The world's smallest class reflow oven (TRF-95) is finally on sale! ~ A tabletop reflow oven for easy and convenient use in labs or at home ~
Compared to conventional commercial products, we have achieved significant miniaturization, weight reduction, and low cost! Anyone can easily reflow cream solder on a wiring board anywhere and in a short time. The original product from Taisei Co., Ltd., the tabletop reflow oven, features: - A compact size that is less than half that of conventional products! - The ability to observe the melting of solder through glass! - Suppression of flux and solder splatter outside the oven! We also accept custom sizes to fit your existing hot plate. Please feel free to contact us.
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basic information
【Features】 ■ Compact and lightweight reflow oven (Dimensions: W110mm × D127mm × H16mm, Weight: 346g) ■ Reflow device with hot plate (Dimensions: W194 × D292 × H110mm, Weight: 3.2kg) (Recommended hot plate: When combined with As One CHP-170DF) ■ Easy temperature setting with a digital temperature controller. ■ Optimized oven structure to achieve uniform temperature on the reflow plate where samples are placed. ■ Capable of reflowing cream solder on printed circuit boards in about 30 seconds. ■ Progress of reflow can be monitored through the glass lid. The world's smallest class reflow oven (TRF-95) is finally on sale! The original tabletop reflow oven from Taisei Co., Ltd. has achieved significant miniaturization, weight reduction, and low cost compared to conventional commercial products. Anyone can easily reflow cream solder on printed circuit boards anywhere in a short time. When using, we recommend combining the heater device with the As One hot plate CHP-170DF and our dedicated cover. For more details, please refer to the catalog or feel free to contact us.
Price information
Please contact us.
Price range
P3
Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Reflow and soldering after electronic component mounting.
Detailed information
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Desktop Solder Reflow Oven TRF-95 Dimensions: W110mm × D127mm × H16mm Weight: 346g Desktop Solder Reflow Oven TRF-125 Dimensions: W140mm × D157mm × H17mm
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Desktop Solder Reflow Equipment (TR-20S) Reflow device with hot plate (Dimensions: W194×D292×H110mm, 3.2Kg) 《Configuration》 Manufacturer: As One, Hot Plate CHP-170DF, with our company's dedicated cover.
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Desktop Solder Reflow Equipment TR-20S
Company information
Tai-Sei Co., Ltd. provides innovative solutions to address the frustrations and inconveniences of researchers and developers through its product sales, engineering, and processing businesses. In the engineering sector, we support everything from small-batch, diverse prototypes to mass production with products such as world-class compact vacuum reflow ovens, cordless ionizer guns, 3BM retainer rings, bobbin racks for optical fibers, custom probes and needles, and joystick manipulators. We offer rapid and flexible design and manufacturing tailored to our customers' needs, creating products that solve the challenges faced by researchers and developers.
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