Heat sink Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

Heat sink Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. LSIクーラー Tokyo//others
  2. null/null
  3. ワイドワーク Tokyo//Trading company/Wholesale
  4. 富士商会 Tokyo//others
  5. 高木製作所 Ibaraki//others
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Heat sink Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Flexible heat sink LSIクーラー
  2. Heat sink for Intel Socket LGA3647 ワイドワーク
  3. Heat sink for high-performance forced air cooling "YK/YU/YX series" LSIクーラー
  4. Aluminum Water-Cooled Heat Sink "YC Series" LSIクーラー
  5. 4 【Heating/Cooling Device Components】Heat Sink Product Lineup List

Heat sink Product List

16～30 item / All 44 items

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Since it is shaped using aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! It is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. This product employs forced cooling using water, achieving a simple and low-cost water-cooled heat sink made from aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are possible) ■ Low cost ■ Specification verification is supported by simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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Comb Fit Heat Sink YK/YU/YX・YC Series

Comb Fit Heat Sink YK/YU/YX・YC Series

Achieving high-performance heat sinks with our unique aluminum pressure welding technology!

The comb-fit heat sink has achieved high-performance heat dissipation through its unique aluminum pressure welding technology. It features excellent heat dissipation characteristics and robustness. 【Features】 ● YX Series → Composed of three parts: left, right, and intermediate fins → The number of intermediate fins can be changed to freely set the width of the fins (width: up to 500mm) → For high-performance forced air cooling ● YK/YU Series → Composed of separate parts for the base and fins → Fins can be freely configured → For high-performance forced air cooling ● YC Series → For water cooling ● Comb-fit Joining Principle → The surfaces of the aluminum base and fins that make up the heat sink are covered with a hard oxide film exposed to air → By instantly removing the hard oxide film and pressing the fresh surfaces of the fins and base together under pressure, the metals bond, improving thermal conductivity between the base and fins → The stress generated during press-fitting and work hardening are combined to join the fins and base → The bonding strength is incomparable to simply pushing the fins into the base *Online meetings are also possible, so please feel free to contact us.

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[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

[Free Diagnosis!] LSI Cooler Co., Ltd. Design Support Service

Support from thermal design to provide the right products! Free provision of analysis using simulation software and actual measurement data for thermal countermeasures!

LSI Cooler Co., Ltd. supports thermal design from the outset to provide appropriate products. We have established a system to support thermal design by offering analysis through simulation software and actual measurement data to enable proper thermal countermeasures. We provide more reliable data more quickly, including power-temperature rise characteristics, wind speed-temperature rise characteristics, transient thermal resistance characteristics, pressure loss characteristics, and thermal distribution. We aim to shorten development time and propose suitable costs. 【Features】 〇 Providing more reliable data more quickly → Power-temperature rise characteristics → Wind speed-temperature rise characteristics → Transient thermal resistance characteristics → Pressure loss characteristics → Thermal distribution, etc. 〇 Shortening development time and proposing appropriate costs, etc. *Online meetings are also available, so please feel free to contact us.

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Thermal management in electronics! Optimal heat sinks for performance and cost.

Thermal management in electronics! Optimal heat sinks for performance and cost.

For thermal management of high-efficiency inverters, use a simple heat sink! Professional catalog available.

With our heat sink design support and a rich lineup, we achieve optimal heat sinks in terms of both performance and cost. ■ For high capacity (Comb Fit) 【YX Series】 - Size adjustments can be made freely according to specifications for each output capacity - Simple structure that does not require wind tunnel sheet metal - Both sides of devices such as power modules can be mounted 【YK Series/YU Series】 - Single-sided base type - Fin arrangement can be freely configured according to unit composition ■ For water cooling (Comb Fit) 【YC Series】 - Double-sided base type - Selection from standard lineup, customization is also possible ■ For low to medium capacity 【F Series/V Series】 - Selection from a rich lineup, customization is also possible ■ For pin-mounted devices 【P Series/FP Series】 - Heat sink fins for pin-mounted transistors and diode packages such as TO220 - Many standard lineup options available, dimension customization is also possible ■ For surface-mounted devices 【SQ Series】 - Pin fin type for surface-mounted devices, designed for air cooling - Small-scale prototypes can be made, dimension and processing customization is also possible

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Crimp-type heat sink / comb fit

Crimp-type heat sink / comb fit

Heat sink compatible with high-output LEDs! Customization available according to application and structure.

As specialists in thermal radiation and thermal design, we at LSI Cooler provide custom-made LED heat sinks for high light output. We can accommodate a wide range of needs from prototype production to mass production. 【Product Lineup and Features】 ◆ "Comb Fit Heat Sink YK Series" - By innovating the configuration of the fin unit, we can create high-performance natural cooling heat fins as well as forced air cooling solutions. - The arrangement of fins on the base is flexible, and circular designs are also possible. ◆ "Heat Sink for Driver Circuits P Series" - Heat sinks with mounting terminals for TO-220 packages. - A wide range of standard lineups is available, and dimension customization is possible. ◆ "Design Support" for fin designs tailored to applications - We offer heat fins tailored to your needs for outdoor, high ceiling, medical, and plant growth lighting, as well as for display boards, floodlights, and fishing lights. *Online meetings are also possible, so please feel free to contact us.

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As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

As the performance of electronic devices continues to improve, components with higher heat dissipation capabilities are needed.

Introducing examples of PIM utilization! We can mass-produce various shapes of heat dissipation products with excellent heat dissipation performance.

We would like to introduce a case study of PIM utilization by Atect Co., Ltd. As the CPU processing speeds of PCs and smartphones increase, the power generation has grown, necessitating high-precision components made from ceramic materials. Our company can manufacture excellent heat dissipation and insulation components using ceramics that have been thermally conductive through our unique technology, leveraging the high emissivity that ceramics inherently possess. These can be applied in various forms such as CPU heat sinks, fin-type heat sinks, pyramid-type heat sinks, pole-type heat sinks, and thin heat sinks. [Challenges Addressed] ■ Manufacturing of high-precision components using ceramic materials *For more details, please refer to the PDF document or feel free to contact us.

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[Technical Adoption Case] High Tongue Heat Sink Extruded Material

[Technical Adoption Case] High Tongue Heat Sink Extruded Material

By using performance analysis through simulation, we can provide proposals tailored to your needs!

We would like to introduce a case where our aluminum technology has been adopted for "high tong heat sink extruded shapes." Heat sinks are heat dissipation materials that utilize the high thermal conductivity of aluminum, used for cooling semiconductor devices in communication equipment and various control devices. The temperature rise of semiconductor devices can lead to issues such as reduced reliability, decreased performance, and destruction, making the use of heat exchangers essential. Aluminum heat sinks, which excel in cooling performance and cost, are utilized. Proposals tailored to your needs can be made through performance analysis using simulations. 【Case Overview】 ■ Application: Cooling of semiconductor devices in communication equipment and various control devices ■ Manufacturing Range - Outer diameter of extruded shapes (φ): 200mm or less - Tong support width (W): 3mm or more *For more details, please refer to the related links or feel free to contact us.

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Water-cooled heat sink for IGBT

Water-cooled heat sink for IGBT

Lightweight due to its thickness of 3 to 15 millimeters! You can choose from various types such as double-sided mounting, single-sided mounting, and ultra-thin models.

IGBT power devices used for various applications. We introduce the "water-cooled heat sink" that maximizes their performance. Made of copper, which excels in performance and durability, and lightweight due to its thickness of 3 to 15 millimeters. You can choose from various types such as double-sided mounting, single-sided mounting, and ultra-thin models. In addition to 8 standard products, custom manufacturing is available up to approximately 500×800 millimeters. The price is for one unit, with discounts available for orders of 2 or more, 10 or more, and 50 or more. For more details, please contact us. 【Features】 ■ Made of oxygen-free copper with excellent thermal conductivity and durability ■ Lightweight due to its thickness of 3 to 15 millimeters ■ In addition to 8 standard products, various custom products can be manufactured according to application ■ Three types (double-sided mounting/single-sided mounting/ultra-thin) *For more details, please refer to the PDF document or feel free to contact us.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used in 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink made from pure copper ingots (material in solid form) that has been machined (skyve processed) into a single molded shape.

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Heat sink for LGA1156/1155/1150/1151

Heat sink for LGA1156/1155/1150/1151

Fanless heatsink for cooling the CPU. Compatible with Intel Socket LGA1156/1155/1150/1151.

Fanless CPU cooler compatible with Intel Socket LGA1156/1155/1150/1151. It is mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, it is necessary to direct airflow from outside onto the heatsink. This product is often used in environments where blower fans are installed or in 1U rack-mounted servers with small fans arranged. It features a heatsink made from aluminum ingots (in a solid material state) that have been machined (skyve processed) into a single piece.

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Heat sink for Intel Socket LGA3647

Heat sink for Intel Socket LGA3647

Fanless heat sink for cooling the CPU. Compatible with Intel Socket LGA3647.

Fanless CPU cooler compatible with Intel Socket LGA3647. Mainly used for 1U rack-mounted servers and small industrial equipment. Since this product is fanless, its cooling performance is affected by the usage environment. To cool it, airflow must be directed at the heatsink from an external source. It is often used in environments such as 1U rack-mounted servers equipped with blower fans or lined with small fans. The heatsink is a monolithic structure machined from aluminum ingots (raw material state).

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Fanless heatsink for Intel Socket LGA1700.

Fanless heatsink for Intel Socket LGA1700.

Total height 27mm, fanless heat sink cooler with copper core heat sink with heat pipe + aluminum fins.

It can cool CPUs for Intel Socket LGA1700. 【Features】 ● Fanless CPU cooler for Intel Socket LGA1700. ● A copper plate is attached to the CPU contact surface of the aluminum heatsink, and heat pipes are also used to efficiently transfer heat, allowing for quick dissipation of CPU heat. ● With a height of 27mm, it is slim and ideal for 1U rack mount cases, slim cases, and small cases where space is limited. ● This product is a fanless heatsink, so cooling performance is affected by the environment in which it is used. It is essential to direct airflow from an external source. Additionally, it does not guarantee cooling performance. ● The installation method uses a backplate, ensuring a secure fit and close contact with the CPU. There is also no worry of it falling, allowing for safe transportation.

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Drum Pump Stand D-STAND

Drum Pump Stand D-STAND

A convenient stand with a tray that allows for the upright storage of a drum pump.

**Merits** - The pump is protected from damage, making it easy to store and retrieve. - The suction pipe opening remains clean. - It takes up little space and is easy to place. **Features** - Comes with a tray to prevent liquid drips from residual liquid in the pump. - Vertical storage with adjustable height. - Includes a hose hook to keep the hose off the floor. - Size (length × width × height): 520 × 410 × 996 (mm) - Material: SUS

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