Announcement of the introduction of Talos F200E

Improved resolution of TEM and STEM! Performance has been significantly enhanced, allowing EDS analysis with four detectors.

Our company will introduce the FEI "Talos F200E" transmission electron microscope system. Compared to conventional models, the resolution for TEM and STEM has improved, and performance has been significantly enhanced, including the capability for EDS analysis with four detectors. Additionally, it is equipped with Drift Corrected Frame Integration (DCFI), which allows for the integration of multiple frames while correcting for drift. 【Specifications (excerpt)】 ■ Acceleration Voltage: 200kV, 80kV ■ TEM Information Limit: ≦0.11nm ■ STEM Resolution: ≦0.14nm ■ Drift Corrected Frame Integration (DCFI) ・Integrates multiple frames while correcting for drift *For more details, please download the PDF or feel free to contact us.

• Other analytical equipment

We will thoroughly evaluate and verify power devices from all angles.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

• Analysis and prediction system
• Other analytical equipment

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

• Other analytical equipment

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

• Other analytical equipment

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with lower energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of a pseudo-leak. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.

• Other analytical equipment

Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

Our company conducts "Backside Emission Analysis of SiC Devices." SiC is a power device that has less energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In a case study of backside emission analysis of SiC MOSFETs, an overseas SiC MOSFET was subjected to ESD, creating a G-(D,S) leakage, and numerous emissions indicating the leakage points were detected through emission analysis. When the emission points were observed using TEM, damage to the SiO2 film and the SiC crystal was noted. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, we can produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Damage layer reduction through low acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Fully automated TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

[To the owners of parking lots and parking lot construction companies] "I am worried about the possibility of colliding with pedestrians when exiting the parking lot..." Among vehicle entrances to parking lots, stores, residences, and factories, those particularly facing sidewalks or roadways are expected to pose risks of dangerous incidents such as pedestrian collisions and vehicle-to-vehicle accidents. To alleviate such concerns, Hotron proposes a [Vehicle Exit Warning Sensor] that detects vehicle departures at various sites and alerts the surrounding area with LED lights and buzzers. The system consists of a simple configuration of "Sensor" + "Controller" + "Switching Power Supply (24V)" + "LED Rotating Light." *When using the exit warning system, we kindly ask that you arrange for the switching power supply (24V), LED rotating light, control panel, circuit breaker, etc. Since it can be retrofitted, it can also be used for existing parking lot entrances. [Contents Included] ○ Exit Warning System Configuration ○ Comparison Table of Exit Warning Sensors ○ Four Modes ○ Wide Range of Applications ○ Customer Feedback ○ Appearance Diagram / Specifications ◎ For more details, please contact us or download the catalog.

Due to the mandatory implementation of heatstroke prevention measures in the workplace, we have seen an increase in inquiries regarding heatstroke at our company. Among these, we have received many requests to "measure the heat index (WBGT) in accordance with JIS standards." To conclude, the observation of the heat index (WBGT) in accordance with the Japanese Industrial Standards JIS Z 8504 can be achieved by utilizing the black globe thermometer from the Natural Disaster Prevention System ZEROSAI. - Real-time heat index (WBGT) management in the cloud, combined with pinpoint weather forecasting - Notifications via electronic display boards and business chat (LINEWORKS, direct, Wowtalk, Microsoft Teams) when threshold values are exceeded - Centralized management of various observation equipment information such as wind speed, rainfall, water level, noise, and vibration - API integration available *For more details, please visit our website or feel free to contact us.

We would like to inform you that, in order to further strengthen and enhance our sales and service operations, there will be changes to our Nagoya Sales Office as of April 1st, as detailed below. ■ Relocation of Nagoya Sales Office 【New Address】 〒460-0003 6th Floor, Sando Building, 1-7-27 Nishiki, Naka Ward, Nagoya City, Aichi Prefecture TEL: 052-212-6520 / FAX: 052-212-6521 *Please note that the TEL and FAX numbers will also change. Taking this opportunity, all of our staff will continue to make even greater efforts. Please feel free to contact us.

To combat heatstroke during the summer, Sysmet Co., Ltd. has started providing black globe thermometers again this year. Differences from conventional black globe thermometers: - 17-day ahead heat index (WBGT) forecast with a 500m mesh - 1-minute updates of heat index (WBGT) measurements compliant with JIS standards - Email alerts when threshold values are exceeded, along with alarm devices (electronic display boards, rotating lights) and notifications via direct LINE WORKS, etc.

We will introduce the implementation results of the sensor technology developed by the Hotron Group, which has been cultivated over more than half a century, through customer case studies. In addition to automatic door sensors, we also offer a wide range of vehicle detection sensors and nursing/care sensors. We have many implementation examples available, so please take a look at the case study page.