クボタ計装 Company Profile

Kubota's "weighing business" celebrated its 100th anniversary in 2024. We cherish the connections built over many years and express our gratitude while seizing the opportunity to leverage the technology we have cultivated for further leaps into the next era. By "measuring correctly," Kubota has continued to contribute to the development of society. We will continue to create new value in "measuring" and support a prosperous future for people. 《A special website for the 100th anniversary of the weighing business is now live!》 We are sharing special content and great campaign information, so please take a look.

Detection of fine surface defects such as scratches and pits on the hard disk surface By irradiating the hard disk surface with a high-power laser, fine surface defects such as scratches and pits are detected, classified by defect type, and the results are displayed. The simultaneous irradiation of multiple lasers not only allows for high-sensitivity detection of scratches but also determines the uneven shape of the defects. Features - Detection of minute defects using high-power lasers - High scratch detection capability - Discrimination of defect unevenness - Full auto-focus - Excellent cost performance - Customization support - Automatic inspection for one cassette - Compatible with transparent glass substrates

Transparent wafers can also be inspected at high speed! High-output lasers detect tiny scratches and particles! The 'Laser Explorer' is the latest wafer surface defect inspection device that supports transparent wafers. High-output lasers detect minute defects such as scratches, pits, and particles! It can be utilized for shipping and receiving inspections of wafers, as well as for quality control in the epitaxial process! 【Other Features】 ■ High throughput (inspects 25 wafers in a cassette in about 40 minutes) ■ Discriminates the unevenness of defects ■ Automatic focus for all samples ■ Customization support ■ Automatic inspection for one cassette ■ High-precision marking for defects (optional) ■ Defect review using a laser microscope (optional)