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  6. McDermid Low Melting Point Solder HRL1-OM550 SDGs

McDermid Low Melting Point Solder HRL1-OM550 SDGs

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McDermid Performance Solutions Japan Co., Ltd. HRL1 OM-550

last updated:Nov 21, 2025

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)
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Introducing examples of achieving energy savings and cost reduction with low melting point solder! Contributing to carbon neutrality through CO2 reduction! Impact resistance equivalent to SAC305!

HRL1 OM-550 is a low-melting solder paste designed to improve yield and reduce component warpage. It significantly enhances drop impact resistance and thermal cycling resistance compared to the company's conventional products. Its melting point is considerably lower than that of SAC305, achieving energy savings in the assembly process by lowering the peak temperature during reflow from 245°C to 185°C. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low-melting solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the BGA ball joints using SAC series is significantly improved compared to the company's conventional low-melting solder. ● The thermal cycling test performance at the BGA ball joints using SAC series is significantly improved compared to the company's conventional low-melting solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low-melting solder.

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低融点SP6.png

McDermid Low Melting Point Solder HRL1-OM550 SDGs

低融点SP6.png
低融点SP6.png
  • Related Link - https://www.seiwa-tr.co.jp/lineup/macdermid/

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<Printing Process> - Micro Printing Capability: φ180um (when using a metal mask with t=100um) φ250um (when using a metal mask with t=125-130um) - Lifespan on the Plate: Over 12 hours - Usable Printing Speed: 25mm to 150mm/sec <Reflow Process Yield> - Reflow Atmosphere: Air and N2 - Low Voids: Meets IPC 7095 CLASS III - Reduced Mounting Defects: Meets industry recommended standards - Reduced Makura (H.I.P) Defects: High resistance to Makura (H.I.P) and NWO (Non-Wet Open) defects - NWO (Non-Wet Open): High resistance to NWO (Non-Wet Open) defects - Flux Residue: Pin testable - Micro Melting Capability: Supports up to φ180um - Flux Residue Color: Transparent <Electrical Reliability> - SIR: Meets IPC SIR J-STD-004B & BELLCORE SIR - Flux Classification: ROL0 (Halide-free) <Environmental Compliance> - Halogen Content: Zero Halogen

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Applications/Examples of results

Implementation of various electrical and electronic components.

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McDermid Low Melting Point Solder Paste HRL1 OM-550

McDermid Low Melting Point Solder Paste HRL1 OM-550

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セイワ

セイワ 東京本社、関西支社、名古屋営業所、中国無錫  グループ会社 エレクトロン(長野県松本市)

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The development of electronics has given people great dreams and has turned those dreams into reality one by one. This development has been passed on to the 21st century, inspiring even greater dreams and hopes. I am deeply grateful and joyful to be engaged in a job that plays a part in this electronics industry. Moving forward, I will continue to serve as a conduit for the appropriate information on semiconductors and electronic components, so that I can contribute to the realization of humanity's great dreams and assist our clients in their product and information development. I sincerely hope to grow together with our clients in the information society of the 21st century. However, on the other hand, environmental issues have become a major focus. As a member of society, I feel the importance of leaving a rich natural environment for the future and preserving the fundamental values of humanity. I am committed to striving towards becoming a company that harmonizes with nature and society as we move towards an endless future.

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