List of Other analytical equipment products
- classification:Other analytical equipment
1801~1845 item / All 2754 items
Inspectors observe without missing anything! Consistent whisker evaluation is possible from reliability testing to analysis.
- Other analytical equipment
EELS analysis for element identification allows for the comparison of the bonding states of substances!
- Other analytical equipment
"SEM images" and "absorption current images (current sensing)" etc.! It identifies open defects in wiring and areas with high resistance defects.
- Other analytical equipment
Adopts a large display and touch panel! Remote operation and file transfer via network are possible.
- Other analytical equipment
● WBGT value (indoor/outdoor) ● Temperature, black globe temperature, relative humidity, dew point temperature, wet bulb temperature ● WBGT value alarm function
- Other measuring instruments
- Other analytical equipment
A high-quality tool for measurement and civil engineering sites! A professional tool that delivers trust and proven results to help you!
- Work tools
- Other measuring instruments
- Other analytical equipment
Digital Tension Meter LX-1 Series: Accuracy: ±2% full scale. Can accommodate a diameter of up to 6.3 mm in very flexible cases.
- others
- Other analytical equipment
TIIS (Intrinsic Safety Explosion-Proof Standard) certified multi-gas detector. Compact, easy to handle, and highly reliable operation. The highest level of protection against dust and water.
- Gas leak device
- Safety and consumables
- Other analytical equipment

Announcement of the new release of the Gas Detector Solution Pack to easily and quickly enhance the safety of gas detectors.
Honeywell Japan, Inc. (Minato-ku, Tokyo, Representative Director: Yasushi Fujii) will launch a solution pack that allows for easy in-house bump testing and calibration of portable gas detectors to enhance safety. Regular in-house maintenance (bump testing and gas calibration) for portable gas detectors. Items included in the gas detector solution pack: Honeywell Japan portable gas detectors (select the required models from the following) ■ Multi-gas detectors - MicroClip X3 (flammable gases, carbon monoxide, hydrogen sulfide, oxygen, diffusion type, Japan explosion-proof compliant) - GasAlertMax XT2 (flammable gases, carbon monoxide, hydrogen sulfide, oxygen, pump suction type, Japan explosion-proof compliant) - BW Ultra, etc. (flammable gases, carbon monoxide, hydrogen sulfide, oxygen, VOCs, etc., pump suction type) ■ Single-gas detectors - BW Solo series (carbon monoxide, oxygen, carbon dioxide, ammonia, ozone, others) ■ Automatic calibrator IntelliDoX (supports bump testing and automatic calibration) ■ Calibration gases (we provide the optimal calibration gas based on the specified type of gas detector)
Achieves high processing accuracy and a wide processing area! Machining is also possible while reducing damage with cooling functions.
- Other analytical equipment
- Analysis and prediction system

Information about the CP processing device Arblade5000_Wide Area Cross-section Milling
We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the milling width can be expanded up to a maximum of 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the wide processing capability ■ Significantly expands the previously localized observation range ■ Equipped with a cooling temperature adjustment function to control temperature rise due to ion beam irradiation ■ The observable range is approximately 8mm
It is possible to perform 3D measurements of the surface irregularities of samples and surface shape measurements through transparent objects!
- Other analytical equipment
- Analysis and prediction system
Wide-range observation and measurement are also possible! Introducing contract analysis using a laser microscope.
- Other analytical equipment
- Analysis and prediction system

Optical film light transmission characteristics
At Aites Co., Ltd., we conduct "optical film analysis." Optical films used in smartphones and other devices have various functions depending on their structure and materials. We measured the light transmittance of privacy protection films at different angles and combined cross-sectional observation with Raman analysis to investigate the mechanism of function manifestation. By investigating the transmittance characteristics of privacy protection films using angle-variable spectrophotometry, we were able to analyze the mechanism of function manifestation through cross-sectional observation and Raman analysis. At Aites, we provide consistent evaluation and analysis from material properties to the mechanisms of function manifestation.
A system-type Schlieren that plays a significant role in research and development as well as inspection processes!
- Measurement and Inspection
- Other analytical equipment
A basic tool that enables high-precision visualization of "cross-sections"!
- Measurement and Inspection
- Other analytical equipment
The simple operating system of the conventional system-type Schlieren remains unchanged, achieving visualization of shield gas behavior!
- Measurement and Inspection
- Other analytical equipment
For authenticity verification and quality control of precious metals! Non-destructive, quick, and accurate measurement is possible.
- Other analytical equipment
- Other measuring instruments
- Non-destructive testing
A device equipped with a small module that contains a LoRaWAN communication chip and an AVR microcontroller on a single board.
- IoT
- Analysis and prediction system
- Other analytical equipment
De facto standard lighting for transparent body and reflective surface inspection
- Other analytical equipment
GC-FID for automatic continuous monitoring in the atmosphere, water, and soil.
- Analysis and prediction system
- Other analytical equipment
Online quantitative analysis and monitoring of sulfur compounds.
- Other analytical equipment
- Environmental Survey
Non-destructive depth analysis of thin films on the nm order is possible! We will also introduce analysis cases.
- Other analytical equipment
- Measurement and Analysis Equipment

Chemical Analysis Trusted Service
We would like to introduce our "Chemical Analysis - Trust Us Service." When conducting component analysis of foreign substances or stains on products, it can be challenging to determine whether organic analysis or inorganic analysis is more suitable, and which specific analysis within organic or inorganic is the most appropriate. We provide a comprehensive service for customers who are struggling with the selection of analysis methods. Since each analytical instrument is capable of measuring different targets, it is necessary to choose the method that fits the purpose based on the information available.
Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.
- Other analytical equipment
- Analysis and prediction system

Measurement of moisture absorption distortion
We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using a strain gauge. It was observed that the material expands when it absorbs moisture due to humidification, contracts when it dries due to dehumidification, and the strain returns to the state it was in before humidification. Regarding FR-1, it is presumed that the material did not return to its original state due to changes in its chemical structure caused by hydrolysis.
Observe the crystal structure with EBSD! Data can be obtained for each metal.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Visualize the features that appeared in the graph! You can check the distribution of crystal sizes and the orientation of crystal orientations.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
I will introduce an example of analysis using EBSD for pipes (austenite).
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal size distribution and residual stress.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of analyzing EBSD patterns (Kikuchi patterns) at gold wire bond joints.
- Electrical Equipment Testing
- Other analytical equipment

Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
You can achieve this much in Microsoft Excel without purchasing expensive software, using only spreadsheets, built-in functions, and analysis tools, without using macros!
- Scientific Calculation and Simulation Software
- Other analytical equipment
- Analysis and prediction system
Waterproof and pressure-resistant, usable even on the deep seabed! A compact thermometer with built-in memory and battery.
- Other measuring instruments
- Other analytical equipment
Gas detectors require regular maintenance.
- Other analytical equipment
Wireless + equipped with a mandown feature!
- Environmental Survey
- Other analytical equipment
Flammable gas, oxygen, carbon monoxide, hydrogen sulfide, and an additional fifth sensor can be selected! Equipped with wireless functionality!
- Environmental Survey
- Other analytical equipment
Using hyperspectral imaging enables even smarter food inspection.
- Other analytical equipment
A mobile measurement device that understands the surrounding environment in three dimensions using omnidirectional camera footage!
- Surveying
- Other analytical equipment
Equipped with VOC detection function! A multi-gas detector that supports detection of over 20 types of gases.
- Environmental Survey
- Other analytical equipment
3-year manufacturer warranty! Compact, lightweight, and easy-to-use multi-gas detector.
- Other analytical equipment
Please use this for the characteristic evaluation of lithium-ion batteries (gas emission analysis).
- Other analytical equipment
- Measurement and Inspection
- Batteries and Capacitors