Heat sink Product List and Ranking from 16 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 19, 2025～Dec 16, 2025
This ranking is based on the number of page views on our site.

Heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 19, 2025～Dec 16, 2025
This ranking is based on the number of page views on our site.

  1. LSIクーラー Tokyo//others
  2. 高木製作所 Ibaraki//others
  3. ワイドワーク Tokyo//Trading company/Wholesale
  4. 4 富士商会 Tokyo//others
  5. 4 三協立山株式会社　三協マテリアル社 Toyama//Building materials, supplies and fixtures manufacturers
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Heat sink Product ranking

Last Updated： Aggregation Period:Nov 19, 2025～Dec 16, 2025
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. Copper water-cooled heat sink 高木製作所
  3. Water-cooled heat sink for IGBT 高木製作所
  4. Heat sink for LGA1156/1155/1150/1151 ワイドワーク
  5. 4 Foot-operated non-contact disinfectant pump stand "Alshu III" LSIクーラー

Heat sink Product List

31～45 item / All 45 items

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Drum Pump Stand D-STAND

Drum Pump Stand D-STAND

A convenient stand with a tray that allows for the upright storage of a drum pump.

**Merits** - The pump is protected from damage, making it easy to store and retrieve. - The suction pipe opening remains clean. - It takes up little space and is easy to place. **Features** - Comes with a tray to prevent liquid drips from residual liquid in the pump. - Vertical storage with adjustable height. - Includes a hose hook to keep the hose off the floor. - Size (length × width × height): 520 × 410 × 996 (mm) - Material: SUS

  • pump

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Aluminum heat sink

Aluminum heat sink

For cooling semiconductor devices and printed circuit boards! Various cooling methods are possible, including natural heat dissipation and forced cooling.

It has excellent heat dissipation, is lightweight, and can be made in various cross-sectional shapes. Natural convection, forced cooling, and a variety of cooling methods are possible. It can be used for cooling semiconductor devices and printed circuit boards. 【Features】 ■ Excellent heat dissipation, lightweight, and can be made in various cross-sectional shapes ■ Natural convection, forced cooling, and a variety of cooling methods are possible *For more details, please refer to the PDF document or feel free to contact us.

  • Power distribution and control panels

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Heat radiator Comb fit

Heat radiator Comb fit

The principle of comb-fit connection is...

The surface of the aluminum material that makes up the base and fins of the heat sink is covered with a hard oxide film due to exposure to air. By instantly removing this hard oxide film and pressing the newly formed surfaces of the fins and base against each other with pressure, the metal will bond together, improving the thermal conductivity between the base and fins. *Online meetings are also possible, so please feel free to contact us.

  • others

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Heat sink for surface mount devices, SQ series

Heat sink for surface mount devices, SQ series

The SQ series is an aluminum extrusion type with a slit fin type.

We are pursuing high performance in heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface mount devices are of the aluminum extrusion type and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and heat absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are utilized as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. [Contents] - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin type heat sink - H Series: Multipurpose, general-purpose fin type heat sink *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out.

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Foot-operated non-contact disinfectant pump stand "Alshu III"

Foot-operated non-contact disinfectant pump stand "Alshu III"

For hand disinfection at the office reception or factory entrance! You can push the pump bottle without touching it, making it hygienic! It is compatible with commercially available bottles as well!

The "Alshu III" is an alcohol disinfectant stand equipped with a foot pedal. By stepping on the pedal, disinfectant can be dispensed from the pump, allowing for disinfection without directly touching the push area, thereby reducing the risk of infection through contact with the push area by multiple people. Since it is foot-operated, no power supply is needed, making it easy to use in various locations such as office reception areas, factory entrances, meeting room entrances, and employee cafeteria entrances. 【Features】 - Allows hand disinfection without touching the pump - Compatible with commercially available bottles - No assembly required - Made in Japan (high quality) - Available in sizes for children, etc. *We can accommodate short delivery times for bulk purchases, so please consult us. *For purchases, please contact us directly through the link below.

  • Safety and consumables

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Flexible heat sink

Flexible heat sink

The heat sink fits the curved surface! The fin shape and size can be customized according to your requirements.

We offer a "Flexible Heat Sink" that elegantly addresses the heat dissipation challenges of curved surfaces. The newly conceived variable base structure heat sink allows for flexible deformation to match the curved shapes of cooling targets, such as perfect circles, partially opened shapes, and ellipses. This innovative structure fits even the curved surfaces that have been difficult to install on until now, maximizing heat dissipation effectiveness. 【Specifications】 ■ Material: Aluminum or aluminum alloy ■ Fin shape and size: Custom-made according to your requirements *For more details, please download the PDF or feel free to contact us.

  • others
  • Heat exchanger
  • Parts and Materials

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[Case Study] Aluminum Extrusion Heat Sink

[Case Study] Aluminum Extrusion Heat Sink

Introducing product examples of heat sinks made by aluminum extrusion!

This is a product example of heat sinks made from aluminum extrusion by Fuji Shokai. A heat sink is a component that utilizes the high thermal conductivity of metal to dissipate and exhaust heat. When installed in contact with a heat source, it can absorb heat and cool the heat source naturally by dissipating it. Additionally, we also manufacture a "forced air cooling type" that enhances the cooling effect. [Overview] ■ The larger the surface area exposed to air, the higher the heat dissipation efficiency, so it often takes the form of multiple protrusions or plates. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Concrete block, ALC panel, extrusion molded cement board construction

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Heat Sink "Offset SS Type"

Heat Sink "Offset SS Type"

Heat dissipation performance is improved compared to conventional comb-shaped heat sinks! Ideal for devices that require space-saving solutions.

The "Offset SS Type" is a heat sink that improves heat dissipation by approximately 30%. By offsetting the fin pitch every other row, it significantly enhances performance compared to conventional extruded (comb-shaped) heat sinks. With a fin height of (maximum) 1/2, it can achieve performance equivalent to our conventional extruded heat sinks, allowing for miniaturization and weight reduction of the equipment. Surface treatment can accommodate anodized specifications (colored), and it is capable of precision cutting, precision machining, and drilling. 【Features】 ■ Dividing and offsetting the fins disrupts the temperature boundary layer ■ Increases opportunities for air to collide with the fins, improving heat dissipation performance ■ Suitable for equipment requiring forced air cooling and space-saving designs ■ Surface treatment can accommodate anodized specifications (colored) ■ Capable of precision cutting, precision machining, and drilling *For more details, please refer to the related links or feel free to contact us.

  • Parts and Materials

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[Sheet Metal Processing Example] Audio Heat Sink/Chassis (Aluminum)

[Sheet Metal Processing Example] Audio Heat Sink/Chassis (Aluminum)

Sheet metal processing through punching! It's a chassis and heat sink related to audio equipment.

At Horiuchi Manufacturing Co., Ltd., we primarily focus on various machining processes using equipment such as NC turret punch presses, NC milling machines, CNC lathes, laser processing machines, and NC benders. We handle a wide range of products including exterior parts for small transformers, other metal press products, sheet metal processing, precision machining, lighting equipment parts, construction hardware, and machine assembly. Additionally, with the introduction of the Amada fiber laser processing machine (ENSIS 3015 AJ), we are now able to process materials such as copper, brass, and aluminum, which we previously found challenging. If you have any requests regarding processing, please feel free to consult with us. [Processing Examples] We perform processing through punching. We manufacture chassis and heat sinks for audio equipment. The size is approximately 300×150×150×3t. *For more details, please refer to the PDF materials or feel free to contact us.

  • others

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- Machining examples of cut-out heat sinks: Metal processing of deep fin grooves -

- Machining examples of cut-out heat sinks: Metal processing of deep fin grooves -

We are Nitto Kousakusho Co., Ltd., engaged in precision machining in Osaka Prefecture.

008【Our Technical Expertise】2024/08/15 ~Machining Case of Machined Heat Sinks: Deep Fin Grooves~ This time, we will introduce a successful machining case involving small to medium lots of 30 to 50 pieces. The product name is heat sink, and machining was carried out based on the following specifications. We received a request to manufacture a monolithic heat sink with fins machined out. In this machining process, there was a challenge due to the deep fin grooves, which made the fins prone to damage during processing. However, leveraging our long-standing expertise in jig manufacturing and machining know-how, we were able to successfully complete and deliver the product. In particular, we responded quickly to the relatively small lot of 30 pieces and met our customer's requirements effectively. Our company provides reliable products with high technical expertise even in small to medium lot metal and machining processes. ◎ If you have any inquiries regarding metal processing or machining, please feel free to contact us. We also welcome simple machining requests, so do not hesitate to reach out. #MetalProcessing #Machining #SmallLotProduction #MediumLotProduction #PrecisionMachining #RotaryEngine

  • Other interior and exterior systems and units

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Aluminum cast heat sink

Aluminum cast heat sink

Efficient cooling of the heating element by an aluminum cast heat sink.

To enhance the efficiency of heat sink functions using aluminum castings, more complex and thinner shapes are achieved through sand casting to maximize the aluminum surface area. Shapes that are difficult to form with castings (such as those requiring sand cores or holes that cannot be machined) can also be formed using pipes of the same material.

  • others

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Disinfectant pump stand

Disinfectant pump stand

Highly suitable for COVID-19 measures in various facilities and stores - a stylish hand sanitizer pump stand.

In the era of living with COVID-19, it has become common for various facilities and stores to have disinfectant pump dispensers and sprays installed, but there are still many places where bottles are placed on makeshift stands or tables. Our disinfectant pump stand (made of sturdy metal) meets the demand for a more stylish design that matches the atmosphere of facilities and stores. The cutting of the base, finished with laser processing, is a design highlight. The FUS-11 comes with a holder for a sign plate, which is sold separately. Its slim shape means it doesn't take up much space. After the COVID-19 pandemic subsides, it can also be used as an interior stand for displaying potted plants.

  • Other store equipment and supplies
  • Other office supplies
  • others

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Foot-operated non-contact disinfectant pump stand that can disinfect without touching it with hands.

Foot-operated non-contact disinfectant pump stand that can disinfect without touching it with hands.

For hand disinfection at schools and restaurants! You can push the pump bottle without touching it! We also have stands for children available!

The "Alshu III" is an alcohol disinfectant stand equipped with a foot pedal. By stepping on the pedal, you can dispense disinfectant from the pump, allowing for disinfection without directly touching the push area, thereby reducing the risk of infection through contact with the push area by multiple people. Since it is foot-operated, no power supply is required, making it easy to use in various places such as schools, restaurants, hospitals, and local governments. 【Features】 ■ Allows hand disinfection without touching the pump ■ Compatible with commercially available bottles ■ No assembly required ■ Made in Japan (high quality) ■ Available in sizes for children, etc. *We can accommodate short delivery times for bulk purchases, so please consult us. *For purchases, please contact us directly through the link below.

  • Safety and consumables

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[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)

[Book] Development of Heat Dissipation and Cooling Technology for Electronic Devices and Components (No. 2115)

[Free trial available - Specialized literature] ★ Thorough explanation of heat problem countermeasures associated with the acceleration of high-performance semiconductors and the high-density implementation of devices.

- Response to 5G, high-speed, and miniaturization - ■ Key Points of This Document Design and Application of Heat Sinks - Resolution of hotspot issues in next-generation power devices - Increase in maximum heat transport per unit - Composite use of graphite and metal materials and application of heat spreaders Development and Application Examples of TIM (Thermal Interface Material) - Orientation technology for transporting large amounts of heat in the thickness direction - Emergence of high thermal conductivity in TIM and reduction of contact thermal resistance - Achievement of high thermal conductivity with less filler content Development of Heat Dissipation Substrates - Improvement of high thermal conductivity and heat shock characteristics in metal-based substrates - Enhancement of thermal conductivity in silicon nitride substrates Prospects for Next-Generation Cooling Technologies - Outlook and challenges of boiling cooling technology - Boiling heat transfer under electric field application Case Studies in Device Heat Dissipation Design - Approaches to thermal design and thermal verification, simulation technology - Response to thermal design based on substrate heat dissipation, component technology - Design and evaluation of submerged processor chips aimed at liquid immersion cooling - Key points in thermal design for mobile devices

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