[Data] Cross-section production method

At Aites Co., Ltd., we conduct "optical film analysis." Optical films used in smartphones and other devices have various functions depending on their structure and materials. We measured the light transmittance of privacy protection films at different angles and combined cross-sectional observation with Raman analysis to investigate the mechanism of function manifestation. By investigating the transmittance characteristics of privacy protection films using angle-variable spectrophotometry, we were able to analyze the mechanism of function manifestation through cross-sectional observation and Raman analysis. At Aites, we provide consistent evaluation and analysis from material properties to the mechanisms of function manifestation.

In the methods for cross-section preparation in semiconductor structural observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanical polishing, which requires technical skill, is decreasing. However, it is still not to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is comparable to FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing methods according to the observation purpose and the composition and structure of the samples.