We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Measurement and Inspection

Sekisui Filler Co., Ltd. will be exhibiting at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Car Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coating agents - Optical adhesives We sincerely look forward to your visit.

Palmholtz Co., Ltd. will be exhibiting at the "AXIA EXPO 2026" held at Aichi Sky Expo (Aichi Prefectural International Exhibition Center). Our company possesses unique new technologies that transform oil palm trunks (Oil Palm Trunk = OPT), which have been treated as unused resources due to their lack of strength and value as building materials, into wood-based products such as building materials and furniture. The oil palm, which produces a large amount of edible oil, leaves the trunks unused and discarded after the oil is extracted. It is estimated that the amount of discarded trunks is 20 million tons per year in both Malaysia and Indonesia. This project involves peeling and drying the unused oil palm trunks to create veneer, which is then layered and compressed under high temperature and pressure to manufacture and sell exterior materials. We showcased a bench as a reference exhibit at the Malaysia Pavilion during the 2025 Osaka Expo. We sincerely look forward to your visit.

Kawasaki Corporation (Headquarters: Tokyo) is pleased to announce that it will participate in the interim report meeting for the Tokyo Metropolitan Government's "Decarbonization Support Project in the Supply Chain for the Creation of a Green Products Market," which will be held on May 20, 2026. At this meeting, we will present the CO2 reduction effects of our environmentally friendly plastic formwork "Daiko Panel," which we have conceived, developed, manufactured, and sold, along with our initiatives towards greening, including related auxiliary materials. [Overview of the Presentation] Theme: Utilizing CFP to enhance CO2 reduction of "Daiko Panel" and promote greening throughout the entire supply chain. Main Content: Introducing initiatives aimed at CO2 reduction, referencing the background of our application for this project and the CFP calculation results for "Daiko Panel" and its auxiliary materials. [Presentation Date and Time] Interim report meeting: May 20, 2026 (Wednesday) from 15:00 to 17:00 Details of the interim report meeting and the Tokyo Metropolitan Government's project: Decarbonization support in the supply chain for the creation of a green products market https://www.cfp-sc.metro.tokyo.lg.jp/

Rentama Co., Ltd. will be exhibiting at the "8th International Construction and Surveying Exhibition (CSPI2026)" held at Makuhari Messe. A wide range of cutting-edge products, technologies, and services from the evolving industries of construction machinery, heavy equipment, attachments, construction DX, and i-Construction will be gathered in one place. This is one of the largest exhibitions in Japan for professionals in the construction and surveying industries to gather for business discussions, advanced information gathering, and problem-solving. This is a valuable opportunity to see KEMROC products up close. We understand you may be busy, but we invite you to stop by our booth. We look forward to meeting everyone.

TESSHA Corporation will be exhibiting at 'FOOMA JAPAN 2026' held at Tokyo Big Sight. This exhibition covers various fields of food manufacturing and is one of the largest comprehensive food manufacturing exhibitions in the world, where advanced technologies and knowledge come together. We plan to showcase our "Small Catalytic Deodorization Device SCU-1EH type." We look forward to your visit.