Protect semiconductor chips from the external environment and transmit electrical signals to the substrate!
The "LSI Package Design/Evaluation Analysis Contract Service" is a service that goes beyond simply reporting evaluation analysis results. It utilizes LSI package design technology, simulation technology, and evaluation analysis technology to estimate the causes of failures and identify optimal structures based on simulations. Not only do we report evaluation analysis results, but we also carry out the estimation of failure causes. We will propose analyses aimed at "narrowing down the occurrence processes" and "structural optimization" based on the analysis results. 【Features】 ■ We propose suitable analysis methods and analysis steps from our company. ■ We carry out not only the reporting of evaluation analysis results but also the estimation of failure causes. ■ We propose analyses aimed at "narrowing down the occurrence processes" and "structural optimization" based on the analysis results. *For more details, please refer to the PDF materials or feel free to contact us.
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【Available Evaluation Analysis Items】 ■ Time Domain Reflectometry Measurement ■ Dimensional Measurement ■ Heated Surface Shape Measurement ■ Ultrasonic Depth Observation ■ Scanning Electron Microscope Observation ■ Energy Dispersive X-ray Analysis ■ X-ray Observation ■ Cross-sectional Observation ■ Pull Share Strength Measurement ■ Reliability Evaluation *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.
