Cross-sectional observation of substrate-mounted components.

In the methods for cross-section preparation in semiconductor structural observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanical polishing, which requires technical skill, is decreasing. However, it is still not to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is comparable to FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing methods according to the observation purpose and the composition and structure of the samples.

Here, we present examples of cross-sectional observations of various components mounted on a board known as an organic substrate. Inside various electronic devices around us, there are substrates equipped with electronic components. When observing the mounted substrates, you can see that numerous components are tightly soldered together. It is necessary to verify that these components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations.