McDermid: Achieving a decarbonized society while reducing costs! Low melting point solder.
McDermid Performance Solutions Japan HRL1 OM-550
Introducing examples of achieving energy savings and cost reduction with solder paste! Contributing to carbon neutrality through CO2 reduction! Equivalent impact resistance to SAC305!
HRL1 OM-550 is designed to improve yield and reduce component warpage with a low melting point solder paste. It significantly enhances drop impact resistance and thermal cycle resistance compared to the company's conventional products, with a melting point that is considerably lower than SAC305. By lowering the peak temperature during reflow from 245°C to 185°C, it achieves energy savings through reduced electricity costs in the assembly process. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low melting point solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low melting point solder. ● The thermal cycle test performance at the SAC series BGA ball joints shows significant improvement compared to the company's conventional low melting point solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low melting point solder.
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basic information
<Printing Process> - Micro Printing Capability: φ180um (when using a metal mask with t=100um) φ250um (when using a metal mask with t=125-130um) - Plate Life: Over 12 hours - Usable Printing Speed: 25mm to 150mm/sec <Reflow Process Yield> - Reflow Atmosphere: Air and N2 - Low Voids: Meets IPC 7095 CLASS III - Reduced Mounting Defects: Meets industry recommended standards - Reduced Mura (H.I.P) Defects: High resistance to Mura (H.I.P) and NWO (Non-Wet Open) defects - NWO (Non-Wet Open): High resistance to NWO (Non-Wet Open) defects - Flux Residue: Pin testable - Micro Meltability: Supports up to φ180um - Flux Residue Color: Transparent <Electrical Reliability> - SIR: Meets IPC SIR J-STD-004B & BELLCORE SIR - Flux Classification: ROL0 (Halide Free) <Environmental Compliance> - Halogen Content: Zero Halogen
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Implementation of various electrical and electronic components MacDermid, established in 1872, is a U.S. manufacturer with a wide range of adoption worldwide based on a global network and unified quality standards. In Japan, we also have a lab in Kanagawa (Hiratsuka) that supports everything from prototype conditions to after-sales service after mass production begins, allowing customers to utilize various facility equipment themselves.
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The development of electronics has given people great dreams and has turned those dreams into reality one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and joyful to be engaged in a job that plays a part in this electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can contribute to the realization of humanity's great dreams and assist our clients in their product and information development. I sincerely hope to grow together with our clients in the information society of the 21st century. However, on the other hand, environmental issues have become a major focus. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental values of humanity. I am committed to striving towards becoming a company that harmonizes with nature and society as we move towards an endless future.