Examples of semiconductor observation using mechanical polishing.

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors by mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those made by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metal microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Parts and Materials

Observations before and after reliability testing, as well as cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "Cross-sectional Observation of Various Mounted Components on Circuit Boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, it becomes clear that numerous components are densely soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations or cross-sectional examinations before and after reliability testing. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

Comprehensive analysis of the structure of MEMS components using a combination of non-destructive and destructive methods!

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray tomography to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We provide information on the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!

This document introduces methods for preparing cross-sections. When conducting observations, analyses, or evaluations, there may be a need to prepare cross-sections. By selecting or combining methods that are appropriate for the purpose, material, and structure, it is possible to obtain highly reliable results. In mechanical processing, methods such as "mechanical polishing" and "microtome" are included. In ion beam processing, main cross-section preparation methods such as "FIB" and "ion polisher (CP)" are also listed. We encourage you to read it. [Contents] ■ Main cross-section preparation methods ■ Processing conditions ■ Advantages & disadvantages *For more details, please refer to the PDF document or feel free to contact us.

• others

We will thoroughly evaluate and verify the LED from all angles.

■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical property measurement, optical property measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Techniques By filtering the visible light range, weak emissions from abnormal areas are detected without missing them.

• Garden lighting/lights (LED/solar)

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Isolation," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "electrically normal," "open, high resistance," etc. 【Initial Diagnosis Items for LED Packages】 ■ Electrical characteristic measurement ■ Appearance observation ■ Lens polishing/package internal optical observation ■ Lighting test (brightness distribution observation) *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

[To the owners of parking lots and parking lot construction companies] "I am worried about the possibility of colliding with pedestrians when exiting the parking lot..." Among vehicle entrances to parking lots, stores, residences, and factories, those particularly facing sidewalks or roadways are expected to pose risks of dangerous incidents such as pedestrian collisions and vehicle-to-vehicle accidents. To alleviate such concerns, Hotron proposes a [Vehicle Exit Warning Sensor] that detects vehicle departures at various sites and alerts the surrounding area with LED lights and buzzers. The system consists of a simple configuration of "Sensor" + "Controller" + "Switching Power Supply (24V)" + "LED Rotating Light." *When using the exit warning system, we kindly ask that you arrange for the switching power supply (24V), LED rotating light, control panel, circuit breaker, etc. Since it can be retrofitted, it can also be used for existing parking lot entrances. [Contents Included] ○ Exit Warning System Configuration ○ Comparison Table of Exit Warning Sensors ○ Four Modes ○ Wide Range of Applications ○ Customer Feedback ○ Appearance Diagram / Specifications ◎ For more details, please contact us or download the catalog.

In recent times, there has been a growing interest in infection control measures and facility hygiene management. Our company offers non-contact sensor products that are recommended for commercial facilities, food factories, and nursing and caregiving facilities. 【Sensors for Automatic Doors】 ● Light Touch Sensor HA-T401 … When you wave your hand in front of the automatic door, the sensor detects the movement and opens or closes the door. This is recommended for making doors with touch switches non-contact. ● Hand Wave Sensor PF-R5, PF-U2, DHS-1 … Opens and closes the automatic door by waving your hand in front of the sensor. ● Foot Switch PF-01S/01D/03S/05 … Opens and closes the automatic door by placing your foot in the opening. 【Access Control System】 ● Face Recognition + Unmanned Temperature Measurement DS Series … Allows for face recognition along with mask detection and body temperature measurement simultaneously. ● Automatic Disinfectant Spray Dispenser PHW-03B … Automatically sprays disinfectant when you wave your hand in front of the sensor. 【Nursing and Care Sensors】 ● Infrared Bed Exit Sensor "Just Place It Pole-kun" … This bed exit sensor is installed next to the bed and notifies via nurse call when the subject enters the detection range. ◎ For more details, please download the catalog or contact us.

As the new year begins, I would like to extend my heartfelt congratulations on your continued prosperity. I sincerely appreciate your exceptional support throughout the year. This is the STJ Group (Santec Telecom Japan, STJ Rentec). Now, I am pleased to announce that we will be opening our "Transceiver & Smartphone Rental Shop" simultaneously at three locations nationwide on January 26 (Monday)! ■ List of Services to be Offered - Same-day pickup/return of rental equipment - Usage explanations and demonstrations of rental equipment - Wireless solution consultation desk - Mobile BPO service counter As a special promotion to celebrate the opening of the rental shop, we are currently running a special price campaign for rental equipment pickup at the shop! For more details, please contact us!

This is the Agricultural Division of Sumitomo Forestry Greenery Co., Ltd. In our division, we manufacture and sell potting soil for agricultural, horticultural, and greening purposes. In the future, we would like to regularly introduce our products through the Nōsan Girl Letter.

We would like to inform you about our participation in the IT Trend EXPO 2026 Spring. 《Exhibition Information》 With the concept of "New encounters will change the way we work tomorrow," one of the largest online exhibitions in the industry will be held. NTT TechnoCross will be exhibiting in the Human Resources Comprehensive category. We have prepared numerous discussions and sessions featuring special guests who are active on television, allowing even those who are usually busy to efficiently gather information on products and services related to IT and DX. Additionally, the first 10,000 participants will receive a 500 yen Amazon gift card. Please be sure to register early. 《Exhibition Overview》 March 3 (Tuesday) to March 7 (Saturday), 2026, online (free: pre-registration required) 《Participation Registration》 https://it.expo.it-trend.jp/key/opl7kgdj *Please register (free) by clicking "Receive Ticket / Proceed to Participation Registration" at the above URL.