For cooling semiconductor devices and printed circuit boards! Various cooling methods are possible, including natural heat dissipation and forced cooling.
It has excellent heat dissipation, is lightweight, and can be made in various cross-sectional shapes. Natural convection, forced cooling, and a variety of cooling methods are possible. It can be used for cooling semiconductor devices and printed circuit boards. 【Features】 ■ Excellent heat dissipation, lightweight, and can be made in various cross-sectional shapes ■ Natural convection, forced cooling, and a variety of cooling methods are possible *For more details, please refer to the PDF document or feel free to contact us.
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【Material】 Aluminum alloy * Hole processing and other specifications can be produced as needed. * The products listed in this catalog are just a small selection; there are many other diverse shapes available. * Please specify the length (L). * Anodized finishes (white, black) are also available. * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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A manufacturer and general electronics trading company that develops components for distribution boards and control panels, panel parts, wiring materials, insulation materials, electrical construction materials, noise countermeasure products, LAN-related materials, signaling equipment, and more.