conditions of each cell of the cooling tower, it is possible to reproduce the thermal flow state quite accurately. In this analysis, we conducted a cooling tower thermal flow analysis considering external winds to examine the impact of multiple cooling towers with different specifications on the temperature distribution of the heated air released from each cell in relation to the airflow conditions around high-rise buildings. For more details, please download the catalog.

  • Scientific Calculation and Simulation Software
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Structural analysis of prismatic Li-ion batteries.

Structural analysis of prismatic Li-ion batteries.

Observation using optical microscopy and ultra-low acceleration FE-SEM! Detailed structural analysis and elemental analysis are possible.

By mechanically polishing commercially available rectangular Li-ion batteries and observing them with optical microscopy and ultra-low acceleration FE-SEM, detailed structural analysis and elemental analysis can be performed. The materials introduce the overall structure of the Li-ion battery and detailed structural observations of the Li-ion battery using SEM and ultra-low acceleration FE-SEM, accompanied by photographs. [Analysis Overview] ■ Overall structure of the Li-ion battery and SEM observation ■ Detailed structural observation of the Li-ion battery using ultra-low acceleration FE-SEM *For more details, please refer to the PDF materials or feel free to contact us.

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Analysis of the assembly joint of the component.

Analysis of the assembly joint of the component.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

  • Other analytical equipment

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Failure analysis of power devices

Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

  • Other analytical equipment

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AI Image Analysis OPTiM AI Camera Enterprise

AI Image Analysis OPTiM AI Camera Enterprise

Screen images/system configurations and various implementation examples as reference materials are included!

The document titled "OPTiM AI Camera Enterprise Proposal" introduces a service that uses AI and cameras to perform analysis as a substitute for the "human eye." It includes screen images/system configurations, detailed information on unlimited usage packs and optional features, as well as various case studies as reference materials. Please take a moment to read it. [Contents (excerpt)] ■ What is OPTiM AI Camera Enterprise ■ Detailed information by function (unlimited usage pack) ■ Detailed information by function (optional features) ■ Reference materials *For more details, please refer to the PDF document or feel free to contact us.

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Analysis of Damage to Agricultural Ponds during Earthquakes

Analysis of Damage to Agricultural Ponds during Earthquakes

Support for the safety assessment of agricultural ponds with a wide range of technologies!

In the seismic performance assessment of agricultural reservoirs, various analyses are required according to the methods established by each municipality. In applied technology, we conduct seismic performance assessments using traditional methods such as seepage flow analysis and sliding stability analysis (simplified Newmark method), in addition to the recently utilized detailed Newmark-D method. We offer proposals for analysis methods tailored to the characteristics of the target area and facilities, so please feel free to contact us.

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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

  • Other analytical equipment

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Narrowing down defective areas using the EBAC (Absorption Current) method.

Narrowing down defective areas using the EBAC (Absorption Current) method.

"SEM images" and "absorption current images (current sensing)" etc.! It identifies open defects in wiring and areas with high resistance defects.

Our company provides analysis and reliability evaluation services. In the "Narrowing Down Defective Areas Using the EBAC (Absorbed Current) Method," we identify open defects and high-resistance areas in wiring using the EBAC method with a nano-probe and high-sensitivity amplifier. By sensing the absorbed current as voltage, we can obtain a contrast based on the resistance voltage drop within the wiring, allowing us to detect high-resistance defects in TEGs such as via chains. [Analysis Examples Using the EBAC Method] ■ SEM Images ■ Overlaid Images ■ Absorbed Current Images (Current Sensing) ■ Absorbed Current Images (Voltage Sensing) *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Analysis of defects in overseas manufactured displays

Analysis of defects in overseas manufactured displays

Numerous achievements in defect analysis! Detailed analysis is possible, from confirming phenomena to inferring the mechanisms of defect occurrence.

Our company conducts "failure analysis of overseas manufactured displays." We can perform detailed analyses, from confirming phenomena to hypothesizing the failure mechanisms and narrowing down the production processes that caused the issues. We carry out lighting observations, panel disassembly, and optical microscope observations tailored to the failure symptoms. If it is necessary to narrow down the defective areas and conduct detailed analysis, we will propose appropriate methods. 【Examples of detailed analysis (partial)】 ■ Cross-sectional observation of wiring ■ Foreign matter analysis ■ Liquid crystal component analysis ■ Electrical characteristic measurement *Additional costs will be incurred. *For more details, please refer to the PDF document or feel free to contact us.

  • Other PCs and OA equipment

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Analysis of good LCD panels

Analysis of good LCD panels

Check the quality status of LCD components and products! We will analyze the structures of the LCD panel using our analytical methods and expertise!

At AITES, we conduct quality analysis of LCD components/products, confirming the quality status of products based on our expertise in LCD technology. The target panels include SEG-LCD, AM-LCD (a-Si TFT / LTPS TFT), OLED for automotive, monitors, mobile devices, and more. We perform quality analysis using our analytical methods on the various structures of liquid crystal panels. 【Analysis Details (Excerpt)】 <Reliability/Lighting Tests> ■ Classification - Reliability Testing - Lighting Inspection ■ Analytical Methods - Oven Drive Testing - Visual Inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Finite Element Analysis (FEA) application "LISA"

Finite Element Analysis (FEA) application "LISA"

User-friendly finite element analysis package for Windows!

"LISA" is a user-friendly finite element analysis (FEA) application equipped with features such as pre/post processing, solvers, and interfaces. It is designed for not only engineers and students who are beginners in finite element analysis but also for experienced users. It includes integrated features such as a modeler, a multi-threaded solver, and a graphical post-processor. [About Licensing] ■Business/Corporate Single User ■Business/Corporate Multiple Users (max 3) *For more details, please refer to the PDF materials or feel free to contact us.

  • Company：B7
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  • Other Software

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Power semiconductor analysis service

Power semiconductor analysis service

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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3D Skeleton Analysis with a Single Camera: "VisionPose Singe3D"

3D Skeleton Analysis with a Single Camera: "VisionPose Singe3D"

Compatible with Unity, iOS/iPadOS, and Android! A posture estimation AI engine that enables easy motion capture without markers.

"VisionPose Single3D" is an SDK (Software Development Kit) for a posture estimation AI engine that captures 3D coordinates with a single camera and detects human skeletal information in real-time. It allows for easy motion capture without the need for calibration. Utilizing technology that estimates 3D coordinates from 2D images, it detects up to 30 key points in 2D coordinates and up to 17 key points in 3D coordinates. The skeletal data obtained from the analysis can be used for commercial purposes as well as for research and development, regardless of the application or genre. ■ Features - Easily obtain 3D coordinates with a single camera - Compatible with Unity, iOS/iPadOS, and Android - No restrictions on usage, including commercial use - Comes standard with two immediately usable applications: └ Real-time skeletal visualization sample app "BodyAndColor" └ Video & still image analysis app "VP Analyzer" (excluding iOS/iPad and Android versions) - Additional learning is possible (additional learning is optional)

  • VR/AR

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