Cross-sectional observation of substrate-mounted components.

Observations before and after reliability testing, as well as cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "Cross-sectional Observation of Various Mounted Components on Circuit Boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, it becomes clear that numerous components are densely soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations or cross-sectional examinations before and after reliability testing. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and problems not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point and a helpful resource for our customers in resolving issues. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other Software

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation quite challenging. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing examples of aluminum welding observations. Internal observations through X-ray fluoroscopy and CT scans provide clearer insights after cross-section preparation!

Here is a case study of the observation of aluminum spot welds. Internal observation using X-ray radiography revealed voids within the weld, and internal observation using X-ray CT confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching, we were able to observe the condition of the weld more clearly. 【Summary】 ■ Internal observation using X-ray radiography - Conducted non-destructive testing and X-ray radiographic observation - Voids were observed within the weld ■ Internal observation using X-ray CT - Conducted non-destructive testing and X-ray CT observation - Confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section tailored to the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing a case study on the cross-section preparation of large samples (65mm × 28mm) and the observation of their internal structures!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. 【Overview】 ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

• others

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within acceptable standards. The evaluation criteria after the solder durability test can be individually established based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• others

Three types of Pb-free soldered products are subjected to reliability tests! We will introduce the main objectives of each test and the results of cross-sectional observations.

We would like to introduce the cross-sectional observation of Pb-free solder after the reliability tests conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints, such as monitoring crack propagation, the TC test, which allows for cross-sectional observation after each cycle, is recommended. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Thank you very much for your continued patronage. We apologize for the inconvenience, but we will be closed during the following period. 【Closure Period】 From Wednesday, April 29, 2026, to Wednesday, May 6, 2026. Inquiries received during the closure period will be addressed sequentially starting from Thursday, May 7, 2026. We apologize for any inconvenience this may cause and appreciate your understanding. *Orders placed on various online shopping sites will still be accepted during the closure period. *Shipping of products and responses to inquiries will begin after Thursday, May 7, 2026.

At the entrance of a real estate company in Minato-ku, Tokyo, we have introduced the rental service "Majesta Fragrance" for commercial aroma diffusers, creating a fragrant atmosphere in the space. With the new start of the office relocation on April 1st, a high-quality and sophisticated scent suitable for this new beginning is spreading throughout the entrance. The "scent" that visitors first experience is one of the important elements that naturally conveys the company's impression and dignity. At Majesta Fragrance, we support the enhancement of corporate branding value through the production of scents tailored to the spatial concept. We also offer a free trial installation, so please experience the atmospheric effects that scent can bring. If you are interested in scent design, please feel free to contact us.

We will be exhibiting at the Thermal Tech 2026 event held at the Osaka Industrial Creation Center. At this exhibition, we will introduce our unique material technologies to engineers who face challenges in material selection for high-temperature environments, focusing on polyimide sheets suitable for high heat resistance and insulation applications. As attendance is by prior registration, please register through the related link before visiting, and we hope you will stop by our booth. We sincerely look forward to your visit. ◆ Our main exhibition content - PI Plates (Polyimide Laminates) - SUS/Polyimide Substrates ◆ Exhibition Details ◆ Exhibition Name: Thermal Tech 2026 (Pre-registration required) Pre-registration Method: Please register via the URL in the related link Date and Time: April 24, 2026 (Friday) 10:30 AM - 4:30 PM Venue: Osaka Industrial Creation Center, 3rd and 4th Floors (Reception on the 4th Floor)

From June 2025, measures against heat stroke in the workplace have become mandatory. Additionally, in December 2026, a "Support Package for Heat Wave Measures in Construction Work" was formulated, making heat stroke prevention during the summer a pressing issue, especially for those engaged in the construction industry. This time, we provide a collection of heat stroke prevention materials that can be utilized through Sysmet Co., Ltd.'s comprehensive weather platform, ZEROSAI X-AI. Examples of heat stroke prevention measures possible with ZEROSAI X-AI: - Cloud management of heat stroke information - Forecasting of the heat index (WBGT) tailored to the site with a mesh of 500m for up to 17 days ahead - Observation of the heat index (WBGT) in compliance with JIS standards using a black globe thermometer - Alerts for exceeding work standard values for the heat index (WBGT) via electronic bulletin boards, emails, and business chat tools like direct LINE WORKS We hope this will be useful at your sites as well.

Energy With Co., Ltd. (Headquarters: Chiyoda-ku, Tokyo, President: Yoshito Ishii, hereinafter referred to as Energy With) has acquired the naming rights for the Nabari City Youth Center located in Nabari City, Mie Prefecture, and began using the name "Energy With Hall" from April 1, 2026. Earlier this month, a new sign for Energy With was installed. About Energy With Hall Facility Overview Address: 1325-1 Matsuzakicho, Nabari City, Mie Prefecture, 518-0721 (Google Maps: https://maps.app.goo.gl/YLh6Dv6D91irLDx79) Phone Number: 0595-64-3478 Fax Number: 0595-64-8321 For more detailed facility information, please see below. Energy With Hall (Nabari City Youth Center (formerly ads Hall)) – Facility Information