I received the Excellent Award at the 38th Electronics Packaging Society Spring Conference.

At the "38th Spring Conference of the Electronics Packaging Society" held at Tokyo University of Science from March 13 (Wednesday) to March 15 (Friday), 2024, Takaya Corporation's presentation titled "Latest Trends in Hybrid Testing Systems Combining JTAG Inspection and Flying Probe Testers" received the Excellence Award at the conference.
The award ceremony took place on September 12, 2024, at the MES2024 Symposium held at Daido University in Aichi Prefecture, where we were presented with a commemorative plaque.


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