Examples of semiconductor observation using mechanical polishing.

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors by mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those made by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metal microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Parts and Materials

Observations before and after reliability testing, as well as cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "Cross-sectional Observation of Various Mounted Components on Circuit Boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, it becomes clear that numerous components are densely soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations or cross-sectional examinations before and after reliability testing. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

Comprehensive analysis of the structure of MEMS components using a combination of non-destructive and destructive methods!

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray tomography to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We provide information on the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!

This document introduces methods for preparing cross-sections. When conducting observations, analyses, or evaluations, there may be a need to prepare cross-sections. By selecting or combining methods that are appropriate for the purpose, material, and structure, it is possible to obtain highly reliable results. In mechanical processing, methods such as "mechanical polishing" and "microtome" are included. In ion beam processing, main cross-section preparation methods such as "FIB" and "ion polisher (CP)" are also listed. We encourage you to read it. [Contents] ■ Main cross-section preparation methods ■ Processing conditions ■ Advantages & disadvantages *For more details, please refer to the PDF document or feel free to contact us.

• others

We will thoroughly evaluate and verify the LED from all angles.

■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical property measurement, optical property measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Techniques By filtering the visible light range, weak emissions from abnormal areas are detected without missing them.

• Garden lighting/lights (LED/solar)

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Isolation," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "electrically normal," "open, high resistance," etc. 【Initial Diagnosis Items for LED Packages】 ■ Electrical characteristic measurement ■ Appearance observation ■ Lens polishing/package internal optical observation ■ Lighting test (brightness distribution observation) *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

Based on practical experience in support companies and business companies, SBS Marketing Co., Ltd. provides consulting services related to marketing, sales promotion, and customer acquisition mainly in the BtoB (business-to-business) sector. On September 23, 2025 (Tuesday), they published a page titled "Easier to Optimize the Allocation of Management Resources!? 'Product Portfolio Management (PPM)'". 'Product Portfolio Management' allows for the optimal allocation of management resources by evaluating one's business along two axes: "market growth potential" and "market share," and classifying it into four quadrants. The page explains the benefits that can be realized by utilizing it, the two axes and four quadrants that make it up, and the associated risks. (Page Overview: Excerpts) ■ What is 'Product Portfolio Management'? ■ What can be achieved through 'PPM'? ■ Components of 'PPM' (vertical and horizontal axes) ■ Components of 'PPM' (four quadrants) ■ Two risks associated with 'PPM' (DL content only) ▼ For more details, please visit this page. https://sbsmarketing.co.jp/blog/ppm-2025-09/

An article has been published about the case of introducing the expense reimbursement system "Rakuraku Seisan" at TSP Corporation. ~ In the case of TSP ~ Before the introduction, there were challenges such as dealing with the "paper" sent from various locations and the reliance on specific individuals for the tasks. After the introduction, the input and checking of FB data, which used to take 2 to 3 hours, can now be completed in just 5 minutes. Additionally, the mindset of the accounting department, which was previously reliant on manual entry, has changed. [Case Overview] ■ Challenges before introduction - Dealing with "paper" sent from various locations, reliance on specific individuals ■ Key points of introduction - A robust support system for setup and operation - Easy to start from a small scale both financially and functionally *For more details, please refer to the related links or feel free to contact us.

The facility operating the nurse call system has made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call. ○ Up to 5 transmitters can be registered with one receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

Full and empty management refers to the real-time display of parking availability and the management of efficient use of parking spaces. By utilizing Hotron's sensors, drivers can quickly discover available parking spaces, achieving efficient parking lot operations. ■ For large parking lots, the "floor management method" and "block management method," which focus on cost reduction, are recommended. Sensors are installed at regular intervals to count the number of vehicles passing through. This method offers the advantage of easy installation and low costs. 【Target Products】 - Vehicle Count Sensor CCS2 - Ultrasonic Sensor HM-UX2/UW2 ■ For smaller scale operations, the "space management method," which installs sensors in each parking space to display availability with high accuracy, is recommended. By ensuring accurate full and empty displays, it helps prevent unnecessary entry of new vehicles and enables safe parking lot operations. 【Target Products】 - Occupancy Detection Sensor HM-UX2/UW2 - Occupancy/Pass Detection Sensor HM-LC6 - Occupancy Detection Sensor HM-LC7/LC7-FLS - Occupancy/Pass Detection Sensor HM-S6 - Occupancy Detection Sensor HM-S8

Castem Co., Ltd. will exhibit at the "Monozukuri World Osaka - Mechanical Components Technology Exhibition" held at Intex Osaka from Wednesday, October 1 to Friday, October 3, 2025. We will showcase lost-wax precision casting and MIM (Metal Injection Molding) products, as well as introduce our new technology, mold-less casting "Digital Cast." In addition to our popular casting demonstrations, we will present case studies on solving issues related to metal parts. Please utilize our "Technical Consultation Booth" to learn about optimal manufacturing methods tailored to your needs, from ultra-small lots to mass production. 【Exhibition Overview】 Dates: October 1 (Wed) - October 3 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Intex Osaka (1-5-102 Nanko-Kita, Suminoe-ku, Osaka City, Osaka Prefecture) Exhibition Booth Number: Hall 6, B Hall 51-1 Pre-registration allows for smooth entry. It is convenient to register via the URL below before your visit. We sincerely look forward to your attendance. https://www.manufacturing-world.jp/osaka/ja-jp/register.html?code=1431877272389396-VEK