Inspection Equipment Product List and Ranking from 230 Manufacturers, Suppliers and Companies | IPROS

Last Updated: Aggregation Period:Aug 05, 2026~Sep 01, 2026
This ranking is based on the number of page views on our site.

Inspection Equipment Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Aug 05, 2026~Sep 01, 2026
This ranking is based on the number of page views on our site.

  1. コスモンド 東京オフィス/四谷ショールーム Tokyo//Interior Design
  2. エクセレント Saitama//Interior construction business
  3. クラボウ(倉敷紡績株式会社) Osaka//Building materials, supplies and fixtures manufacturers
  4. 4 イシダ・エスエー Kanagawa//Building materials, supplies and fixtures manufacturers
  5. 5 クマヒラ 本社 Tokyo//Other construction industries

Inspection Equipment Product ranking

Last Updated: Aggregation Period:Aug 05, 2026~Sep 01, 2026
This ranking is based on the number of page views on our site.

  1. Capsule Bed "SQUARE Series" コスモンド 東京オフィス/四谷ショールーム
  2. Capsule Bed "SQUARE" コスモンド 東京オフィス/四谷ショールーム
  3. Information Multiscale "iz-7000" イシダ・エスエー
  4. 4 Capsule Bed "SRIPPLE" エクセレント
  5. 5 Flame-retardant material "Brevano" クラボウ(倉敷紡績株式会社)

Inspection Equipment Product List

331~360 item / All 538 items

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X-ray computed tomography device 'TXR-C3R150PS-01'

Compact and lightweight with easy operation! Equipped with a three-tube X-ray source, suitable for industrial tomography inspection.

The "TXR-C3R150PS-01" is an industrial tomography inspection device that uses a cold cathode three-tube X-ray source, a dedicated PC, and a high-precision detector. It allows for immediate imaging without preheating, is compact and lightweight for easy mobility. With three-tube imaging, you can view composite images of flaws at different depths. 【Features】 ■ Immediate imaging without preheating ■ Compact and lightweight for easy mobility ■ High mobility ■ Easy operation ■ Safe and energy-efficient *For more details, please refer to the PDF materials or feel free to contact us.

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Wireless Mini X-ray Inspection Device 'TXR-C1R150P-07W'

Achieving high mobility! A wireless compact X-ray inspection device that significantly reduces inspection costs.

The "TXR-C1R150P-07W" is a wireless controlled X-ray inspection device equipped with a cold cathode X-ray tube. It requires no preheating, is energy-efficient, and achieves compactness and lightweight for high mobility. It allows for efficient energy savings and significant reductions in inspection costs, making it suitable for regular inspections of high-voltage cable ends. 【Features】 ■ No preheating required and energy-efficient ■ Compact and lightweight for high mobility ■ Enables aerial inspections using drones ■ Suitable for regular inspections of high-voltage cable ends ■ Allows for efficient energy savings and significant reductions in inspection costs *For more details, please refer to the PDF document or feel free to contact us.

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Laser Ultrasonic Visualization Inspection Device 'LUVI-SC1'

Real-time ultrasound for defect detection. High-speed scanning with complete non-contact capability allows for fine inspection.

The "LUVI-SC1" is a microscope-type non-destructive testing device that inspects fine latent defects in electronic components and precision mechanical parts without causing damage. It emits a laser downward from a laser oscillator to scan the surface of the test object. The ultrasonic propagation signal waveforms excited at each scan point are detected by a receiving sensor and recorded. The recorded data is reconstructed to display and analyze ultrasonic video images, allowing for the detection and evaluation of fine defects. 【Features】 ■ You can view the propagation of ultrasonic waves in video format. ■ Easily discover inherent defects and abnormalities in the test object. ■ The inspection unit features a touch panel. ■ Laser output, focus adjustment, and internal temperature monitoring status are displayed as icons. ■ Easy to operate. *For more details, please refer to the PDF document or feel free to contact us.

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Laser Ultrasonic Visualization Inspection Device "LUVI-ST4"

We conduct non-destructive testing for inherent defects in automobiles, aircraft, industrial plants, shipbuilding, steel, electronic components, and more.

The "LUVI-ST4" is a laser ultrasonic visualization inspection device that can visualize ultrasound with a laser. Just like a spring bubbling up from the surface of water, ripples are generated from areas with defects, allowing for the detection of scratches and cracks through imaging. With non-contact laser scanning, it can visualize ultrasound in any complex-shaped object and detect defects. Additionally, there is no need to adjust the laser's irradiation angle or focal length, making measurements easy. 【Features】 ■ Immediate observation and defect detection on-site ■ Visualization of ultrasound transmitted through any complex-shaped object ■ Wide area ■ Rapid ■ Easy to measure *For more details, please refer to the PDF document or feel free to contact us.

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Wireless Mini X-ray Source 'TXR-C1R130P-04W'

Achieving the imaging of high-voltage power lines and wire ends, allowing for real-time observation of inspection results.

The "TXR-C1R130P-04W" is a wireless-controlled X-ray inspection device equipped with a cold cathode X-ray tube. Safety is enhanced through interlocks. Vibration resistance is strengthened by reinforcing the corners. Additionally, it enables remote-controlled imaging in combination with drones, allowing real-time observation of inspection results. 【Features】 ■ Realization of imaging for high-voltage wires and wire ends ■ External synchronization ■ Wireless control ■ Compact and lightweight ■ High mobility *For more details, please refer to the PDF document or feel free to contact us.

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XY stage usage examples: 15 cases, case presentation.

This is an example of a positioning stage using a manual XY stage, as well as measuring devices and inspection jigs.

We will introduce examples of solving "troubles" related to positioning stages using mainly manual XY stages, as well as measurement devices and inspection jigs. [Contents] - Flatness inspection jig - Height inspection jig - Surface runout measurement jig - Appearance shape inspection device - Substrate measurement device *For more details, please download the PDF or feel free to contact us.

  • Other analytical equipment
  • Inspection Equipment

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X-ray fluoroscopy and CT examination device 'Observation case of inductive coil'

[Comparison images available] Internal shape abnormalities can also be observed non-destructively! We compared X-ray CT and cross-sectional SEM.

We will introduce a case of observing an inductor coil (orthogonal CT observation + cross-sectional observation). The inside of an inductor coil that experienced operational failure was observed using X-ray CT. It was confirmed that abnormal shapes occurred in various places of the spirally formed wiring. With X-ray CT observation, it is possible to observe in three dimensions, making the condition of the abnormal areas clear. Additionally, cross-sections including the abnormal areas were created through mechanical polishing, and observations were conducted using SEM. *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis and prediction system
  • Inspection Equipment

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X-ray fluoroscopy and CT examination device: Observation case of a microphone

[Video Available] X-ray fluoroscopy observation & orthogonal CT observation! We will introduce observation cases of microphones.

We will introduce a case of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounted substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphone] ■ X-ray Fluoroscopic Image - Wire bonding and wiring patterns of the mounted substrate can be observed. ■ Orthogonal CT Image - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

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[X-ray fluoroscopy and CT examination equipment] Examples of combined use of transmission observation and image processing technology.

Detecting differences between normal product images and defective product images through image processing! Introducing a case study of the combined use of transmission observation and image processing technology.

We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmitted X-ray images of normal substrates and defective substrates, the wiring was intricately laid out, making it difficult to identify abnormalities at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon checking the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

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X-ray fluoroscopy and CT scanner: Device appearance and main specifications

Introduction of YXLON's multi-focus Cheetah EVO! It can be used for various applications, including electronic components.

X-ray observation is a method of non-destructive testing and is the first inspection performed for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented substrates and electronic parts. Additionally, CT inspection can capture structures in three dimensions, allowing for visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, enabling real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

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Case Study Collection: X-ray Fluoroscopy and CT Examination Equipment

Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" through X-ray fluoroscopy and oblique CT observation are included!

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopy and angled CT observation, as well as observations of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopy observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopy observation & orthogonal CT observation)... ★ Currently, we are offering a free collection of case studies on X-ray fluoroscopy and CT inspection equipment! You can view it immediately via "PDF download." * For more details, please refer to the PDF document or feel free to contact us.

  • Analysis and prediction system
  • Other analytical equipment
  • Inspection Equipment

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Observation of aluminum welding joints

Introducing examples of aluminum welding observations. Internal observations through X-ray fluoroscopy and CT scans provide clearer insights after cross-section preparation!

Here is a case study of the observation of aluminum spot welds. Internal observation using X-ray radiography revealed voids within the weld, and internal observation using X-ray CT confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching, we were able to observe the condition of the weld more clearly. 【Summary】 ■ Internal observation using X-ray radiography - Conducted non-destructive testing and X-ray radiographic observation - Voids were observed within the weld ■ Internal observation using X-ray CT - Conducted non-destructive testing and X-ray CT observation - Confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section tailored to the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

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Investigation of solar power generation equipment malfunctions

We will propose solutions to your problems with solar cell modules and solar power generation equipment, utilizing our expertise in fault detection.

● Evaluation/Analysis of Solar Cell Modules We conduct failure analysis and performance evaluation of solar cell modules. - Non-destructive testing: We reveal failure conditions through EL measurements and output measurements equivalent to product shipment inspections. - Destructive testing: We identify the causes of failure through cross-sectional component analysis of defective parts. ● On-site Investigation We investigate the damage to solar panels caused by natural disasters and the causes of power generation decline. - We propose appropriate methods, starting with measurements by Solament, to investigate failure conditions and causes. - Based on the investigation results, we will submit an investigation report to the insurance company.

  • Solar power generation equipment
  • Inspection Equipment

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Inspection equipment OLED (FPD) image inspection equipment

Reduce costs by minimizing variability in visual inspection judgments.

The PV-EL Dorado Evo.I is an "OLED image inspection device (FPD image inspection device)" that has achieved the detection of minute defects across the entire surface of organic EL (OLED) panels, which previously could only be realized with quite large equipment, in a compact and low-cost manner.

  • Other analytical equipment
  • Inspection Equipment

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Image processing system for wide-field shape inspection

New era of shape inspection through the realization of wide field of view / high resolution.

We have achieved a wide field of view and high resolution that has been difficult to realize until now. Changing the camera position or switching due to variety changes is almost unnecessary. Additionally, by simply swapping the camera and capture device, standard area cameras (2D CCD/C-MOS cameras) can also be used.

  • Other Software
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Thermal resistance testing device

Proposal for a thermal resistance testing device backed by semiconductor and thermal analysis technology.

We will propose original equipment that fits the product genre and needs of our customers. Rather than just selling equipment, we will offer solutions based on semiconductor technology and thermal analysis technology, from optimal specification proposals to suggestions for measurement conditions.

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X-ray inspection device X-ray flavor inspection machine Level Eye 'LE4-60'

High-speed flavor inspection at up to 2000 pieces per minute! Operates with one-third the power of image processing methods.

The X-ray flavor inspection machine 'LE4-60' is a device that can inspect the flavor content of PET bottles, aluminum cans, and steel cans at an ultra-fast rate of "up to 2000 units per minute." It is compact and easy to install, minimizes power consumption, and achieves energy savings! It is less affected by the shape of the container and water droplets, and has low X-ray output, making it safe. 【Features】 ■ High-speed inspection… Up to 2000 units/min ■ High-precision inspection… ±1mm (during transport) ■ Energy-saving… One-third of the power consumption of similar products ■ Lightweight… 20% lighter than similar products *For more details, please download the catalog or feel free to contact us.

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X-ray flavor inspection machine "Level Eye LE4-70" *Technical documentation available

"Approximately 500 units introduced" Active in breweries, sake breweries, packers, etc.! For inspection in beverage manufacturing.

The X-ray flavor inspection machine "Level Eye LE4-70" is an inspection device adapted for "flavor inspection" in beverage manufacturing. Based on the introduction of approximately 500 units in the series and the experience gained from those sites, the accuracy and stability remain intact, while maintenance has been improved. The compact box-type design reduces the weight to about half of the conventional models. ★Currently, we are offering product catalogs and technical materials. Please download them from the "PDF Download" link below. <New Features> ■Automatic X-ray Dose Adjustment Automatically adjusts to the optimal X-ray dose, contributing to the extension of the X-ray tube's lifespan by avoiding unnecessary output. ■Automatic Correction Function Automatically corrects judgment values even if the sensor's sensitivity decreases to a certain extent, enabling stable long-term inspections. ■Flexible Layout The touch panel can be mounted on any side, allowing for installation in various locations and work scenes. ■Oscilloscope-less Adjustment No special skills are required for X-ray source replacement and adjustment. In emergencies, customers can replace it, and our service personnel can check the situation later. ■Data Transfer Inspection data can be sent to a PC, and data graphing is also possible (with separate software).

  • Other measuring instruments
  • Inspection Equipment

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Wafer Inspection Device

Please make use of this for the standardization and automation of your inspection processes!

Not only can we detect minute defects (foreign substances, scratches, etc.) that occur on transparent substrates such as sapphire, which have traditionally been difficult to inspect, but we can also automate and standardize the inspection process that has previously shown significant variability when done by the naked eye.

  • Non-destructive testing
  • Inspection Equipment

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Post-Process Related Product Catalog

A wide variety of products are featured, including inspection equipment, joining materials, and wafer processing equipment!

This catalog features the product lineup handled by the post-process department. We offer a wide range of products, including the "Wafer and Chip Appearance Inspection Equipment" compatible with 2-inch to 12-inch sizes, as well as "N2 Compact Size Reflow" and "Solder Paste." 【Featured Products (Excerpt)】 ■ Inspection Equipment ■ Reflow Equipment ■ Bonding Materials ■ Cleaning Equipment ■ Wafer Process Equipment ■ Others *For more details, please refer to the PDF document or feel free to contact us.

  • Joining and fastening materials
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Inspection equipment

Introducing small glass substrate appearance inspection equipment and electronic component six-sided appearance inspection equipment.

Dainichi Shoji Co., Ltd. introduces the "Inspection Equipment" it handles. The "Wafer and Chip Appearance Inspection Equipment" achieves labor-saving with high-speed throughput and is capable of inspecting micro-cracks, foreign substances, and pattern defects. The "Small Glass Substrate Appearance Inspection Equipment" can detect minute scratches and dirt on small glass substrates such as those used in smartphones. Additionally, we also handle the "Electronic Component 6-Surface Appearance Inspection Equipment," which can perform high-speed inspection of chip components on six surfaces, processing approximately 1,500 units per minute. 【Wafer and Chip Appearance Inspection Equipment Features】 ■ Compatible with 2-inch to 12-inch sizes ■ Supports Si wafers, compounds, glass, etc. ■ Inspection of warped wafers and chips after dicing ■ Automatic discrimination function / Map data storage function ■ Resolution: 1.5μm *For more details, please refer to the PDF document or feel free to contact us.

  • Measurement and Inspection
  • Inspection Equipment

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