Observation of cross-sectional polishing of power modules.

For evaluating before and after reliability testing, as well as for failure analysis due to severe thermal stress from power cycles!

We would like to introduce an example of cross-sectional observation of IGBT modules conducted by our company. Starting with the removal of the encapsulation gel, we perform extensive cross-sectioning to confirm the overall structure, as well as cross-sectional observations of fine structures such as solder joints and wire bonding interfaces. In extensive cross-sectional observations, we can grasp the overall structure and check for distortions in the entire module. Additionally, in fine structure cross-sectional observations, we can identify solder cracks, the growth and coarsening of intermetallic compounds, and issues such as lifting or breaking at wire bonding points. 【Features】 ■ Extensive cross-sectional observation - Capable of confirming the overall structure and distortions in the entire module. ■ Fine structure cross-sectional observation - Capable of identifying solder cracks, the growth and coarsening of intermetallic compounds, and issues such as lifting or breaking at wire bonding points. *For more details, please download the PDF or feel free to contact us.

Other analytical equipment