Examples of semiconductor observation using mechanical polishing.

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors by mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those made by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metal microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Parts and Materials

Observations before and after reliability testing, as well as cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "Cross-sectional Observation of Various Mounted Components on Circuit Boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, it becomes clear that numerous components are densely soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations or cross-sectional examinations before and after reliability testing. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

Comprehensive analysis of the structure of MEMS components using a combination of non-destructive and destructive methods!

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray tomography to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We provide information on the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!

This document introduces methods for preparing cross-sections. When conducting observations, analyses, or evaluations, there may be a need to prepare cross-sections. By selecting or combining methods that are appropriate for the purpose, material, and structure, it is possible to obtain highly reliable results. In mechanical processing, methods such as "mechanical polishing" and "microtome" are included. In ion beam processing, main cross-section preparation methods such as "FIB" and "ion polisher (CP)" are also listed. We encourage you to read it. [Contents] ■ Main cross-section preparation methods ■ Processing conditions ■ Advantages & disadvantages *For more details, please refer to the PDF document or feel free to contact us.

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We will thoroughly evaluate and verify the LED from all angles.

■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical property measurement, optical property measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Techniques By filtering the visible light range, weak emissions from abnormal areas are detected without missing them.

• Garden lighting/lights (LED/solar)

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Isolation," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "electrically normal," "open, high resistance," etc. 【Initial Diagnosis Items for LED Packages】 ■ Electrical characteristic measurement ■ Appearance observation ■ Lens polishing/package internal optical observation ■ Lighting test (brightness distribution observation) *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

Japan is one of the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of major earthquakes occurring. Regarding the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake countermeasures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" For more details, please download the materials or contact us.

The "HA-T Series" is an energy-saving automatic door sensor that opens only for those who want to enter, whether on a busy street or in a narrow passageway. The automatic door opens simply by bringing your hand close, addressing hygiene concerns even in facilities used by a large number of people. Depending on the application and installation location, you can choose between "Non-vision Mount Type/HA-T401" and "Non-vision Built-in Type/HA-T520." 【Recommended for such places!】 ☑ Entrance facing a busy passageway ☑ Presence of counters or signs near the door ☑ Buildings facing narrow passageways ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors 【Features】 ● Adaptable to various door types with four detection spot settings ● Reduces unnecessary opening and closing to minimize power consumption, contributing to energy-saving effects ● Equipped with a light touch function, allowing the door to open and close simply by waving your hand, ensuring hygiene ● Can also be used as a wide detection range non-vision infrared sensor ◎ For more details, please download the materials or contact us.

Seven Corporation has begun research and development related to rust prevention, aiming to expand the functionality of the natural multifunctional aqueous solution "SEA'S 7." This research is being promoted as a collaborative study with the Industrial Technology Research Institute. In recent years, the manufacturing industry has been seeking technologies that balance environmental impact reduction and improved work safety, making rust prevention measures after cleaning a critical issue. This research includes corrosion evaluation using metal test pieces, measurement of weight changes, and durability tests in a circulating water environment, advancing the understanding of rust prevention mechanisms and performance evaluation. In the future, we aim to develop a next-generation SEA'S 7 that incorporates rust prevention functionality in addition to cleaning, disinfection, and deodorization, contributing to the efficiency of manufacturing processes and the reduction of environmental impact.

We are pleased to announce the launch of the "Vertical Aluminum Step Type F." The "Vertical Aluminum Step Type F" is a new type of aluminum ladder specifically designed for excavation sites, based on the existing "Vertical Aluminum Step." The vertical aluminum step is lightweight due to its aluminum construction, making it easy to transport and set up. Additionally, its modular design allows for flexible height combinations (with connecting parts of 0.7m, 1.0m, and 2.0m). The newly launched Type F retains the features of the previous model while providing even greater convenience. <Features of Type F> ■ The hook adjustment range of the fixed part has been expanded. It can be attached to structures ranging from 20mm to 200mm. ■ The length of the stand pipe can be adjusted. The stand pipe can be stored, making transportation and storage easier. <Release Date> January 5, 2026 <Specifications> - Standard set for Type F: 2.4m *Individual sales of the hanging fixed part and connecting parts are available. *Sales of the previous model (stand pipe fixed type) will also continue.

This time, we will explain the differences in roles between the "accounting system" and the "document management system," which are surprisingly not well known, as well as points that are often overlooked in legal compliance. ■ The difference between accounting systems and document management systems is their "scope of coverage." - Accounting System = Management of "money (numbers)" - Document Management System = Management of "evidence (documents)" ■ Documents that are often overlooked in accounting systems The accounting system primarily focuses on "accounting processes." - "Estimates" where no money movement occurs - "Delivery notes" and "purchase orders," which are intermediate points in transactions ⇒ There are cases where these are not saved or managed in the accounting system. This could be considered a deficiency under the Electronic Bookkeeping Act. ■ Supplementing the missing parts with an "independent system" While there are high-function ERP (Enterprise Resource Planning) systems that can manage everything from estimates to invoicing seamlessly, the reality is that the cost can be a significant barrier to implementation. Therefore, there is also the option of managing documents with an independent document management system like paperlogic. Paperlogic is currently offering a free trial. Please feel free to contact us.