Examples of semiconductor observation using mechanical polishing.

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors by mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those made by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metal microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Parts and Materials

Observations before and after reliability testing, as well as cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "Cross-sectional Observation of Various Mounted Components on Circuit Boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, it becomes clear that numerous components are densely soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations or cross-sectional examinations before and after reliability testing. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

Comprehensive analysis of the structure of MEMS components using a combination of non-destructive and destructive methods!

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray tomography to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We provide information on the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!

This document introduces methods for preparing cross-sections. When conducting observations, analyses, or evaluations, there may be a need to prepare cross-sections. By selecting or combining methods that are appropriate for the purpose, material, and structure, it is possible to obtain highly reliable results. In mechanical processing, methods such as "mechanical polishing" and "microtome" are included. In ion beam processing, main cross-section preparation methods such as "FIB" and "ion polisher (CP)" are also listed. We encourage you to read it. [Contents] ■ Main cross-section preparation methods ■ Processing conditions ■ Advantages & disadvantages *For more details, please refer to the PDF document or feel free to contact us.

• others

We will thoroughly evaluate and verify the LED from all angles.

■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical property measurement, optical property measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Techniques By filtering the visible light range, weak emissions from abnormal areas are detected without missing them.

• Garden lighting/lights (LED/solar)

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Isolation," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "electrically normal," "open, high resistance," etc. 【Initial Diagnosis Items for LED Packages】 ■ Electrical characteristic measurement ■ Appearance observation ■ Lens polishing/package internal optical observation ■ Lighting test (brightness distribution observation) *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

Kort Valuta Inc. (Head Office: Shibuya, Tokyo; CEO: Hideki Shibata) is pleased to announce that we will hold our next recruitment event, “Kort Valuta Night,” on November 26, 2025. This recurring event offers an opportunity for potential candidates to casually learn about our company culture and team atmosphere before applying. By lowering the barrier to entry and providing authentic insights from current employees, the event helps participants gain a more concrete sense of what it’s like to work at Kort Valuta. Since the event’s launch, approximately ten attendees have gone on to join the company in a range of roles — including marketing, customer support, and backend engineering.

The recognition that "the PDF invoice received from the other party must be stored as electronic data" is widely accepted. However, is that response truly sufficient for perfection? ◆ The "receipt" of electronic transactions includes issuance and delivery The Electronic Bookkeeping Act defines "electronic transactions" as the receipt of electromagnetic records related to transaction information. Breaking down the term "receipt" is key to understanding. - "Receipt": Receiving electronic data such as invoices and receipts from business partners - "Issuance": Issuing and delivering electronic data such as invoices and estimates to business partners When downloading a PDF from your company's accounting system and attaching it to an email, or concluding electronic contracts through a cloud-based invoicing service, both the receiving party and the issuing party (your company) are obligated to store the data. 【Utilizing paperlogic DESKTOP for document management】 - Elimination of manual input - Assurance of reliable searchability - Centralized management of receipt and issuance → paperlogic DESKTOP addresses the challenges of complex metadata management in the storage of these issued documents.

We are pleased to announce that Arsystem Co., Ltd. has received the "Health Management Excellent Corporation 2025" and "Next Bright 1000*" certifications under the Health Management Excellent Corporation Certification System promoted by the Ministry of Economy, Trade and Industry and the Japan Health Conference. *Certified corporations that applied for Bright 500, ranking from 501 to 1500. This year, we are also able to receive the new certification "Next Bright 1000," and we feel happy to have taken another step toward realizing our vision of being "the company that values its employees the most on Earth." Moving forward, we will continue to strive to create a "Love Al" environment where each of our valued employees can work healthily and energetically, both physically and mentally.

Recently, the calculation formula for electric floor heating in the "Energy Consumption Performance Calculation Program" has been significantly revised and was officially released in April. With this release, the introduction of electric floor heating in ZEH homes has become possible. For more details on heating conditions, please refer to the attached flyer. "Energy Consumption Performance Calculation Program" can be found here ▸ https://house.app.lowenergy.jp/#/ If you have any other questions or concerns, please feel free to contact our representative.

Kort Valuta Inc. (Headquarters: Shibuya-ku, Tokyo; President & CEO: Hideki Shibata; hereinafter “the Company”) announces that it has renewed the user interface (UI) of TwooCa, the Company’s digital employee ID with Visa payment functionality.