Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" through X-ray fluoroscopy and oblique CT observation are included!
In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopy and angled CT observation, as well as observations of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopy observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopy observation & orthogonal CT observation)... ★ Currently, we are offering a free collection of case studies on X-ray fluoroscopy and CT inspection equipment! You can view it immediately via "PDF download." * For more details, please refer to the PDF document or feel free to contact us.
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Company information
Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
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