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Particles in photoresist solution and SOG can be measured from 0.1 μm.
High counting efficiency 0 Measurement of particle count in 0.1μm photoresist solution and SOG Robust support system with domestic manufacturing and maintenance!
Particles of 0.15μm can be measured from photoresist solutions and SOG, etc.
Liquid Particle Counter KS-41A Measures particles from 0.15μm in photoresist solutions and SOG Robust support system with domestic manufacturing and maintenance
Electrode formation with a three-dimensional structure requires at least electroplating method 3D photolithography technology.
3D photolithography is a three-dimensional patterning technology suitable for the formation of electrode structures. In next-generation core technologies, MENS devices require techniques to process complex and delicate patterns in three-dimensional structures. Our company offers 3D photolithography technology that utilizes an electroplating method, where the entire substrate is immersed in a liquid phase to deposit a metal film.
High aspect ratio resist
Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. We have achieved the ability to give height to flat resist patterns! ■□■ Features ■□■ ■ The resist pattern is used as a protective film to shield metal thin films and other materials from etching solutions during the etching process. ■ To realize high-precision metal patterns, high-resolution photoresists with excellent adhesion and melting properties are being researched and developed. For more details, please download the catalog or contact us.
Aspect ratio 1:5 processing results! Can be used in a wide range of fields!
Our company is capable of processing using "high aspect ratio resist" with a high aspect ratio between pattern line width and film thickness (height). We have a proven track record of processing with an aspect ratio of 1:5. With this technology, the resist pattern becomes not just a protective film but a fine three-dimensional structure, expanding its range of applications. 【Features】 ■ Proven track record of processing with an aspect ratio of 1:5 ■ Wide range of applications *For more details, please refer to the catalog or feel free to contact us.
Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to increased design freedom, and since a coverlay is not required, significant thinning and weight reduction of the entire substrate is possible. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High bendability with no cracks occurring even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly attached ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
Negative-type anion
Since it is an anionic electrophoretic negative-type photoresist, the developer and stripping solution will be alkaline. The developer and stripping solution are not specialized products.
