Announcement of the introduction of Talos F200E

Improved resolution of TEM and STEM! Performance has been significantly enhanced, allowing EDS analysis with four detectors.

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, including the capability for EDS analysis with four detectors. Additionally, it is equipped with Drift Corrected Frame Integration (DCFI), which allows for the integration of multiple frames while correcting for drift. 【Specifications (excerpt)】 ■ Acceleration Voltage: 200kV, 80kV ■ TEM Information Limit: ≦0.11nm ■ STEM Resolution: ≦0.14nm ■ Drift Corrected Frame Integration (DCFI) ・Integrates multiple frames while correcting for drift *For more details, please download the PDF or feel free to contact us.

• Other analytical equipment

We will thoroughly evaluate and verify power devices from all angles.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

• Analysis and prediction system
• Other analytical equipment

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

• Other analytical equipment

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

• Other analytical equipment

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with lower energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of a pseudo-leak. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.

• Other analytical equipment

Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

Our company conducts "Backside Emission Analysis of SiC Devices." SiC is a power device that has less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In a case study of backside emission analysis of SiC MOSFETs, an overseas SiC MOSFET was subjected to ESD, creating a G-(D,S) leakage, and numerous emissions indicating the leakage points were detected through emission analysis. When the emission points were observed using TEM, damage to the SiO2 film and the SiC crystal was noted. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, we can produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Damage layer reduction through low acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Fully automated TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

The "Hotron Non-Contact Switch" allows you to open and close doors without directly touching door knobs or switches, making it hygienic! You can choose from two types: the "Hand Wave Sensor," which only requires you to wave your hand, and the "Foot Switch," which only requires you to place your foot in front of it. It reduces the risk of virus and bacteria transmission in places where hygiene is a concern, such as food factories, restaurants, hospitals, and nursing facilities. 【Features】 ○ Reduces the risk of virus transmission by allowing door operation without contact ○ A wide variety of options to choose from based on application and location ○ Ideal for places where hygiene is a priority, such as food factories and medical facilities ○ Prevents unnecessary detection due to the switch mechanism 【Product Lineup】 ■ Hand Wave Sensor Series ○ Exposed waterproof type, front, down, and side-facing type "PF-R5" ○ Exposed type, front-facing type "PF-R1" ○ Embedded type, front-facing type "PF-U2" ○ Exposed type, downward wide type "PF-R4" ■ Foot Switch Series ○ Slim type with wide opening, vertical beam type "PF-01S" ○ Slim type with wide opening, horizontal beam type "PF-03S" ○ Standard type, horizontal beam type "PF-05" ◎ For more details, please download the catalog or contact us.

In recent years, with the outbreak of infectious diseases, there has been a demand for products that cater to "contactless operation," and this trend has extended to environments where automatic doors were previously operated by touch switches. As the automation of doors and the non-contact operation of automatic doors become more widespread, do you have any of the following concerns? ☑ Although automatic doors have been installed, they remain open due to people crossing frequently in busy areas. ☑ Touch switches have been introduced to reduce unnecessary openings and closings, but hygiene is a concern. ☑ Touch switches require regular battery replacements since they are powered. The light beam touch sensor "HA-T401" opens and closes automatic doors without contact, and its compact detection range makes it suitable for narrow passages and busy areas, contributing to energy savings and infection control. 【Benefits of Implementation】 ○ Adaptable to various door types with four spot settings, ideal for busy roads and narrow passages. ○ Energy-saving effects with two setting modes that reduce unnecessary openings and closings of automatic doors. ○ Equipped with a light beam touch function, allowing doors to open and close simply by waving a hand, ensuring hygiene. ◎ For more details, please download the catalog or contact us.

An article has been published about the case of introducing the expense reimbursement system "Rakuraku Seisan" at TSP Corporation. ~ In the case of TSP ~ Before the introduction, there were challenges such as dealing with the "paper" sent from various locations and the reliance on specific individuals for the tasks. After the introduction, the input and checking of FB data, which used to take 2 to 3 hours, can now be completed in just 5 minutes. Additionally, the mindset of the accounting department, which was previously reliant on manual entry, has changed. [Case Overview] ■ Challenges before introduction - Dealing with "paper" sent from various locations, reliance on specific individuals ■ Key points of introduction - A robust support system for setup and operation - Easy to start from a small scale both financially and functionally *For more details, please refer to the related links or feel free to contact us.

Engineering Meetup Report is Now Available! We have published the event report from the AI Startup Engineering Meetup, held at Google for Startups Campus Tokyo. The event brought together four AI startups, where engineers and engineering leaders with backgrounds at major companies shared insights on: ◆Product development ◆Career journeys ◆AI-related initiatives Kort Valuta was represented by our Chief Operating Officer and a Backend Engineer, who shared perspectives on product development in the fintech industry and the unique development environment of a startup. The networking session that followed sparked meaningful conversations on technology and career development, creating valuable new connections among participants. At Kort Valuta, we will continue to value collaboration with the technology community while striving to build even better products. Read the event report: https://prtimes.jp/main/html/rd/p/000000126.000076589.html We're hiring! If you're interested in building the future of fintech with us, check out our careers page: https://recruit.kortvaluta.com/?utm_source=WEB&utm_medium=sns&utm_campaign=ipros

We have published a white paper titled "Half a Year of Procrastination vs. Full Operation in 3 Months - Conditions for Companies That Should Use Initial Setup Support," aimed at companies considering the introduction and operation of attendance management systems. This document clearly explains the key points of initial setup that are prone to difficulties during implementation, as well as the differences between handling it in-house and utilizing specialized support. If you want to smoothly launch an attendance management system, please take a look.