We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Measurement and Inspection

【Exhibition Information】 Exhibition Name: Food Processing Technology Exhibition 2025 Date and Time: November 14, 2025 (Friday) 10:30 AM - 4:30 PM *Free entry and exit, pre-registration required Location: Osaka Industry Creation Center - We will showcase technical products using the factory deodorant "Deofure." - We will display the tofu defoamer "Tofu Up." - Other fragrance technology products will also be exhibited. *For more details, please refer to the materials.

Protech Engineering will exhibit at the "Landslide Disaster Prevention Technology Forum '25 in Toyama," organized by the Japan Society for Slope Disaster Prevention Technology, scheduled to be held on Thursday, October 9, 2025. On that day, we will provide detailed explanations of the following disaster prevention products using models, panels, and various materials. ◆Exhibited Products◆ - Pile-type debris flow and driftwood countermeasures for non-flowing streams / Urban Guard (model display) Additionally, our representative will conduct a technical presentation, so we kindly invite you to attend.

Protech Engineering (Booth Number: 240) will be exhibiting at the "Hokkaido Construction Development Comprehensive Exhibition 2025," scheduled to be held on October 8 (Wednesday) and 9 (Thursday), 2025. On the day of the event, we will provide detailed explanations of the following disaster prevention products using models, panels, and various materials. ◆ Main Exhibited Products ◆ - Energy-absorbing rockfall protection fence / ARC Fence (model display) - Landslide debris protection fence / Slope Guard Fence Type LE (model display) - Pile-type (pile foundation) debris flow and driftwood countermeasure for non-flowing streams / Urban Guard - Avalanche prevention piles / Tri-Pile - Avalanche protection fence / Slope Guard Fence Type LS - High energy-absorbing rockfall protection fence / Macro Fence In addition, we will have a variety of materials on disaster prevention products developed independently by Protech Engineering, so we kindly invite you to visit our booth.

Profect Co., Ltd. will hold a seminar on October 3rd (Friday) themed around the IT Implementation Subsidy 2025 and our developed and sold production management system "TED." This year's IT Implementation Subsidy has seen a significant decrease in the acceptance rate compared to previous years. Many companies are struggling with the situation of having wanted to implement IT tools but being rejected. In this seminar, we will explain why the acceptance rate has dropped, the background behind it, and the key points for being accepted. Additionally, we will introduce our initiatives that have achieved a 100% acceptance rate so far this year and the reasons why our production management system "TED," registered as an IT tool, is chosen. To accommodate busy schedules, this seminar will be held in a hybrid format, allowing for both in-person attendance and online participation via Zoom. Please choose your preferred method of participation according to your convenience. If you are currently considering applying for the IT Implementation Subsidy or are interested in production management, we encourage you to join us. We sincerely look forward to your application.

An international forum aimed at promoting the circular economy and closed-loop economy, "Closed Loop Recycle Forum 2025 (hereinafter referred to as CLRF2025)," will be held for two days from November 25 (Tuesday) to 26 (Wednesday) at The Oriental Terrace in Chuo Ward, Hamamatsu City, Shizuoka Prefecture. In Europe, closed-loop recycling practices are already advancing. We have organized this international forum as a platform to connect the forefront of Europe with Japan's challenges, striving for a future that balances economic viability and environmental sustainability. A total of 12 speakers, including Chairman Kajiwara of the Waste and 3R Research Foundation and Director Kaneko of the Ministry of the Environment's Container and Packaging Recycling Division, along with leading recycling operators and researchers from Japan and Europe, will present advanced examples of the circular economy and closed-loop economy. Furthermore, through discussions on the feasibility and challenges of implementation in Japan, we will explore hints for sustainable business models that companies and local governments should aim for.