Low elasticity makes bending of FPC easy. Contributes to thinner, lighter designs and increased design flexibility.
The "Photo-sensitive Coverlay (PICC)" is a solder resist for flexible substrates that excels in flexibility, insulation, and manufacturability. With low elasticity, it allows the substrate to be easily bent, contributing to increased design freedom, and since a coverlay is not required, significant thinning and weight reduction of the entire substrate is possible. 【Features】 ■ Suitable for high-density mounting with a minimum opening size of 80–150μm ■ High bendability with no cracks occurring even after over 10 million sliding tests (R=5mm) ■ Can cover the entire outer surface with only PICC, contributing to process shortening and simplification ■ EMI shielding can be directly attached ■ High insulation reliability, compatible with line & space of 25μm/25μm *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.
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basic information
[Image of Utilizing Photosensitive Coverlay (PICC)] Multifunctionalization of Wire Harnesses Flexible Substrate for Mobile Device Antenna Cables Lightweight Multifunctionalization of 5G/6G Communication and CASE Electronic Boards Wearable Devices and Smartphones Applications in Healthcare and Medical Devices *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.
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For more details, please refer to the materials. Feel free to contact us as well.
Detailed information
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Achieving high-density implementation, lightweight, thin design, and free design.
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High flexibility that does not develop cracks even after more than 10 million bending tests (R = 5mm).
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When technologies, materials, and components that are praised in the global electronics industry are born, and when products and systems that are admired by people around the world come into existence, Tamura is there. Please look forward to Tamura's future as it aims to be a one-and-only company that supports the development of an information society and contributes to the preservation of the global environment.
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