【MiniLab-125】 Multi-target sputtering system (compatible with Φ8") equipped with a 1000℃ heater stage (SiC coating)! Compact size!

Multifunctional Multi-Sputtering Device (Compatible with Φ8inch Substrates)
- Simultaneous deposition of three components + single component Pulse DC sputtering
- Flexible arrangement of RF500W and DC850W power supplies to three component cathodes (Source1, 2, 3)
- Equipped with a 5KW Pulse DC power supply → used with dedicated cathode (4)
- Substrate heating stage Max 800℃ (SiC coated heater can reach Max 1000℃)
- MFC x 3 systems (Ar, O2, N2) for reactive sputtering
- Main chamber RIE etching stage RF300W
- LL chamber <30W low power controlled soft etching
- Unique "Soft-Etching" technology reduces substrate damage through substrate bias
- Touch panel or Windows PC operation: All operations can be performed via touch panel/PC without dispersion.
- Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm
- Multi-chamber type can also be manufactured.
● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
![Multisource Simultaneous Sputtering Device [MiniLab-S125]](https://image.www.ipros.com/public/news/image/1/2d3/12548/IPROS06137231868342339221.jpeg?w=280&h=280)

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Due to its modular design, it is possible to assemble a dedicated machine tailored to your desired film type and process. A flexible, compact experimental device that can accommodate various applications.