Integration with boundary scan testing using a flying probe tester.

Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)

On December 17th (Tuesday), we participated in the research and exhibition presentation held at Okayama Research Park and conducted a panel display. We had the opportunity to interact with representatives from companies, universities, and technical colleges in the prefecture. The presentation panels from each organization can be viewed on the Okayama Research Park Research and Exhibition Presentation website.

The "29th Okayama Research Park Research and Exhibition Presentation" will be held with the aim of presenting and disseminating research results related to the "Okayama Research Park." A poster exhibition titled "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers" will be featured. Companies, universities, and institutions interested in industry-academia-government collaboration are warmly invited to participate. Poster exhibitions related to research seeds (Industry-Academia Collaboration Model Booth + 8 fields) 《Fields》 ○ Precision Processing and Machinery ○ Materials Technology ○ Semiconductors ○ AI, IoT, and Robotics ○ Medical, Bio, and Food ○ Environment, Chemistry, and Energy ○ Measurement and Inspection ○ Others ■ Organizer Okayama Prefecture, Okayama Prefectural Industrial Promotion Foundation ■ Support Okayama University, Okayama Prefectural University, Okayama University of Science, Kibi International University, Kawasaki Medical University, Kawasaki University of Medical Welfare, Shujitsu University and Shujitsu Junior College, Notre Dame Seishin University, Tsuyama National College of Technology, China Vocational Ability Development University, IPU International Pacific University, Okayama Research Park Incubation Center (ORIC)

At the "38th Spring Conference of the Electronics Packaging Society" held at Tokyo University of Science from March 13 (Wednesday) to March 15 (Friday), 2024, Takaya Corporation's presentation titled "Latest Trends in Hybrid Testing Systems Combining JTAG Inspection and Flying Probe Testers" received the Excellence Award at the conference. The award ceremony took place on September 12, 2024, at the MES2024 Symposium held at Daido University in Aichi Prefecture, where we were presented with a commemorative plaque.