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  4. Announcement of the introduction of Talos F200E
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  • Jun 18, 2025
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Jun 18, 2025

Announcement of the introduction of Talos F200E

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Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has been improved, and performance has been significantly enhanced, allowing for EDS analysis with four detectors. Additionally, it is equipped with features such as drift-corrected frame integration (DCFI), which integrates multiple frames while correcting for drift.
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Announcement of the introduction of Talos F200E

Improved resolution of TEM and STEM! Performance has been significantly enhanced, allowing EDS analysis with four detectors.

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, including the capability for EDS analysis with four detectors. Additionally, it is equipped with Drift Corrected Frame Integration (DCFI), which allows for the integration of multiple frames while correcting for drift. 【Specifications (excerpt)】 ■ Acceleration Voltage: 200kV, 80kV ■ TEM Information Limit: ≦0.11nm ■ STEM Resolution: ≦0.14nm ■ Drift Corrected Frame Integration (DCFI) ・Integrates multiple frames while correcting for drift *For more details, please download the PDF or feel free to contact us.

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Total solution service for power devices

We will thoroughly evaluate and verify power devices from all angles.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

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Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

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Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

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OBIRCH analysis of SiC devices using short-wavelength lasers.

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with lower energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of a pseudo-leak. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.

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Backside light emission analysis of SiC devices

Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

Our company conducts "Backside Emission Analysis of SiC Devices." SiC is a power device that has less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In a case study of backside emission analysis of SiC MOSFETs, an overseas SiC MOSFET was subjected to ESD, creating a G-(D,S) leakage, and numerous emissions indicating the leakage points were detected through emission analysis. When the emission points were observed using TEM, damage to the SiO2 film and the SiC crystal was noted. *For more details, please refer to the PDF document or feel free to contact us.

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Power semiconductor analysis service

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

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Announcement of the Introduction of FIB-SEM Helios 5 UC

Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, we can produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Damage layer reduction through low acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Fully automated TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(8)

Announcement of the introduction of Talos F200E

Announcement of the introduction of Talos F200E

OTHER
  • E-book viewing
  • Catalog download

Contact this catalog

Total solution service for power devices.

Total solution service for power devices.

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Failure analysis of power devices

Failure analysis of power devices

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

OBIRCH analysis of SiC devices using short-wavelength lasers.

OBIRCH analysis of SiC devices using short-wavelength lasers.

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Backside light emission analysis of SiC devices

Backside light emission analysis of SiC devices

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Power semiconductor analysis services

Power semiconductor analysis services

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Announcement of the introduction of FIB-SEM Helios 5 UC

Announcement of the introduction of FIB-SEM Helios 5 UC

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

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Truck berth vehicle detection

It's not too late to address the "2024 Problem." Why not immediately reduce drivers' waiting times?

  • NEW
  • PRODUCT

Are you making progress on measures for the "2024 Problem"? The management of drivers' working hours is becoming stricter, and in the logistics field, reducing "waiting time for loading" has become an urgent issue. To address this challenge, our company, Hotron, proposes the "Vehicle Detection Ultrasonic Sensor 'HM-UX2'," which instantly grasps the availability of loading bays. The 'HM-UX2' contributes to the resolution of waiting times by accurately understanding the availability status, reducing unnecessary waiting and queuing, and shortening waiting times, thereby alleviating the burden on drivers! By replacing the "eyes" of your loading bay management with this high-precision sensor, why not start taking measures against the "2024 Problem"? Take a look at the product features: "Can it accurately detect availability?" "Can we really use it in our company?" "I just want to know the cost, even if it's an estimate." If you have any questions or requests, please feel free to consult us first.

Aug 08, 2025

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Regarding the response during the summer vacation period.

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  • COMPANY

We sincerely apologize for the inconvenience, but we will be closed for summer vacation during the following period. Closure period: August 9 (Saturday) to August 17 (Sunday), 2025 Inquiries received during this period will be addressed sequentially starting from August 18 (Monday). We appreciate your understanding and cooperation.

Aug 08, 2025

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High-Performance Materials Week [Osaka] 13th High-Performance Plastics Exhibition Thank You for Attending

  • NEW
  • COMPANY

Thank you very much for visiting our booth at the "High-Performance Materials Week [Osaka] 13th High-Performance Plastics Exhibition." Thanks to you, we had many visitors and were able to conclude the event successfully. In addition to the "PPLB-445" displayed on the day, we have a variety of products available. For those who were unable to measure samples at the venue, we offer a trial measurement service. Furthermore, for those who would like to know more about our products and services, we also accept online meetings. We welcome inquiries from those who attended as well as those who could not make it this time due to scheduling conflicts. Please feel free to contact us.

Aug 08, 2025

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【New Product Information】Wireless display "NW2991-JP" with long battery life and low power consumption released.

  • NEW
  • PRODUCT

Aioi System is pleased to announce the release of the low-power wireless display "NW2991-JP," which achieves long battery life. This product supports 920MHz band wireless communication and can be operated in conjunction with wired displays. It can be easily integrated into existing systems by simply adding a master unit. With a high-speed response time of under one second and a variety of display functions for text and barcodes, it supports a wide range of applications. ▼ For more details, please see the press release linked below ▼ ■ Main Features - Maintenance-free design with a battery life of one year (low power consumption) - Compatible with mixed operation with wired displays - High-speed response (under one second) and diverse display formats - Stable communication in the 920MHz band ■ You can see the actual product at the exhibition This product will be displayed at the TOPPAN booth during the International Logistics Comprehensive Exhibition 2025, 4th INNOVATION EXPO. We invite you to visit the venue, see the actual product, and experience its performance. Dates: September 10 (Wed) - 12 (Fri), 2025 Venue: Tokyo Big Sight (Halls 4-8) Booth No: 5-907 (TOPPAN booth) Exhibition official website ▶ linked below We sincerely look forward to your visit.

Aug 08, 2025

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Measurement of cosmetics

Thank you for visiting the Monozukuri World (Measurement, Inspection, and Sensor Exhibition).

  • NEW
  • COMPANY

Thank you very much for visiting our booth at the "Monozukuri World (Measurement, Inspection, and Sensor Exhibition) 2025." Thanks to you, we had many visitors, and the event concluded successfully. In addition to the "PPLB-445" showcased on the day, we have a variety of products available. For those who were unable to conduct sample measurements at the venue, we offer a trial measurement service. Furthermore, for those who would like to learn more about our products and services, we also accept online meetings. We welcome inquiries from those who attended, as well as those who were unable to come this time due to scheduling conflicts. Please feel free to reach out to us.

Aug 08, 2025

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  • イプロスがリアル展示会を主催します! AI/DX 営業・マーケティング展 出展社募集中 リード数・商談数が止まらない!新しいリアル展示会を提供 会期 2026年3月24日(火)~25日(水) 会場 東京ビッグサイト東4ホール 出展概要資料を進呈!
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