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  6. Observation of conductive particle shape in COG implementation

Observation of conductive particle shape in COG implementation

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last updated:Apr 12, 2024

アイテス
アイテス
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Observing the state of conductive particles from the planar direction and cross-sectional direction! A case study confirming the degree of deformation.

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) is deposited on its surface for conductivity. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and the connection state, cross-sectional observations were conducted, revealing that the amount of particle deformation was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional perspectives, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related issues. [Summary] ■ In implemented ICs, slight "warping" or "tilting" can cause differences in particle deformation between the edges and the center, potentially leading to display defects. ■ By examining the deformation of conductive particles from both the planar and cross-sectional perspectives, we can explore the correlation with display defects. *For more details, please refer to the PDF document or feel free to contact us.

    Analysis and prediction system
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Observation of conductive particle shape in COG implementation

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Observation of conductive particle shapes in COG implementation

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We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection state, cross-sectional observations were conducted, revealing that the amount of particle deformation was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any investigations related to panel issues.

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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