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  4. Information about the CP processing device Arblade5000_Wide Area Cross-section Milling
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  • Sep 09, 2024
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Sep 09, 2024

Information about the CP processing device Arblade5000_Wide Area Cross-section Milling

アイテス アイテス
We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the milling width can be expanded up to a maximum of 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the wide processing capability ■ Significantly expands the previously localized observation range ■ Equipped with a cooling temperature adjustment function to control temperature rise due to ion beam irradiation ■ The observable range is approximately 8mm
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CP processing device Arblade5000_ wide area cross-section milling

Approximately double the width of processing is possible! This significantly expands the previously localized observation range.

We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the milling width can be expanded up to 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately twice the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise due to ion beam irradiation ■ The observable range is approximately 8mm *For more details, please download the PDF or feel free to contact us.

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Analysis of the assembly joint of the component.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

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Total support service for cross-section grinding, processing, observation, and analysis.

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Cross-section polishing (CP) method for cross-sectional observation service.

Achieves high processing accuracy and a wide processing area! Machining is also possible while reducing damage with cooling functions.

The CP method allows for the observation of cross-sections without damage from polishing, compared to mechanical polishing methods. Our triple ion milling device with cooling function achieves high processing precision and a wide processing area through ion beams irradiated from three directions. For materials sensitive to heat, processing can be done while reducing damage with the cooling function. 【Features】 - Processing width of approximately 4mm and processing depth of approximately 1mm, allowing for extensive processing. - High flatness in both hard and soft materials, enabling the production of cross-sections without physical damage. - Capable of producing cross-sections with good positional accuracy. - Processing can be done while cooling (cryogenic). *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to Cross-Section Processing and Observation Methods

Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a well-established and historically long-standing method for producing cross-sections, allowing for a wide range of cross-sectional fabrication. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples may be possible. *For more details, please refer to the PDF materials or feel free to contact us.

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Related catalog(5)

CP processing device Arblade5000_ wide area cross-section milling

CP processing device Arblade5000_ wide area cross-section milling

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Analysis of the assembly joint of the implementation components

Analysis of the assembly joint of the implementation components

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Cross-section polishing (CP) method for cross-sectional observation service.

Cross-section polishing (CP) method for cross-sectional observation service.

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Introduction to Cross-Section Processing and Observation Methods

Introduction to Cross-Section Processing and Observation Methods

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[Please introduce this to the management and general affairs department] Update on the expense reimbursement system implementation case! The input and verification work for FB data that used to take 2-3 hours is now completed in just 5 minutes!

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An article has been published about the case of introducing the expense reimbursement system "Rakuraku Seisan" at TSP Corporation. ~ In the case of TSP ~ Before the introduction, there were challenges such as dealing with the "paper" sent from various locations and the reliance on specific individuals for the tasks. After the introduction, the input and checking of FB data, which used to take 2 to 3 hours, can now be completed in just 5 minutes. Additionally, the mindset of the accounting department, which was previously reliant on manual entry, has changed. [Case Overview] ■ Challenges before introduction - Dealing with "paper" sent from various locations, reliance on specific individuals ■ Key points of introduction - A robust support system for setup and operation - Easy to start from a small scale both financially and functionally *For more details, please refer to the related links or feel free to contact us.

Sep 26, 2025

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【Wandering Prevention】 "Nurse Call Linked Wireless Series" Prevents tripping and disconnection caused by cords!

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The facility operating the nurse call system has made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call. ○ Up to 5 transmitters can be registered with one receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

Sep 26, 2025

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Full and Empty Management (Medium to Large Scale)

Parking lot occupancy management vehicle detection sensor | Hotron Co., Ltd.

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Full and empty management refers to the real-time display of parking availability and the management of efficient use of parking spaces. By utilizing Hotron's sensors, drivers can quickly discover available parking spaces, achieving efficient parking lot operations. ■ For large parking lots, the "floor management method" and "block management method," which focus on cost reduction, are recommended. Sensors are installed at regular intervals to count the number of vehicles passing through. This method offers the advantage of easy installation and low costs. 【Target Products】 - Vehicle Count Sensor CCS2 - Ultrasonic Sensor HM-UX2/UW2 ■ For smaller scale operations, the "space management method," which installs sensors in each parking space to display availability with high accuracy, is recommended. By ensuring accurate full and empty displays, it helps prevent unnecessary entry of new vehicles and enables safe parking lot operations. 【Target Products】 - Occupancy Detection Sensor HM-UX2/UW2 - Occupancy/Pass Detection Sensor HM-LC6 - Occupancy Detection Sensor HM-LC7/LC7-FLS - Occupancy/Pass Detection Sensor HM-S6 - Occupancy Detection Sensor HM-S8

Sep 26, 2025

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[Castem Co., Ltd.] "From the development stage to cast products" Announcement of participation in the Kansai Machine Element Technology Exhibition

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Castem Co., Ltd. will exhibit at the "Monozukuri World Osaka - Mechanical Components Technology Exhibition" held at Intex Osaka from Wednesday, October 1 to Friday, October 3, 2025. We will showcase lost-wax precision casting and MIM (Metal Injection Molding) products, as well as introduce our new technology, mold-less casting "Digital Cast." In addition to our popular casting demonstrations, we will present case studies on solving issues related to metal parts. Please utilize our "Technical Consultation Booth" to learn about optimal manufacturing methods tailored to your needs, from ultra-small lots to mass production. 【Exhibition Overview】 Dates: October 1 (Wed) - October 3 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Intex Osaka (1-5-102 Nanko-Kita, Suminoe-ku, Osaka City, Osaka Prefecture) Exhibition Booth Number: Hall 6, B Hall 51-1 Pre-registration allows for smooth entry. It is convenient to register via the URL below before your visit. We sincerely look forward to your attendance. https://www.manufacturing-world.jp/osaka/ja-jp/register.html?code=1431877272389396-VEK

Sep 26, 2025

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We will be exhibiting at interOpto2025 / Light and Laser Science and Technology Fair (Ultraviolet Fair).

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From November 11, 2025 (Tuesday), at Pacifico Yokohama, we will be exhibiting at interOpto2025 / Light and Laser Science and Technology Fair (organized by the Optical Industry Technology Promotion Association / Optronics Corporation) with a focus on: - UV-transmitting glass that can be molded - Diffusion glass that can uniformly diffuse incident light - A double-sided lens array that is molded without lamination 【About the Exhibition】 Event Name: interOpto2025 / Light and Laser Science and Technology Fair UV Fair Date: November 11 (Tuesday) to 13 (Thursday), 2025 Opening Hours: 10:00 AM to 5:00 PM Venue: Pacifico Yokohama Exhibition Hall C Booth Number: C-15 Organizer: Optical Industry Technology Promotion Association / Optronics Corporation Official Website: https://www.optronics.co.jp/interopto/ We invite everyone attending this exhibition to visit our booth "Gosuzumi Seiko Glass." We sincerely look forward to meeting you on-site.

Sep 26, 2025

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  • イプロスがリアル展示会を主催します! AI/DX 営業・マーケティング展 出展社募集中 リード数・商談数が止まらない!新しいリアル展示会を提供 会期 2026年3月24日(火)~25日(水) 会場 東京ビッグサイト東4ホール 出展概要資料を進呈!
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