The ultra-compact vacuum high-power reflow furnace (TR-125VH3) has arrived in the world's smallest class of reflow furnace series!
The ultra-compact vacuum high-power reflow furnace (TR-125VH3) from Taisei Corporation has a heating speed that is three times faster than our conventional models! (21℃/min) By combining it with a cooling reflow plate, cooling performance is enhanced! It prevents oxidation in a vacuum or nitrogen atmosphere, allowing for high-quality soldering, and due to low-temperature heating, it prevents deterioration and distortion of components. It eliminates the need for flux and cleaning agents, leading to cost reduction and lower environmental impact. This is an essential unit for researchers and developers pursuing cutting-edge technology, as it enhances development and accelerates development speed.
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basic information
■Reflow Oven External Dimensions: W110×D127×H16mm Weight: less than 350g Internal Space: W116×D116×H16mm Lid Opening and Closing: Arm Fixed Type ■Hot Plate External Dimensions: W200×D260×H118mm Weight: less than 5.1kg Power Supply: AC100V 50/60Hz Heater Capacity: 1300W Maximum Temperature: 430℃ (Rapid heating in about 30 minutes) Maximum Usage Temperature in Reflow Oven: 260℃ ■Temperature Controller External Dimensions: W85×D170×H103mm Weight: 0.9kg --------------------------------------------------- ■Size: Less than 1/20 of conventional vacuum reflow ovens. ■Atmosphere: Capable of vacuum and nitrogen purging. ■Maximum Operating Temperature: 300℃ (Constantly at 260℃) ■Heating Speed: 3 times faster (21℃/min) to reach (compared to our company) ■Temperature Control: Temperature profile setting is possible. (Can be output to PC when combined with temperature controller*) *Temperature controller sold separately.
Price information
It varies depending on the composition, so please contact us.
Price range
P4
Delivery Time
※The delivery time may vary depending on the quantity and options, so please feel free to contact us.
Applications/Examples of results
Reflow soldering of electronic components in a vacuum and nitrogen atmosphere.
Detailed information
Line up（3）
| Model number | overview |
|---|---|
| TR-125V2 | The ultra-compact vacuum reflow oven TR-125V2 is the world's smallest class with an ultra-lightweight and compact design, making it easy to install in labs! Recommended hot plate: Combine with As One ND-1A for high-precision temperature control through PID control. You can set temperature profiles that were not possible with previous models using the program function of the hot plate, and temperature profiles can be output to a PC. (Software included) *USB cable sold separately |
| TRF-125V | The ultra-compact vacuum reflow oven TRF-125V allows for reflow using a vacuum environment or nitrogen gas at a reasonable price, preventing oxidation of electronic components, wiring board electrodes, and solder. |
| TR-20 | The small and lightweight tabletop solder reflow oven TR-20 is a lightweight and compact furnace (dimensions: W110mm×D127mm×H16mm, weight 346g) combined with a hot plate equipped with a temperature controller recommended by our company, making it easy for anyone to perform reflow in a short time. It is ideal for those new to reflow and for use in labs or at home. |
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Company information
Tai-Sei Co., Ltd. provides innovative solutions to address the frustrations and inconveniences of researchers and developers through its product sales, engineering, and processing businesses. In the engineering sector, we support everything from small-batch, diverse prototypes to mass production with products such as world-class compact vacuum reflow ovens, cordless ionizer guns, 3BM retainer rings, bobbin racks for optical fibers, custom probes and needles, and joystick manipulators. We offer rapid and flexible design and manufacturing tailored to our customers' needs, creating products that solve the challenges faced by researchers and developers.
