Introduction to wire bonding and other aspects of SOP (Small Outline Package) packages!
Wire bonding is a method of connecting electrodes on a semiconductor chip to package terminals using metal wires, which can be broadly categorized into ball bonding and wedge bonding methods. This document presents examples of shape observation of joints using the ball bonding method. The samples included were prepared by mechanical polishing to create cross-sections, but there are appropriate processing methods depending on the observation purpose, sample composition, and structure. At Aites, we consider and propose processing, pretreatment, observation methods, and combinations based on our accumulated know-how. Please feel free to contact us for consultations. [Observation Overview] ■ Wire bonding of SOP (Small Outline Package) packages ■ Wire bonding of LED segment display devices ■ Wire bonding of surface-mounted LEDs *For more details, please download the PDF or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.
