"Observation × Vacuum × High-Speed Temperature Rise" Prototype Conditions Completed In-House! The Long-Awaited Desktop Vacuum Reflow Oven for Researchers and Developers.
Eliminate delays in development speed caused by dependence on outsourcing and waiting for large equipment availability! The "Small Vacuum Reflow Oven TR-200-300" is a research and development device developed for in-house production of prototype evaluation and bonding condition setting for BGA, power semiconductors, and advanced packages, designed for tabletop installation. It independently and precisely controls the vacuum environment, atmosphere, and temperature profile, allowing for the reproduction of advanced bonding process studies that were previously only possible with large equipment. ◆ Equipped with a utility model pending "Lifting Device" ◆ Process observation through a large glass window ◆ Significant reduction of voids and oxidation with vacuum and nitrogen (N₂) atmosphere support ◆ Compact tabletop design for easy introduction in research and development and prototyping environments ◆ Parameter setting and data collection via PC connection
Inquire About This Product
basic information
Chamber effective internal dimensions: W170 × D170 × H20 mm External dimensions: W520 × D370 × H192 mm Body weight: Approximately 22.5 kg Power specifications: Single-phase 200V Temperature setting range: Room temperature to 300℃ Maximum heating rate: 120℃/min Maximum cooling rate: 80℃/min Temperature distribution accuracy: ±4℃ Temperature control method: PID control method (8 programs × 16 steps) Vacuum degree: -0.1 MPa Usable gases: Inert gases such as nitrogen (N₂) (Note: Forming gas not allowed) PC connection function: Condition setting and temperature log data collection (Dedicated software and cable included)
Price information
Please contact us as it varies depending on the specifications. Before placing an order, we accept orders only after you have confirmed to your satisfaction whether it fits the work or evaluation theme you are considering. Feel free to consult with our dedicated technical sales representatives regarding on-site demos (free) or contracted testing (for a fee). For inquiries about requesting materials, demo consultations, or contracted testing, please contact Taisei Corporation.
Price range
P5
Delivery Time
Applications/Examples of results
Suitable for condition setting, prototype evaluation, evaluation testing, process examination, material evaluation, etc. ◆ Evaluation of mounting conditions for BGA and substrate samples "I want to repeatedly confirm in-house at what temperature profile voids occur." ◆ Initial examination of flip chip and bonding conditions "I want to quickly narrow down how much pressure needs to be increased for stable bonding strength in small lots." ◆ Comparative testing when changing materials "I want to compare what changed when the solder material was altered under the same profile." ◆ Preliminary confirmation testing before outsourcing "I want to confirm whether bonding can really be achieved under these conditions before outsourcing."
Line up（2）
| Model number | overview |
|---|---|
| Ultra-compact vacuum high-power reflow furnace TR-125VH3 | The ultra-compact vacuum high-power reflow furnace TR-125VH3 has improved cooling performance by combining it with a cooling reflow plate compared to our conventional products. It enables high-quality soldering by preventing oxidation in a vacuum or nitrogen atmosphere, and its low-temperature heating prevents degradation and distortion of components. It eliminates the need for flux and cleaning agents, leading to cost reduction and lower environmental impact. It is an essential machine for enhancing development and accelerating development speed. |
| Ultra-compact vacuum reflow oven TR-125V2 | The ultra-compact vacuum reflow oven TR-125V2 is designed to be ultra-lightweight and compact, making it easy to install in laboratories, and is among the smallest in the world! When combined with the recommended hot plate: As One ND-1A, it enables high-precision temperature control through PID control. Temperature profiles that were not possible with previous models can now be set using the hot plate's programming function, and temperature profiles can be output to a PC (software included). *USB cable sold separately. |
catalog（1）
Download All Catalogs
Company information
Tai-Sei Co., Ltd. provides innovative solutions to address the frustrations and inconveniences of researchers and developers through its product sales, engineering, and processing businesses. In the engineering sector, we support everything from small-batch, diverse prototypes to mass production with products such as world-class compact vacuum reflow ovens, cordless ionizer guns, 3BM retainer rings, bobbin racks for optical fibers, custom probes and needles, and joystick manipulators. We offer rapid and flexible design and manufacturing tailored to our customers' needs, creating products that solve the challenges faced by researchers and developers.
![[Case Study] Sensor Reduces Sorting Time by Half! Higashi Nihon Recycling Systems](https://image.www.ipros.com/public/product/image/add/2001211187/IPROS42997668617422795954.png?w=280&h=280)
